High Frequency Characterization Of Electronic Packaging

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High-Frequency Characterization of Electronic Packaging

Author : Luc Martens
Publisher : Springer Science & Business Media
ISBN 13 : 1461556236
Total Pages : 169 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis High-Frequency Characterization of Electronic Packaging by : Luc Martens

Download or read book High-Frequency Characterization of Electronic Packaging written by Luc Martens and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 169 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Author : Hengyun Zhang
Publisher : Woodhead Publishing
ISBN 13 : 0081025335
Total Pages : 436 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore by : Hengyun Zhang

Download or read book Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang and published by Woodhead Publishing. This book was released on 2019-11-14 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging

An Engineer's Guide to Automated Testing of High-Speed Interfaces, Second Edition

Author : Jose Moreira
Publisher : Artech House
ISBN 13 : 1608079864
Total Pages : 709 pages
Book Rating : 4.6/5 (8 download)

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Book Synopsis An Engineer's Guide to Automated Testing of High-Speed Interfaces, Second Edition by : Jose Moreira

Download or read book An Engineer's Guide to Automated Testing of High-Speed Interfaces, Second Edition written by Jose Moreira and published by Artech House. This book was released on 2016-04-30 with total page 709 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition of An Engineer's Guide to Automated Testing of High-Speed Interfaces provides updates to reflect current state-of-the-art high-speed digital testing with automated test equipment technology (ATE). Featuring clear examples, this one-stop reference covers all critical aspects of automated testing, including an introduction to high-speed digital basics, a discussion of industry standards, ATE and bench instrumentation for digital applications, and test and measurement techniques for characterization and production environment. Engineers learn how to apply automated test equipment for testing high-speed digital I/O interfaces and gain a better understanding of PCI-Express 4, 100Gb Ethernet, and MIPI while exploring the correlation between phase noise and jitter. This updated resource provides expanded material on 28/32 Gbps NRZ testing and wireless testing that are becoming increasingly more pertinent for future applications. This book explores the current trend of merging high-speed digital testing within the fields of photonic and wireless testing.

Microwave Circuits for 24 GHz Automotive Radar in Silicon-based Technologies

Author : Vadim Issakov
Publisher : Springer Science & Business Media
ISBN 13 : 3642135986
Total Pages : 218 pages
Book Rating : 4.6/5 (421 download)

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Book Synopsis Microwave Circuits for 24 GHz Automotive Radar in Silicon-based Technologies by : Vadim Issakov

Download or read book Microwave Circuits for 24 GHz Automotive Radar in Silicon-based Technologies written by Vadim Issakov and published by Springer Science & Business Media. This book was released on 2010-08-05 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: There are continuous efforts focussed on improving road traffic safety worldwide. Numerous vehicle safety features have been invented and standardized over the past decades. Particularly interesting are the driver assistance systems, since these can considerably reduce the number of accidents by supporting drivers’ perception of their surroundings. Many driver assistance features rely on radar-based sensors. Nowadays the commercially available automotive front-end sensors are comprised of discrete components, thus making the radar modules highly-priced and suitable for integration only in premium class vehicles. Realization of low-cost radar fro- end circuits would enable their implementation in inexpensive economy cars, c- siderably contributing to traffic safety. Cost reduction requires high-level integration of the microwave front-end c- cuitry, specifically analog and digital circuit blocks co-located on a single chip. - cent developments of silicon-based technologies, e.g. CMOS and SiGe:C bipolar, make them suitable for realization of microwave sensors. Additionally, these te- nologies offer the necessary integration capability. However, the required output power and temperature stability, necessary for automotive radar sensor products, have not yet been achieved in standard digital CMOS technologies. On the other hand, SiGe bipolar technology offers excellent high-frequency characteristics and necessary output power for automotive applications, but has lower potential for - alization of digital blocks than CMOS.

Interconnection Noise in VLSI Circuits

Author : Francesc Moll
Publisher : Springer Science & Business Media
ISBN 13 : 0306487195
Total Pages : 214 pages
Book Rating : 4.3/5 (64 download)

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Book Synopsis Interconnection Noise in VLSI Circuits by : Francesc Moll

Download or read book Interconnection Noise in VLSI Circuits written by Francesc Moll and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.

Grounding and Shielding

Author : Ralph Morrison
Publisher : John Wiley & Sons
ISBN 13 : 1119183731
Total Pages : 224 pages
Book Rating : 4.1/5 (191 download)

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Book Synopsis Grounding and Shielding by : Ralph Morrison

Download or read book Grounding and Shielding written by Ralph Morrison and published by John Wiley & Sons. This book was released on 2016-03-24 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applies basic field behavior in circuit design and demonstrates how it relates to grounding and shielding requirements and techniques in circuit design This book connects the fundamentals of electromagnetic theory to the problems of interference in all types of electronic design. The text covers power distribution in facilities, mixing of analog and digital circuitry, circuit board layout at high clock rates, and meeting radiation and susceptibility standards. The author examines the grounding and shielding requirements and techniques in circuit design and applies basic physics to circuit behavior. The sixth edition of this book has been updated with new material added throughout the chapters where appropriate. The presentation of the book has also been rearranged in order to reflect the current trends in the field. Grounding and Shielding: Circuits and Interference, Sixth Edition: Includes new material on vias and field control, capacitors as transmission lines, first energy sources, and high speed designs using boards with only two layers Demonstrates how circuit geometry controls performance from dc to gigahertz Examines the use of multi-shielded transformers in clean-power installations Provides effective techniques for handling noise problems in analog and digital circuits Discusses how to use conductor geometry to improve performance, limit radiation, and reduce susceptibility to all types of hardware and systems Grounding and Shielding: Circuits and Interference, Sixth Edition is an updated guide for circuit design engineers and technicians. It will also serve as a reference for engineers in the semiconductor device industry.

