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Effect Of Surface Modification Of Multi Walled Carbon Nanotubes On Thermal Conductivity Of Underfill For Microelectronic Packaging
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Book Synopsis Advanced Materials for Thermal Management of Electronic Packaging by : Xingcun Colin Tong
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Download or read book Graphene written by Wonbong Choi and published by CRC Press. This book was released on 2016-04-19 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the late 20th century, graphene-a one-atom-thick planar sheet of sp2-bonded carbon atoms densely packed in a honeycomb crystal lattice-has garnered appreciable attention as a potential next-generation electronic material due to its exceptional properties. These properties include high current density, ballistic transport, chemical inertness,
Book Synopsis Epoxy Composites by : Debdatta Ratna
Download or read book Epoxy Composites written by Debdatta Ratna and published by iSmithers Rapra Publishing. This book was released on 2007-08 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Composite Materials by : Kamal K. Kar
Download or read book Composite Materials written by Kamal K. Kar and published by Springer. This book was released on 2016-10-14 with total page 694 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composite materials are used as substitutions of metals/traditional materials in aerospace, automotive, civil, mechanical and other industries. The present book collects the current knowledge and recent developments in the characterization and application of composite materials. To this purpose the volume describes the outstanding properties of this class of advanced material which recommend it for various industrial applications.
Book Synopsis Nano-Bio- Electronic, Photonic and MEMS Packaging by : C.P. Wong
Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C.P. Wong and published by Springer Science & Business Media. This book was released on 2009-12-23 with total page 761 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Book Synopsis Bioinspired Engineering of Thermal Materials by : Tao Deng
Download or read book Bioinspired Engineering of Thermal Materials written by Tao Deng and published by John Wiley & Sons. This book was released on 2018-06-11 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive overview and summary of recent achievements and the latest trends in bioinspired thermal materials. Following an introduction to different thermal materials and their effective heat transfer to other materials, the text discusses heat detection materials that are inspired by biological systems, such as fire beetles and butterflies. There then follow descriptions of materials with thermal management functionality, including those for evaporation and condensation, heat transfer and thermal insulation materials, as modeled on snake skins, polar bears and fire-resistant trees. A discussion of thermoresponsive materials with thermally switchable surfaces and controllable nanochannels as well as those with high thermal conductivity and piezoelectric sensors is rounded off by a look toward future trends in the bioinspired engineering of thermal materials. Straightforward and well structured, this is an essential reference for newcomers as well as experienced researchers in this exciting field.
Book Synopsis Fundamentals of Lead-Free Solder Interconnect Technology by : Tae-Kyu Lee
Download or read book Fundamentals of Lead-Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Book Synopsis Phenolic Resins: A Century of Progress by : Louis Pilato
Download or read book Phenolic Resins: A Century of Progress written by Louis Pilato and published by Springer Science & Business Media. This book was released on 2010-03-10 with total page 543 pages. Available in PDF, EPUB and Kindle. Book excerpt: The legacy of Leo Hendrik Baekeland and his development of phenol formal- hyde resins are recognized as the cornerstone of the Plastics Industry in the early twentieth century, and phenolic resins continue to ?ourish after a century of robust growth. On July 13, 1907, Baekeland ?led his “heat and pressure” patent related to the processing of phenol formaldehyde resins and identi?ed their unique utility in a plethora of applications. The year 2010 marks the Centennial Year of the prod- tion of phenolic resins by Leo Baekeland. In 1910, Baekeland formed Bakelite GmbH and launched the manufacture of phenolic resins in Erkner in May 1910. In October 1910, General Bakelite began producing resins in Perth Amboy, New Jersey. Lastly, Baekeland collaborated with Dr. Takamine to manufacture phenolic resins in Japan in 1911. These events were instrumental in establishing the Plastics Industry and in tracing the identity to the brilliance of Dr. Leo Baekeland. Phenolic resins remain as a versatile resin system featuring either a stable, thermoplastic novolak composition that cures with a latent source of formaldehyde (hexa) or a heat reactive and perishable resole composition that cures thermally or under acidic or special basic conditions. Phenolic resins are a very large volume resin system with a worldwide volume in excess of 5 million tons/year, and its growth is related to the gross national product (GNP) growth rate globally.
