How To Use Surface Mount Technology

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Surface Mount Technology

Author : Ray Prasad
Publisher : Springer Science & Business Media
ISBN 13 : 1461540844
Total Pages : 791 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Surface Mount Technology by : Ray Prasad

Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Surface Mount Technology

Author : Carmen Capillo
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 376 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Surface Mount Technology by : Carmen Capillo

Download or read book Surface Mount Technology written by Carmen Capillo and published by McGraw-Hill Companies. This book was released on 1989 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Handbook of Surface Mount Technology

Author : Stephen W. Hinch
Publisher : Longman Scientific and Technical
ISBN 13 :
Total Pages : 512 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Handbook of Surface Mount Technology by : Stephen W. Hinch

Download or read book Handbook of Surface Mount Technology written by Stephen W. Hinch and published by Longman Scientific and Technical. This book was released on 1988 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Surface-mount Technology for PC Boards

Author : Glenn R. Blackwell
Publisher : Delmar Thomson Learning
ISBN 13 :
Total Pages : 548 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Surface-mount Technology for PC Boards by : Glenn R. Blackwell

Download or read book Surface-mount Technology for PC Boards written by Glenn R. Blackwell and published by Delmar Thomson Learning. This book was released on 2006 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to generate high manufacturing yields, low testing costs, and reproducible designs using the latest components of surface mount technology (SMT)! Manufacturers, managers, engineers, students, and others who work with printed-circuit boards will find a wealth of cutting-edge information about SMT and fine pitch technology (FPT) in this new edition. Practical data and clear illustrations combine to clearly and accurately present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging.

Surface Mount Technology Terms and Concepts

Author : Phil Zarrow
Publisher : Newnes
ISBN 13 : 0750698756
Total Pages : 145 pages
Book Rating : 4.7/5 (56 download)

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Book Synopsis Surface Mount Technology Terms and Concepts by : Phil Zarrow

Download or read book Surface Mount Technology Terms and Concepts written by Phil Zarrow and published by Newnes. This book was released on 1997-08-21 with total page 145 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface Mount Technology Terms and Concepts is an invaluable resource for anyone involved in SMT. This book clearly defines more than 1000 of the most commonly used terms and concepts. By far the most comprehensive glossary of its kind, as well as more accessible and readable than most technical books devoted to assembly, Surface Mount Technology Terms and Concepts contains all of the terms that engineers and managers engaged in surface mount process, manufacturing, quality, design, and purchasing may encounter.

Solder Paste in Electronics Packaging

Author : Jennie Hwang
Publisher : Springer Science & Business Media
ISBN 13 : 146153528X
Total Pages : 374 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Solder Paste in Electronics Packaging by : Jennie Hwang

Download or read book Solder Paste in Electronics Packaging written by Jennie Hwang and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.

Design Guidelines for Surface Mount Technology

Author : John E. Traister
Publisher :
ISBN 13 :
Total Pages : 468 pages
Book Rating : 4.:/5 (41 download)

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Book Synopsis Design Guidelines for Surface Mount Technology by : John E. Traister

Download or read book Design Guidelines for Surface Mount Technology written by John E. Traister and published by . This book was released on 1990 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt:

How to Use Surface Mount Technology

Author : Jerry Mullen
Publisher :
ISBN 13 : 9780895121578
Total Pages : 116 pages
Book Rating : 4.1/5 (215 download)

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Book Synopsis How to Use Surface Mount Technology by : Jerry Mullen

Download or read book How to Use Surface Mount Technology written by Jerry Mullen and published by . This book was released on 1984 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Surface Mount Technology for Concurrent Engineering and Manufacturing

Author : Frank Classon
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Surface Mount Technology for Concurrent Engineering and Manufacturing by : Frank Classon

Download or read book Surface Mount Technology for Concurrent Engineering and Manufacturing written by Frank Classon and published by McGraw-Hill Companies. This book was released on 1993 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to gaining the valuable miniaturization and cost-saving benefits of surface mount technology (SMT), showing how to integrate multiple company functions - designs, manufacturing, testing and management - and save time and money at every stage.

SMT Soldering Handbook

Author : RUDOLF STRAUSS
Publisher : Elsevier
ISBN 13 : 9780080480978
Total Pages : 400 pages
Book Rating : 4.4/5 (89 download)

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Book Synopsis SMT Soldering Handbook by : RUDOLF STRAUSS

Download or read book SMT Soldering Handbook written by RUDOLF STRAUSS and published by Elsevier. This book was released on 1998-02-24 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology

Design Guidelines for Surface Mount Technology

Author : John Traister
Publisher : Elsevier
ISBN 13 : 032314165X
Total Pages : 326 pages
Book Rating : 4.3/5 (231 download)

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Book Synopsis Design Guidelines for Surface Mount Technology by : John Traister

Download or read book Design Guidelines for Surface Mount Technology written by John Traister and published by Elsevier. This book was released on 2012-12-02 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.

A Scientific Guide to Surface Mount Technology

Author : Colin Lea
Publisher :
ISBN 13 :
Total Pages : 606 pages
Book Rating : 4.0/5 ( download)

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Book Synopsis A Scientific Guide to Surface Mount Technology by : Colin Lea

Download or read book A Scientific Guide to Surface Mount Technology written by Colin Lea and published by . This book was released on 1988 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Surface Mount Technology

Author : Charles-Henri Mangin
Publisher : Springer
ISBN 13 :
Total Pages : 240 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Surface Mount Technology by : Charles-Henri Mangin

Download or read book Surface Mount Technology written by Charles-Henri Mangin and published by Springer. This book was released on 1987 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Lead-free Soldering Process Development and Reliability

Author : Jasbir Bath
Publisher : John Wiley & Sons
ISBN 13 : 1119482046
Total Pages : 512 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Lead-free Soldering Process Development and Reliability by : Jasbir Bath

Download or read book Lead-free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-06-12 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Design Guidelines for Surface Mount Technology

Author : Vern Solberg
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 224 pages
Book Rating : 4.:/5 (41 download)

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Book Synopsis Design Guidelines for Surface Mount Technology by : Vern Solberg

Download or read book Design Guidelines for Surface Mount Technology written by Vern Solberg and published by McGraw-Hill Companies. This book was released on 1989 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Soldering in Electronics Assembly

Author : MIKE JUDD
Publisher : Elsevier
ISBN 13 : 9780080517346
Total Pages : 369 pages
Book Rating : 4.5/5 (173 download)

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Book Synopsis Soldering in Electronics Assembly by : MIKE JUDD

Download or read book Soldering in Electronics Assembly written by MIKE JUDD and published by Elsevier. This book was released on 1999-03-26 with total page 369 pages. Available in PDF, EPUB and Kindle. Book excerpt: Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. A practical guide for the industry covering all the main soldering processes currently in use Cleaning, faults, troubleshooting and standards are all major topics Considers safety and solder process quality assessment

Reflow Soldering Processes

Author : Ning-Cheng Lee
Publisher : Newnes
ISBN 13 : 0750672188
Total Pages : 282 pages
Book Rating : 4.7/5 (56 download)

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Book Synopsis Reflow Soldering Processes by : Ning-Cheng Lee

Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process