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Interconnect Technology And Design For Gigascale Integration
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Book Synopsis Interconnect Technology and Design for Gigascale Integration by : Jeffrey A. Davis
Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Book Synopsis Special Issue on Emerging Interconnect Technologies for Gigascale Integration by : Partha Pratim Pande
Download or read book Special Issue on Emerging Interconnect Technologies for Gigascale Integration written by Partha Pratim Pande and published by . This book was released on 2010 with total page 80 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Multilevel Interconnect Architectures for Gigascale Integration (GSI) by : Raguraman Venkatesan
Download or read book Multilevel Interconnect Architectures for Gigascale Integration (GSI) written by Raguraman Venkatesan and published by . This book was released on 2002 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis A Hierarchy of Interconnect Limits and Opportunities for Gigascale Integration (GSI) by : Jeffrey Alan Davis
Download or read book A Hierarchy of Interconnect Limits and Opportunities for Gigascale Integration (GSI) written by Jeffrey Alan Davis and published by . This book was released on 1999 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Contribuição ao estudo das argilas dos solos do Rio Grande do Sul by : Wenceslau J. Goedert
Download or read book Contribuição ao estudo das argilas dos solos do Rio Grande do Sul written by Wenceslau J. Goedert and published by . This book was released on 1967 with total page 14 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Focus Center Research Program for Interconnects for Gigascale Integration by : James D. Meindl
Download or read book Focus Center Research Program for Interconnects for Gigascale Integration written by James D. Meindl and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Integrated Interconnect Technologies for 3D Nanoelectronic Systems by : Muhannad S. Bakir
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Book Synopsis Interconnect Technologies for Integrated Circuits and Flexible Electronics by : Yash Agrawal
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Book Synopsis Prospects for Mirror-enabled Polymer Pillar I/O Optical Interconnects for Gigascale Integration by : Oluwafemi O. Ogunsola
Download or read book Prospects for Mirror-enabled Polymer Pillar I/O Optical Interconnects for Gigascale Integration written by Oluwafemi O. Ogunsola and published by . This book was released on 2006 with total page 209 pages. Available in PDF, EPUB and Kindle. Book excerpt: Digital systems have derived performance benefits due to the scaling down of CMOS microprocessor feature sizes towards packing billions of transistors on a chip, or gigascale integration (GSI). This has placed immense bandwidth demands on chip-to-chip and chip-to-board interconnects. The present-day electrical interconnect may limit bandwidth as transmission rates grow. As such, optical interconnects have been proposed as a potential solution. A critical requirement for enabling chip-to-chip and chip-to-board optical interconnection is out-of-plane coupling for directing light between a chip and the board. Any solution for this problem must be compatible with conventional packaging and assembly requirements. This research addresses the prospects for integrating waveguides with mirrors and polymer pillar optical I/O interconnects to provide such a compatible, out-of-plane, chip-to-board packaging solution through the design, analysis, fabrication, and testing of its constituent parts and their ultimate integration.
Book Synopsis The Impact of Interconnect Process Variations and Size Effects for Gigascale Integration by : Gerald Gabriel Lopez
Download or read book The Impact of Interconnect Process Variations and Size Effects for Gigascale Integration written by Gerald Gabriel Lopez and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this research is to demonstrate the impact of interconnect process variations, line-edge roughness and size effects on interconnect effective resistivity and ultimately chip performance. The investigation is accomplished through five tasks. In Task I, a new closed-form effective resistivity model, which is a function of line-edge roughness (LER), surface specularity and grain boundary reflectivity, is derived. In Task II, a critical path model is enhanced by including interconnect parasitics using the model in Task I. This enhancement also involves an extensive survey of foundry process data to shed light on the device resistance estimation used in the critical path model in Task II. Task III develops a Monte Carlo (MC) simulation framework called the Fast Interconnect Statistical Simulator (FISS). Using the latest International Technology Roadmap for Semiconductors (ITRS) projections, the FISS projects the impact of interconnect process variations and size effects onto high performance microprocessor units (HP-MPUs). Task IV fabricates metallic interconnect test structures with sub-100nm line-widths. The fifth task statistically calibrates the model from Task I using resistivity data measured from the test structures in Task IV.
