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Author : Jun Tian
Publisher :
ISBN 13 : 9789462033306
Total Pages : pages
Book Rating : 4.0/5 (333 download)
Download or read book Hybrid Wafer-level Packaging for RF-MEMS and Optoelectronic Applications written by Jun Tian and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Tai-Ran Hsu
Publisher : IET
ISBN 13 : 9780863413353
Total Pages : 310 pages
Book Rating : 4.4/5 (133 download)
Download or read book MEMS Packaging written by Tai-Ran Hsu and published by IET. This book was released on 2004 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the entire spectrum of assembly, packaging and testing of MEMs (microelectro-mechanical systems) and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering.
Author : Seonho Seok
Publisher : Springer
ISBN 13 : 3319778722
Total Pages : 119 pages
Book Rating : 4.3/5 (197 download)
Download or read book Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering written by Seonho Seok and published by Springer. This book was released on 2018-04-27 with total page 119 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119314135
Total Pages : 576 pages
Book Rating : 4.1/5 (193 download)
Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author : Rao Tummala
Publisher : McGraw Hill Professional
ISBN 13 : 0071500596
Total Pages : 979 pages
Book Rating : 4.0/5 (715 download)
Download or read book Fundamentals of Microsystems Packaging written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2001-05-08 with total page 979 pages. Available in PDF, EPUB and Kindle. Book excerpt: LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author :
Publisher :
ISBN 13 :
Total Pages : 8 pages
Book Rating : 4.:/5 (644 download)
Download or read book Wafer Level Micropackaging for RF MEMS Switches written by and published by . This book was released on 2005 with total page 8 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.
Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119793777
Total Pages : 324 pages
Book Rating : 4.1/5 (197 download)
Download or read book Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811088845
Total Pages : 319 pages
Book Rating : 4.8/5 (11 download)
Download or read book Fan-Out Wafer-Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
Author :
Publisher :
ISBN 13 :
Total Pages : 8 pages
Book Rating : 4.:/5 (958 download)
Download or read book Hermetic Wafer-Level Packaging for RF MEMs written by and published by . This book was released on 2012 with total page 8 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mike Golio
Publisher : CRC Press
ISBN 13 : 142000672X
Total Pages : 736 pages
Book Rating : 4.4/5 (2 download)
Download or read book RF and Microwave Passive and Active Technologies written by Mike Golio and published by CRC Press. This book was released on 2018-10-03 with total page 736 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the high frequency world, the passive technologies required to realize RF and microwave functionality present distinctive challenges. SAW filters, dielectric resonators, MEMS, and waveguide do not have counterparts in the low frequency or digital environment. Even when conventional lumped components can be used in high frequency applications, their behavior does not resemble that observed at lower frequencies. RF and Microwave Passive and Active Technologies provides detailed information about a wide range of component technologies used in modern RF and microwave systems. Updated chapters include new material on such technologies as MEMS, device packaging, surface acoustic wave (SAW) filters, bipolar junction and heterojunction transistors, and high mobility electron transistors (HMETs). The book also features a completely rewritten section on wide bandgap transistors.
Author : Balwinder Baj
Publisher : World Scientific
ISBN 13 : 9811279543
Total Pages : 450 pages
Book Rating : 4.8/5 (112 download)
Download or read book Distributed Intelligent Circuits And Systems written by Balwinder Baj and published by World Scientific. This book was released on 2024-03-06 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main objective of this book is to provide insights into recent advances in distributed intelligent circuits, systems and their applications. Distributed intelligence is the key enabler for innovations in machine-to-machine communications. The innovations are directed towards keeping existing algorithms as the base and developing new intelligent systems by employing smart technologies. Artificial intelligence (AI) and, more specifically, deep learning (DL) are receiving significant attention in assisting doctors in the detection of disease patterns without much human intervention. In agriculture, robots automate slow, repetitive and dull tasks, allowing farmers to focus more on improving overall production yields.The evolving trends point to the interface of artificial intelligence with machines being a factor in enhancing the decision-making capabilities of smart machines. This book provides relevant theoretical frameworks that include basic models, algorithms, circuit designs and the latest developments in experimental aspects in the field of distributed intelligence systems for industrial applications. The challenges encountered in the development of models for distributed intelligence systems for environmental monitoring are mitigated with artificial intelligence, machine learning and deep learning. This book identifies challenges and helps in applying solutions in the development of advanced intelligent systems for environmental monitoring.
Author : Matthew William Kelley
Publisher :
ISBN 13 :
Total Pages : 236 pages
Book Rating : 4.:/5 (638 download)
Download or read book Modeling-based Design Optimization of Wafer-level and Chip-scale Packaging for RF-MEMS Devices written by Matthew William Kelley and published by . This book was released on 2004 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Daniel Lu
Publisher : Springer Science & Business Media
ISBN 13 : 0387782192
Total Pages : 723 pages
Book Rating : 4.3/5 (877 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer Science & Business Media. This book was released on 2008-12-17 with total page 723 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Mike Golio
Publisher : CRC Press
ISBN 13 : 1439833230
Total Pages : 2208 pages
Book Rating : 4.4/5 (398 download)
Download or read book The RF and Microwave Handbook - 3 Volume Set written by Mike Golio and published by CRC Press. This book was released on 2018-10-08 with total page 2208 pages. Available in PDF, EPUB and Kindle. Book excerpt: By 1990 the wireless revolution had begun. In late 2000, Mike Golio gave the world a significant tool to use in this revolution: The RF and Microwave Handbook. Since then, wireless technology spread across the globe with unprecedented speed, fueled by 3G and 4G mobile technology and the proliferation of wireless LANs. Updated to reflect this tremendous growth, the second edition of this widely embraced, bestselling handbook divides its coverage conveniently into a set of three books, each focused on a particular aspect of the technology. Six new chapters cover WiMAX, broadband cable, bit error ratio (BER) testing, high-power PAs (power amplifiers), heterojunction bipolar transistors (HBTs), as well as an overview of microwave engineering. Over 100 contributors, with diverse backgrounds in academic, industrial, government, manufacturing, design, and research reflect the breadth and depth of the field. This eclectic mix of contributors ensures that the coverage balances fundamental technical issues with the important business and marketing constraints that define commercial RF and microwave engineering. Focused chapters filled with formulas, charts, graphs, diagrams, and tables make the information easy to locate and apply to practical cases. The new format, three tightly focused volumes, provides not only increased information but also ease of use. You can find the information you need quickly, without wading through material you don’t immediately need, giving you access to the caliber of data you have come to expect in a much more user-friendly format.
Author : Alexander Polyakov
Publisher :
ISBN 13 : 9789090211107
Total Pages : pages
Book Rating : 4.2/5 (111 download)
Download or read book Wafer-level Packaging Technology for RF Applications Based on a Rigid Low-loss Spacer Substrate written by Alexander Polyakov and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811372241
Total Pages : 368 pages
Book Rating : 4.8/5 (113 download)
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Author :
Publisher :
ISBN 13 :
Total Pages : 7 pages
Book Rating : 4.:/5 (742 download)
Download or read book Wafer Level Micro-Encapsulation written by and published by . This book was released on 2005 with total page 7 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated
