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Hybrid Assemblies And Multichip Modules
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Book Synopsis Hybrid Assemblies and Multichip Modules by : Fred W. Kear
Download or read book Hybrid Assemblies and Multichip Modules written by Fred W. Kear and published by CRC Press. This book was released on 2020-07-24 with total page 298 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
Book Synopsis Hybrid Assemblies and Multichip Modules by : Fred W. Kear
Download or read book Hybrid Assemblies and Multichip Modules written by Fred W. Kear and published by CRC Press. This book was released on 2020-07-25 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
Book Synopsis Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines by : Michael Pecht
Download or read book Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-03-31 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.
Download or read book Chip On Board written by John H. Lau and published by Springer Science & Business Media. This book was released on 1994-06-30 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Book Synopsis Precision Assembly Technologies and Systems by : Svetan Ratchev
Download or read book Precision Assembly Technologies and Systems written by Svetan Ratchev and published by Springer. This book was released on 2010-02-06 with total page 346 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of new-generation micro-manufacturing technologies and systems has revolutionised the way products are designed and manufactured today with a s- nificant impact in a number of key industrial sectors. Micro-manufacturing techno- gies are often described as disruptive, enabling and interdisciplinary leading to the creation of whole new classes of products that were previously not feasible to ma- facture. While key processes for volume manufacture of micro-parts such as mach- ing and moulding are becoming mature technologies, micro-assembly remains a key challenge for the cost-effective manufacture of complex micro-products. The ability to manufacture customizable micro-products that can be delivered in variable volumes within relatively short timescales is very much dependent on the level of development of the micro-assembly processes, positioning, alignment and measurement techniques, gripping and feeding approaches and devices. Micro-assembly has developed rapidly over the last few years and all the pred- tions are that it will remain a critical technology for high-value products in a number of key sectors such as healthcare, communications, defence and aerospace. The key challenge is to match the significant technological developments with a new gene- tion of micro-products that will establish firmly micro-assembly as a mature manuf- turing process. th The book includes the set of papers presented at the 5 International Precision - sembly Seminar IPAS 2010 held in Chamonix, France from the 14th to the 17th February 2010.
Book Synopsis Integrated Circuit Packaging, Assembly and Interconnections by : William Greig
Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Book Synopsis Product Design for Manufacture and Assembly by : Geoffrey Boothroyd
Download or read book Product Design for Manufacture and Assembly written by Geoffrey Boothroyd and published by CRC Press. This book was released on 2010-12-08 with total page 710 pages. Available in PDF, EPUB and Kindle. Book excerpt: Hailed as a groundbreaking and important textbook upon its initial publication, the latest iteration of Product Design for Manufacture and Assembly does not rest on those laurels. In addition to the expected updating of data in all chapters, this third edition has been revised to provide a top-notch textbook for university-level courses in product
Book Synopsis Assembly Automation and Product Design by : Geoffrey Boothroyd
Download or read book Assembly Automation and Product Design written by Geoffrey Boothroyd and published by CRC Press. This book was released on 2005-06-22 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addressing design for automated and manual assembly processes, Assembly Automation and Product Design, Second Edition examines assembly automation in parallel with product design. The author enumerates the components, processes, performance, and comparative economics of several types of automatic assembly systems. He provides information on equipme
Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Book Synopsis Product Design for Manufacture and Assembly, Second Edition, Revised and Expanded by : Geoffrey Boothroyd
Download or read book Product Design for Manufacture and Assembly, Second Edition, Revised and Expanded written by Geoffrey Boothroyd and published by CRC Press. This book was released on 2002 with total page 738 pages. Available in PDF, EPUB and Kindle. Book excerpt: Containing more than 300 equations and the extensive data, necessary to estimate manufacturing and assembly cost during product design, benchmarking, and should cost analysis, this textbook gives students modern and effective tools for analysing injection moulding, sheet metalworking, die casting, powder metal processing costs, sand and investment casting, and hot forging. It includes discussions of the influence of the application of design for manufacture and assembly, material selection and economic ranking of processes, the effect of reduced assembly difficulties on product quality, the links between computer-aided design solid models and design analysis tools, and more.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Book Synopsis Re-Engineering the Manufacturing System by : Robert E. Stein
Download or read book Re-Engineering the Manufacturing System written by Robert E. Stein and published by CRC Press. This book was released on 2003-06-03 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: An information systems trailblazer in the domains of decision support and factory and supply chain synchronization, the second edition of Re-Engineering the Manufacturing System stays true to its title, once again bestowing uniquely straightforward instructions for designing, installing, and operating manufacturing information systems. This updated and expanded source takes care to clarify the often blurred concepts of synchronization and optimization and offers implementation advice from four discrete angles to yield better bottom-line results. It shows how to exploit an information system, rolling ERP system implementation into the TOC framework to promote profit materialization.
