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Author : Richard Kevin Ulrich
Publisher : Wiley-IEEE Press
ISBN 13 :
Total Pages : 410 pages
Book Rating : 4.F/5 ( download)
Download or read book Integrated Passive Component Technology written by Richard Kevin Ulrich and published by Wiley-IEEE Press. This book was released on 2003-06-30 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: Table of contents
Author : Hee-Ran Ahn
Publisher : John Wiley & Sons
ISBN 13 : 0470036958
Total Pages : 308 pages
Book Rating : 4.4/5 (7 download)
Download or read book Asymmetric Passive Components in Microwave Integrated Circuits written by Hee-Ran Ahn and published by John Wiley & Sons. This book was released on 2006-09-01 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book examines the new and important technology of asymmetric passive components for miniaturized microwave passive circuits. The asymmetric design methods and ideas set forth by the author are groundbreaking and have not been treated in previous works. Readers discover how these design methods reduce the circuit size of microwave integrated circuits and are also critical to reducing the cost of equipment such as cellular phones, radars, antennas, automobiles, and robots. An introductory chapter on the history of asymmetric passive components, which began with asymmetric ring hybrids first described by the author, sets the background for the book. It lays a solid foundation with a chapter examining microwave circuit parameters such as scattering, ABCD, impedance, admittance, and image. A valuable feature of this chapter is a conversion table between the various circuit matrices characterizing two-port networks terminated in arbitrary impedances. The correct conversion has also never been treated in previous works. Next, the author sets forth a thorough treatment of asymmetric passive component design, which covers the basic and indispensable elements for integration with other active or passive devices, including: * Asymmetric ring hybrids * Asymmetric branch-line hybrids * Asymmetric three-port power dividers and N-way power dividers * Asymmetric ring hybrid phase shifters and attenuators * Asymmetric ring filters and asymmetric impedance transformers With its focus on the principles of circuit element design, this is a must-have graduate-level textbook for students in microwave engineering, as well as a reference for design engineers who want to learn the new and powerful design method for asymmetric passive components.
Author : Guo'an Wang
Publisher : Artech House
ISBN 13 : 1608071995
Total Pages : 306 pages
Book Rating : 4.6/5 (8 download)
Download or read book Passive RF Component Technology written by Guo'an Wang and published by Artech House. This book was released on 2012 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications.
Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566774260
Total Pages : 574 pages
Book Rating : 4.7/5 (742 download)
Download or read book Microelectronics Technology and Devices written by and published by The Electrochemical Society. This book was released on 2005 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : C.P. Wong
Publisher : Springer Science & Business Media
ISBN 13 : 1441900403
Total Pages : 761 pages
Book Rating : 4.4/5 (419 download)
Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C.P. Wong and published by Springer Science & Business Media. This book was released on 2009-12-23 with total page 761 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author : Guo Qi Zhang
Publisher : Springer Science & Business Media
ISBN 13 : 0387755934
Total Pages : 338 pages
Book Rating : 4.3/5 (877 download)
Download or read book More than Moore written by Guo Qi Zhang and published by Springer Science & Business Media. This book was released on 2010-01-23 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.
Author : C. P.(Ching-Ping) Wong
Publisher : Springer Nature
ISBN 13 : 303049991X
Total Pages : 582 pages
Book Rating : 4.0/5 (34 download)
Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C. P.(Ching-Ping) Wong and published by Springer Nature. This book was released on 2021-03-17 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Author : D. Widmann
Publisher : Springer Science & Business Media
ISBN 13 : 9783540661993
Total Pages : 370 pages
Book Rating : 4.6/5 (619 download)
Download or read book Technology of Integrated Circuits written by D. Widmann and published by Springer Science & Business Media. This book was released on 2000-07-06 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Strongly involved with SIEMENS Corp. in the tremendous recent developments of process technologies for IC fabrication the authors comprehensively record their authoritative knowledge and practical experience. New materials , modern planar technology, process designs for CMOS, Bipolar, BICMOS and smart-power technologies, self-adjusting doping techniques are just a few of the highlights. With its strong application-orientation this is a need-to-have book for professionals in semiconductor industries. Senior students in electrical engineering and physics can use it as a textbook because of the systematic treatment of the subjects. With regard to their later careers as industrial engineers they will particularly appreciate the deep insight into the actual methods and problems of IC manufacturing.
