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Icept 2003
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Book Synopsis The Social Dynamics of Carbon Capture and Storage by : Nils Markusson
Download or read book The Social Dynamics of Carbon Capture and Storage written by Nils Markusson and published by Routledge. This book was released on 2012-05-04 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: Carbon capture and storage (CCS) has emerged rapidly as a crucial technological option for decarbonising electricity supply and mitigating climate change. Great hopes are being pinned on this new technology but it is also facing growing scepticism and criticism. This book is the first to bring together the full range of social and policy issues surrounding CCS shedding new light on this potentially vital technology and its future. The book covers many crucial topics including the roles and positions that different publics, NGOs, industry, political parties and media are taking up; the way CCS is organised, supported and regulated; how CCS is being debated and judged; how innovation, demonstration and learning are occurring and being conceptualised and promoted; and the role of CCS in the transition to a low carbon energy future. The authors draw on a variety of approaches, concepts, methods and themes and provide a new understanding of innovation in the energy and climate change fields. It tackles the many issues in a way that speaks to those concerned not only to understand these developments, but to those who are involved in the scientific and technological work itself, as well as those charged with evaluating and making decisions relevant to the future of the technology.
Book Synopsis Microjoining and Nanojoining by : Y N Zhou
Download or read book Microjoining and Nanojoining written by Y N Zhou and published by Elsevier. This book was released on 2008-03-27 with total page 835 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. - Reviews the basics of nanojoining including solid-state bonding and fusion microwelding - Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling - Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Book Synopsis Visual Inspection Technology in the Hard Disk Drive Industry by : Paisarn Muneesawang
Download or read book Visual Inspection Technology in the Hard Disk Drive Industry written by Paisarn Muneesawang and published by John Wiley & Sons. This book was released on 2015-04-13 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: A presentation of the use of computer vision systems to control manufacturing processes and product quality in the hard disk drive industry. Visual Inspection Technology in the Hard Disk Drive Industry is an application-oriented book borne out of collaborative research with the world’s leading hard disk drive companies. It covers the latest developments and important topics in computer vision technology in hard disk drive manufacturing, as well as offering a glimpse of future technologies.
Download or read book Heat Transfer written by Miguel Araiz and published by BoD – Books on Demand. This book was released on 2021-09-22 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal energy is present in all aspects of our lives, including when cooking, driving, or turning on the heat or air conditioning. Sometimes this thermal management is not evident, but it is essential for our comfort and lifestyle. In addition, heat transfer is vital in many industrial processes. Thermal energy analysis is a complex task that usually requires different approaches. With five sections, this book provides information on heat transfer problems and using experimental techniques and computational models to analyse them.
Book Synopsis International Symposium on Advanced Packaging Materials by :
Download or read book International Symposium on Advanced Packaging Materials written by and published by . This book was released on 2005 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by : Juan Cepeda-Rizo
Download or read book Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments written by Juan Cepeda-Rizo and published by CRC Press. This book was released on 2021-12-29 with total page 278 pages. Available in PDF, EPUB and Kindle. Book excerpt: Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.
Download or read book Climate Policy written by and published by . This book was released on 2007 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Heterogeneous Integrations by : John H. Lau
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Download or read book Microwave Journal written by and published by . This book was released on 2003 with total page 1218 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Extreme Environment Electronics by : John D. Cressler
Download or read book Extreme Environment Electronics written by John D. Cressler and published by CRC Press. This book was released on 2017-12-19 with total page 1041 pages. Available in PDF, EPUB and Kindle. Book excerpt: Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Book Synopsis Governing Technology for Sustainability by : Joseph Murphy
Download or read book Governing Technology for Sustainability written by Joseph Murphy and published by Routledge. This book was released on 2012-06-25 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a world of growing complexity and dwindling resources, the relationship between technology and sustainability is a pressing issue of concern at the highest levels. This book improves our understanding by examining the ways that people, technology and governance shape each other with implications for sustainability. It is the first book to link technology studies and governance research to this problem. Contributions from leading environmental social scientists are included, with each chapter reporting on new research and tackling complex, but vital issues. Drawing on examples such as wave and tidal power, wind power, micro-generation, community waste recycling and eco-housing, the book provides powerful new insights into the governance of technology for sustainability. A detailed introduction and conclusion discuss existing research directions and identify the contribution that the book makes in advancing our understanding of the people-technology-governance nexus and its implications for sustainability. This is essential reading for all those in academia, government and industry working at the critical interface between how we develop, deploy and govern technology in the pursuit of sustainability.
Download or read book World Economics written by and published by . This book was released on 2005 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Science & Public Policy written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Pacific Islands Regional Millennium Development Goals Report 2004 by :
Download or read book Pacific Islands Regional Millennium Development Goals Report 2004 written by and published by . This book was released on 2004 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Introduction to Microsystem Packaging Technology by : Yufeng Jin
Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Download or read book System on Package written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2007-07-22 with total page 807 pages. Available in PDF, EPUB and Kindle. Book excerpt: System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Book Synopsis Fracture, Fatigue, Failure and Damage Evolution, Volume 8 by : Alan T. Zehnder
Download or read book Fracture, Fatigue, Failure and Damage Evolution, Volume 8 written by Alan T. Zehnder and published by Springer. This book was released on 2016-09-20 with total page 155 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fracture, Fatigue, Failure and Damage Evolution, Volume 8 of the Proceedings of the 2016 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the eighth volume of ten from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: In-situ Techniques for Fracture & Fatigue General Topics in Fracture & Fatigue Fracture & Fatigue of Composites Damage, Fracture, Fatigue & Durability Interfacial Effects in Fracture & Fatigue Damage Detection in Fracture & Fatigue