Download or read book MEMS Packaging written by Tai-Ran Hsu and published by IET. This book was released on 2004 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the entire spectrum of assembly, packaging and testing of MEMs (microelectro-mechanical systems) and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering.
Book Synopsis Flat Rolling Fundamentals by : Vladimir B. Ginzburg
Download or read book Flat Rolling Fundamentals written by Vladimir B. Ginzburg and published by CRC Press. This book was released on 2000-06-30 with total page 860 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume compiles information from physics, metallurgy, and mechanical and electrical engineering to epitomize the fundamental characteristics of flat rolling steel. Flat Rolling Fundamentals is drawn from in-depth analyses of metal properties and behaviors to technologies in application. The book provides a full characterization of steel, including structure, chemical composition, classifications, physical properties, deformation, and plasticity. The authors present different types of rolling mills and the defining physical analytical parameters.They also discuss the effects of hot rolling on steel and the role of lubrication and thermomechanical treatments to minimize these effects. This book presents qualitative and quantitative advances in cost-effective steel production.
Book Synopsis Manufacturing Engineering Processes, Second Edition by : Leo Alting
Download or read book Manufacturing Engineering Processes, Second Edition written by Leo Alting and published by CRC Press. This book was released on 2020-08-19 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: Responding to the need for an integrated approach in manufacturing engineering oriented toward practical problem solving, this updated second edition describes a process morphology based on fundamental elements that can be applied to all manufacturing methods - providing a framework for classifying processes into major families with a common theoretical foundation. This work presents time-saving summaries of the various processing methods in data sheet form - permitting quick surveys for the production of specific components.;Delineating the actual level of computer applications in manufacturing, this work: creates the basis for synthesizing process development, tool and die design, and the design of production machinery; details the product life-cycle approach in manufacturing, emphasizing environmental, occupational health and resource impact consequences; introduces process planning and scheduling as an important part of industrial manufacturing; contains a completely revised and expanded section on ceramics and composites; furnishes new information on welding arc formation and maintenance; addresses the issue of industrial safety; and discusses progress in non-conventional processes such as laser processing, layer manufacturing, electrical discharge, electron beam, abrasive jet, ultrasonic and eltrochemical machining.;Revealing how manufacturing methods are adapted in industry practices, this work is intended for use by students of manufacturing engineering, industrial engineering and engineering design; and also for use as a self-study guide by manufacturing, mechanical, materials, industrial and design engineers.
Book Synopsis Manufacturing Engineering Processes, Second Edition, by : Alting
Download or read book Manufacturing Engineering Processes, Second Edition, written by Alting and published by CRC Press. This book was released on 1993-11-23 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: Responding to the need for an integrated approach in manufacturing engineering oriented toward practical problem solving, this updated second edition describes a process morphology based on fundamental elements that can be applied to all manufacturing methods - providing a framework for classifying processes into major families with a common theoretical foundation. This work presents time-saving summaries of the various processing methods in data sheet form - permitting quick surveys for the production of specific components.;Delineating the actual level of computer applications in manufacturing, this work: creates the basis for synthesizing process development, tool and die design, and the design of production machinery; details the product life-cycle approach in manufacturing, emphasizing environmental, occupational health and resource impact consequences; introduces process planning and scheduling as an important part of industrial manufacturing; contains a completely revised and expanded section on ceramics and composites; furnishes new information on welding arc formation and maintenance; addresses the issue of industrial safety; and discusses progress in non-conventional processes such as laser processing, layer manufacturing, electrical discharge, electron beam, abrasive jet, ultrasonic and eltrochemical machining.;Revealing how manufacturing methods are adapted in industry practices, this work is intended for use by students of manufacturing engineering, industrial engineering and engineering design; and also for use as a self-study guide by manufacturing, mechanical, materials, industrial and design engineers.
Book Synopsis Metalworking Fluids by : Jerry P. Byers
Download or read book Metalworking Fluids written by Jerry P. Byers and published by CRC Press. This book was released on 1994-06-14 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work provides concise introductory material on metallurgy for the novice, presenting up-to-date information on metalworking fluid technology. Its history, formulation, application, maintenance, testing and governmental regulation are detailed, and a trouble-shooting section is included on the causes of, and cures for, common industrial problems related to metalworking fluids.