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Suny Li (Li Yang)
Publisher : John Wiley & Sons
ISBN 13 : 1119046009
Total Pages : 651 pages
Book Rating : 4.1/5 (19 download)
Download or read book SiP System-in-Package Design and Simulation written by Suny Li (Li Yang) and published by John Wiley & Sons. This book was released on 2017-07-14 with total page 651 pages. Available in PDF, EPUB and Kindle. Book excerpt: An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Author :
Publisher :
ISBN 13 :
Total Pages : 436 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings written by and published by . This book was released on 2001 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Richard K. Ulrich
Publisher : John Wiley & Sons
ISBN 13 : 0471466093
Total Pages : 852 pages
Book Rating : 4.4/5 (714 download)
Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author : Mikhail Popovich
Publisher : Springer Science & Business Media
ISBN 13 : 0387716017
Total Pages : 532 pages
Book Rating : 4.3/5 (877 download)
Download or read book Power Distribution Networks with On-Chip Decoupling Capacitors written by Mikhail Popovich and published by Springer Science & Business Media. This book was released on 2007-10-08 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides insight into the behavior and design of power distribution systems for high speed, high complexity integrated circuits. Also presented are criteria for estimating minimum required on-chip decoupling capacitance. Techniques and algorithms for computer-aided design of on-chip power distribution networks are also described; however, the emphasis is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.
Author : John D. Cressler
Publisher : CRC Press
ISBN 13 : 1351834789
Total Pages : 321 pages
Book Rating : 4.3/5 (518 download)
Download or read book Fabrication of SiGe HBT BiCMOS Technology written by John D. Cressler and published by CRC Press. This book was released on 2018-10-03 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: SiGe HBT BiCMOS technology is the obvious groundbreaker of the Si heterostructures application space. To date virtually every major player in the communications electronics market either has SiGe up and running in-house or is using someone else’s SiGe fab as foundry for their designers. Key to this success lies in successful integration of the SiGe HBT and Si CMOS, with no loss of performance from either device. Filled with contributions from leading experts, Fabrication of SiGe HBT BiCMOS Technologies brings together a complete discussion of these topics into a single resource. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume examines the design, fabrication, and application of silicon heterostructure transistors. A novel aspect of this book the inclusion of numerous snapshot views of the industrial state-of-the-art for SiGe HBT BiCMOS technology. It has been carefully designed to provide a useful basis of comparison for the current status and future course of the global industry. In addition to the copious technical material and the numerous references contained in each chapter, the book includes easy-to-reference appendices on the properties of Si and Ge, the generalized Moll-Ross relations, integral charge-control relations, and sample SiGe HBT compact model parameters.
Author : Thomas Noulis
Publisher : CRC Press
ISBN 13 : 1351642782
Total Pages : 555 pages
Book Rating : 4.3/5 (516 download)
Download or read book Noise Coupling in System-on-Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 555 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Author : Lih-Tyng Hwang
Publisher : John Wiley & Sons
ISBN 13 : 111928967X
Total Pages : 465 pages
Book Rating : 4.1/5 (192 download)
Download or read book 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility written by Lih-Tyng Hwang and published by John Wiley & Sons. This book was released on 2018-03-28 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools
Author : Jiaguo Lu
Publisher : Springer Nature
ISBN 13 : 9819914752
Total Pages : 455 pages
Book Rating : 4.8/5 (199 download)
Download or read book Active Array Antennas for High Resolution Microwave Imaging Radar written by Jiaguo Lu and published by Springer Nature. This book was released on 2023-05-04 with total page 455 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights the application of active array antennas in high-resolution microwave imaging radar systems. It introduces the basic principles, analytical methods, and performance parameters of active array antennas to achieve low profile, high efficiency, and lightweight. The book systematically elaborates the architecture, analysis, and engineering practice to achieve wideband, multi-band, multi-polarization, and common aperture in active array antennas. It explores hotspot technologies of digital array antennas, microwave photonic array antennas, and active packaging antennas. By presenting over 300 illustrations and diagrams, including schematic diagrams, block diagrams, relation diagrams, and breakdown drawings, the book enables a thorough understanding of the antenna array microsystem as the advanced phase of active array antennas and the direction of future R&D. The book is a good reference source for researchers and engineers interested in the engineering and implementation of microwave imaging radar systems and antenna technology.