Book Synopsis Fundamentals of Microfabrication and Nanotechnology, Three-Volume Set by : Marc J. Madou
Download or read book Fundamentals of Microfabrication and Nanotechnology, Three-Volume Set written by Marc J. Madou and published by CRC Press. This book was released on 2018-12-14 with total page 1983 pages. Available in PDF, EPUB and Kindle. Book excerpt: Now in its third edition, Fundamentals of Microfabrication and Nanotechnology continues to provide the most complete MEMS coverage available. Thoroughly revised and updated the new edition of this perennial bestseller has been expanded to three volumes, reflecting the substantial growth of this field. It includes a wealth of theoretical and practical information on nanotechnology and NEMS and offers background and comprehensive information on materials, processes, and manufacturing options. The first volume offers a rigorous theoretical treatment of micro- and nanosciences, and includes sections on solid-state physics, quantum mechanics, crystallography, and fluidics. The second volume presents a very large set of manufacturing techniques for micro- and nanofabrication and covers different forms of lithography, material removal processes, and additive technologies. The third volume focuses on manufacturing techniques and applications of Bio-MEMS and Bio-NEMS. Illustrated in color throughout, this seminal work is a cogent instructional text, providing classroom and self-learners with worked-out examples and end-of-chapter problems. The author characterizes and defines major research areas and illustrates them with examples pulled from the most recent literature and from his own work.
Book Synopsis Composite Materials by : Deborah D. L. Chung
Download or read book Composite Materials written by Deborah D. L. Chung and published by Springer Science & Business Media. This book was released on 2010-04-03 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first edition of "Composite Materials" introduced a new way of looking at composite materials. This second edition expands the book’s scope to emphasize application-driven and process-oriented materials development. The approach is vibrant yet functional.
Book Synopsis Handbook of Thermal Science and Engineering by :
Download or read book Handbook of Thermal Science and Engineering written by and published by Springer. This book was released on 2018-07-31 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.
Book Synopsis Electrical Conductive Adhesives with Nanotechnologies by : Yi (Grace) Li
Download or read book Electrical Conductive Adhesives with Nanotechnologies written by Yi (Grace) Li and published by Springer Science & Business Media. This book was released on 2009-10-08 with total page 445 pages. Available in PDF, EPUB and Kindle. Book excerpt: “Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Book Synopsis Electrochemical Nanotechnologies by : Tetsuya Osaka
Download or read book Electrochemical Nanotechnologies written by Tetsuya Osaka and published by Springer Science & Business Media. This book was released on 2009-12-15 with total page 283 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, the term "electrochemical nanotechnology" is defined as nanoprocessing by means of electrochemical techniques. This introductory book reviews the application of electrochemical nanotechnologies with the aim of understanding their wider applicability in evolving nanoindustries. These advances have impacted microelectronics, sensors, materials science, and corrosion science, generating new fields of research that promote interaction between biology, medicine, and microelectronics. This volume reviews nanotechnology applications in selected high technology areas with particular emphasis on advances in such areas. Chapters are classified under four different headings: Nanotechnology for energy devices - Nanotechnology for magnetic storage devices - Nanotechnology for bio-chip applications - Nanotechnology for MEMS/Packaging.
Book Synopsis Brain-Computer Interface Technologies by : Claude Clément
Download or read book Brain-Computer Interface Technologies written by Claude Clément and published by Springer Nature. This book was released on 2019-10-08 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is about the field of brain-computer interfaces (BCI) and the unique and special environment of active implants that electrically interface with the brain, spinal cord, peripheral nerves, and organs. At the heart of the book is the matter of repairing and rehabilitating patients suffering from severe neurologic impairments, from paralysis to movement disorders and epilepsy, that often requires an invasive solution based on an implanted device. Past achievements, current work, and future perspectives of BCI and other interactions between medical devices and the human nervous system are described in detail from a pragmatic point of view. Reviews the Active Implantable Medical Devices (AIMDs) industry and how it is moving from cardiac to neuro applications Clear, easy to read, presentation of the field of neuro-technologies for human benefit Provides easy to understand explanations about the technical limitations, the physics of implants in the human body, and realistic long terms perspectives
Book Synopsis Carbon Nanotubes for Interconnects by : Aida Todri-Sanial
Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2018-05-30 with total page 333 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
