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Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 :
Total Pages : 680 pages
Book Rating : 4.3/5 (91 download)
Download or read book Electronics Manufacturing written by John H. Lau and published by McGraw Hill Professional. This book was released on 2003 with total page 680 pages. Available in PDF, EPUB and Kindle. Book excerpt: An engineer's guidebook demonstrating non-toxic electronics manufacturing processes
Author : C. P. Wong
Publisher :
ISBN 13 :
Total Pages : 700 pages
Book Rating : 4.:/5 (133 download)
Download or read book Electronics Manufacturing written by C. P. Wong and published by . This book was released on 2002 with total page 700 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the cost; design; materials; process; equipment; manufacturing; and reliability issues; this comprehensive guide provides cutting edge information on lead-free; halogen-free; and conductive-adhesive technologies. --
Author : Sanka Ganesan
Publisher : John Wiley & Sons
ISBN 13 : 0471786179
Total Pages : 804 pages
Book Rating : 4.4/5 (717 download)
Download or read book Lead-free Electronics written by Sanka Ganesan and published by John Wiley & Sons. This book was released on 2006-02-17 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Author : Edwin Bradley
Publisher : John Wiley & Sons
ISBN 13 : 9780470171462
Total Pages : 472 pages
Book Rating : 4.1/5 (714 download)
Download or read book Lead-Free Electronics written by Edwin Bradley and published by John Wiley & Sons. This book was released on 2007-10-26 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Author :
Publisher : Emerald Group Publishing
ISBN 13 : 184663010X
Total Pages : 72 pages
Book Rating : 4.8/5 (466 download)
Download or read book Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging written by and published by Emerald Group Publishing. This book was released on 2006 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470065419
Total Pages : 508 pages
Book Rating : 4.4/5 (7 download)
Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Author : Ephraim Suhir
Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)
Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author : Dongkai Shangguan
Publisher : ASM International
ISBN 13 : 161503093X
Total Pages : 292 pages
Book Rating : 4.6/5 (15 download)
Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : C.P. Wong
Publisher : Springer Science & Business Media
ISBN 13 : 1441900403
Total Pages : 761 pages
Book Rating : 4.4/5 (419 download)
Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C.P. Wong and published by Springer Science & Business Media. This book was released on 2009-12-23 with total page 761 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author : Mel Schwartz
Publisher : CRC Press
ISBN 13 : 1420082167
Total Pages : 782 pages
Book Rating : 4.4/5 (2 download)
Download or read book Innovations in Materials Manufacturing, Fabrication, and Environmental Safety written by Mel Schwartz and published by CRC Press. This book was released on 2010-11-24 with total page 782 pages. Available in PDF, EPUB and Kindle. Book excerpt: When people make a call on a cellphone, drive a car, or turn on a computer, few truly appreciate the innovations in material selection, technology, and fabrication that were required to make it all possible. Innovations in Materials Manufacturing, Fabrication, and Environmental Safety explores expected developments in analysis, design, testing, and
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811539200
Total Pages : 545 pages
Book Rating : 4.8/5 (115 download)
Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Author : Yi (Grace) Li
Publisher : Springer Science & Business Media
ISBN 13 : 0387887830
Total Pages : 445 pages
Book Rating : 4.3/5 (878 download)
Download or read book Electrical Conductive Adhesives with Nanotechnologies written by Yi (Grace) Li and published by Springer Science & Business Media. This book was released on 2009-10-08 with total page 445 pages. Available in PDF, EPUB and Kindle. Book excerpt: “Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author : Mel Schwartz
Publisher : CRC Press
ISBN 13 : 1420043730
Total Pages : 556 pages
Book Rating : 4.4/5 (2 download)
Download or read book Smart Materials written by Mel Schwartz and published by CRC Press. This book was released on 2008-11-20 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explores State-of-the-Art Work from the World's Foremost Scientists, Engineers, Educators, and Practitioners in the FieldWhy use smart materials?Since most smart materials do not add mass, engineers can endow structures with built-in responses to a myriad of contingencies. In their various forms, these materials can adapt to their environments by c
Author : Sina Ebnesajjad
Publisher : William Andrew
ISBN 13 : 0815516010
Total Pages : 337 pages
Book Rating : 4.8/5 (155 download)
Download or read book Adhesives Technology Handbook written by Sina Ebnesajjad and published by William Andrew. This book was released on 2008-09-16 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Following the successful first, the second edition is a complete guide to all that is required to successfully bond materials. It is both a reference and a source for learning the basics for those involved in the entire product value chains. Basic principles of adhesion such as surface characterization, types of adhesive bonds, and adhesion failure topics are covered in addition to a description of common adhesive materials and application techniques. Provides the end user practitioners of adhesion technology with a complete guide to bonding materials successfully Covers most substrates, including plastics, metals, elastomers and ceramics, explaining basic principles and describing common materials and application techniques Arranges information so that each chapter can be studied selectively or in conjunction with others
Author : Rajesh Gomatam
Publisher : CRC Press
ISBN 13 : 9004187820
Total Pages : 436 pages
Book Rating : 4.0/5 (41 download)
Download or read book Electrically Conductive Adhesives written by Rajesh Gomatam and published by CRC Press. This book was released on 2008-12-23 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni
Author : James E. Morris
Publisher : Springer
ISBN 13 : 3319903624
Total Pages : 1007 pages
Book Rating : 4.3/5 (199 download)
Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author : Rajkumar Durairaj
Publisher : BoD – Books on Demand
ISBN 13 : 9535109537
Total Pages : 117 pages
Book Rating : 4.5/5 (351 download)
Download or read book Rheology written by Rajkumar Durairaj and published by BoD – Books on Demand. This book was released on 2013-02-13 with total page 117 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the current research in the area of rheology. Rheological characterizations are performed on materials in order to understand the basic nature of a system, quality control of raw materials and final products. The rheological characterizations are important to study the effect of different parameters such as formulation, shelf life and temperature on the quality of final products. The book covers a broad range of rheology related topics such as microrheology, capillary rheolgical measurements, characterization of dense suspensions and numerical analysis of viscoelastic fluids.