Electrical Design of Through Silicon Via

Author : Manho Lee
Publisher : Springer
ISBN 13 : 9401790388
Total Pages : 286 pages
Book Rating : 4.4/5 (17 download)

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Book Synopsis Electrical Design of Through Silicon Via by : Manho Lee

Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Signal and Power Integrity--simplified

Author : Eric Bogatin
Publisher : Pearson Education
ISBN 13 : 0132349795
Total Pages : 793 pages
Book Rating : 4.1/5 (323 download)

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Book Synopsis Signal and Power Integrity--simplified by : Eric Bogatin

Download or read book Signal and Power Integrity--simplified written by Eric Bogatin and published by Pearson Education. This book was released on 2010 with total page 793 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.

Principles and Techniques of Electromagnetic Compatibility

Author : Christos Christopoulos
Publisher : CRC Press
ISBN 13 : 1420006339
Total Pages : 536 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Principles and Techniques of Electromagnetic Compatibility by : Christos Christopoulos

Download or read book Principles and Techniques of Electromagnetic Compatibility written by Christos Christopoulos and published by CRC Press. This book was released on 2018-10-03 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuits are faster and more tightly packed than ever, wireless technologies increase the electromagnetic (EM) noise environment, new materials entail entirely new immunity issues, and new standards govern the field of electromagnetic compatibility (EMC). Maintaining the practical and comprehensive approach of its predecessor, Principles and Techniques of Electromagnetic Compatibility, Second Edition reflects these emerging challenges and new technologies introduced throughout the decade since the first edition appeared. What's new in the Second Edition? Characterization and testing for high-speed design of clock frequencies up to and above 6 GHz Updates to the regulatory framework governing EM compliance Additional coverage of the printed circuit board (PCB) environment as well as additional numerical tools An entirely new section devoted to new applications, including signal integrity, wireless and broadband technologies, EMC safety, and statistical EMC Added coverage of new materials such as nanomaterials, band gap devices, and composites Along with new and updated content, this edition also includes additional worked examples that demonstrate how estimates can guide the early stages of design. The focus remains on building a sound foundation on the fundamental concepts and linking this to practical applications, rather than supplying application-specific fixes that do not easily generalize to other areas.

Handbook of 3D Integration, Volume 4

Author : Paul D. Franzon
Publisher : John Wiley & Sons
ISBN 13 : 3527697047
Total Pages : 492 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon

Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Antenna-in-Package Technology and Applications

Author : Duixian Liu
Publisher : John Wiley & Sons
ISBN 13 : 1119556651
Total Pages : 492 pages
Book Rating : 4.1/5 (195 download)

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Book Synopsis Antenna-in-Package Technology and Applications by : Duixian Liu

Download or read book Antenna-in-Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-03 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

More than Moore

Author : Guo Qi Zhang
Publisher : Springer Science & Business Media
ISBN 13 : 0387755934
Total Pages : 338 pages
Book Rating : 4.3/5 (877 download)

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Book Synopsis More than Moore by : Guo Qi Zhang

Download or read book More than Moore written by Guo Qi Zhang and published by Springer Science & Business Media. This book was released on 2010-01-23 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.

Power Electronic Packaging

Author : Yong Liu
Publisher : Springer Science & Business Media
ISBN 13 : 1461410533
Total Pages : 606 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Power Electronic Packaging by : Yong Liu

Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Sci-tech News

Author :
Publisher :
ISBN 13 :
Total Pages : 296 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Sci-tech News by :

Download or read book Sci-tech News written by and published by . This book was released on 1999 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Measurement Techniques for Radio Frequency Nanoelectronics

Author : T. Mitch Wallis
Publisher : Cambridge University Press
ISBN 13 : 1107120683
Total Pages : 329 pages
Book Rating : 4.1/5 (71 download)

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Book Synopsis Measurement Techniques for Radio Frequency Nanoelectronics by : T. Mitch Wallis

Download or read book Measurement Techniques for Radio Frequency Nanoelectronics written by T. Mitch Wallis and published by Cambridge University Press. This book was released on 2017-09-14 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring numerous examples linking theoretical concepts with real-world applications, this practical, cross-disciplinary guide will help you understand the fundamentals of radio frequency measurement of nanoscale devices. -- Résumé abrégé du livre.

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Author : Xing-Chang Wei
Publisher : CRC Press
ISBN 13 : 1315305852
Total Pages : 251 pages
Book Rating : 4.3/5 (153 download)

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Book Synopsis Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by : Xing-Chang Wei

Download or read book Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates

Download Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates PDF Online Free

Author : Renato Rimolo-Donadio
Publisher : Logos Verlag Berlin GmbH
ISBN 13 : 3832527761
Total Pages : 226 pages
Book Rating : 4.8/5 (325 download)

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Book Synopsis Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates by : Renato Rimolo-Donadio

Download or read book Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates written by Renato Rimolo-Donadio and published by Logos Verlag Berlin GmbH. This book was released on 2011 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.