Book Synopsis Interconnect Technologies for Integrated Circuits and Flexible Electronics by : Yash Agrawal
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer. This book was released on 2023-10-07 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Book Synopsis Special Issue on Compact Interconnect Models for Gigascale Integration by : Samar K. Saha
Download or read book Special Issue on Compact Interconnect Models for Gigascale Integration written by Samar K. Saha and published by . This book was released on 2009 with total page 385 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Power Distribution in Gigascale Integration (GSI) by : Kaveh Shakeri
Download or read book Power Distribution in Gigascale Integration (GSI) written by Kaveh Shakeri and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The main objective of this thesis is to develop models for the power distribution network of high performance gigascale chips. The two main concerns in distributing power in a chip are voltage drop and electromigration-induced reliability failures. The voltage drop on the power distribution network is due to IR-drop and simultaneous switching noise. IR-drop is the voltage drop due to current passing through the resistances of the power distribution network. Simultaneous switching noise is due to varying current passing through the inductances of the power distribution network. Compact physical models are derived for the IR-drop and electromigration for different types of packages. These chip-package co-design models enable designers in the early stages of the design to estimate the on-chip interconnect resources, and also to choose type and size of the package required for power distribution. Modeling of the simultaneous switching noise requires the simulation of a large circuit with thousands of inductances. The main obstacle challenging the simulation of a simultaneous switching noise circuit model is the computing resources required to solve the dense inductance matrix. In this work, a new relative inductance matrix is introduced to solve massively coupled RLC interconnects. It is proven that the analysis using this method is accurate for a wide frequency range and all configurations. Using the new inductance matrix makes the circuit simulations significantly faster without losing accuracy.
Book Synopsis Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation by : Rene van Leuken
Download or read book Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation written by Rene van Leuken and published by Springer. This book was released on 2011-01-16 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. The 24 revised full papers presented and the 9 extended abstracts were carefully reviewed and are organized in topical sections on design flows; circuit techniques; low power circuits; self-timed circuits; process variation; high-level modeling of poweraware heterogeneous designs in SystemC-AMS; and minalogic.
Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 265 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Book Synopsis Modeling Microprocessor Performance by : Bibiche Geuskens
Download or read book Modeling Microprocessor Performance written by Bibiche Geuskens and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 205 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling Microprocessor Performance focuses on the development of a design and evaluation tool, named RIPE (Rensselaer Interconnect Performance Estimator). This tool analyzes the impact on wireability, clock frequency, power dissipation, and the reliability of single chip CMOS microprocessors as a function of interconnect, device, circuit, design and architectural parameters. It can accurately predict the overall performance of existing microprocessor systems. For the three major microprocessor architectures, DEC, PowerPC and Intel, the results have shown agreement within 10% on key parameters. The models cover a broad range of issues that relate to the implementation and performance of single chip CMOS microprocessors. The book contains a detailed discussion of the various models and the underlying assumptions based on actual design practices. As such, RIPE and its models provide an insightful tool into single chip microprocessor design and its performance aspects. At the same time, it provides design and process engineers with the capability to model, evaluate, compare and optimize single chip microprocessor systems using advanced technology and design techniques at an early design stage without costly and time consuming implementation. RIPE and its models demonstrate the factors which must be considered when estimating tradeoffs in device and interconnect technology and architecture design on microprocessor performance.
Book Synopsis Proceedings of the Fourth Symposium on Low Temperature Electronics and High Temperature Superconductivity by : Cor L. Claeys
Download or read book Proceedings of the Fourth Symposium on Low Temperature Electronics and High Temperature Superconductivity written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 1997 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:
