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Author : S K Bajaj
Publisher : Elsevier Health Sciences
ISBN 13 : 8131258963
Total Pages : 26 pages
Book Rating : 4.1/5 (312 download)
Download or read book Effect of Load on SMT (Free & After Load) written by S K Bajaj and published by Elsevier Health Sciences. This book was released on 2019-08-31 with total page 26 pages. Available in PDF, EPUB and Kindle. Book excerpt: Effect of Load on SMT (Free & After Load)
Author : Harminder Singh
Publisher : Elsevier Health Sciences
ISBN 13 : 8131265633
Total Pages : 1153 pages
Book Rating : 4.1/5 (312 download)
Download or read book Textbook of Physiology for Medical Students, 2nd Edition - E-Book written by Harminder Singh and published by Elsevier Health Sciences. This book was released on 2022-11-16 with total page 1153 pages. Available in PDF, EPUB and Kindle. Book excerpt: Textbook of Physiology for Medical Students, 2nd Edition - E-Book
Author : Alan Talevi
Publisher : Frontiers Media SA
ISBN 13 : 2889666972
Total Pages : 135 pages
Book Rating : 4.8/5 (896 download)
Download or read book Lipid Nanoparticles as a Novel Strategy to Deliver Bioactive Molecules written by Alan Talevi and published by Frontiers Media SA. This book was released on 2021-04-13 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ning-Cheng Lee
Publisher : Elsevier
ISBN 13 : 008049224X
Total Pages : 281 pages
Book Rating : 4.0/5 (84 download)
Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Elsevier. This book was released on 2002-01-24 with total page 281 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.Provides engineers the cutting-edge technology in a rapidly changing fieldOffers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Author : Ephraim Suhir
Publisher : John Wiley & Sons
ISBN 13 : 047088679X
Total Pages : 610 pages
Book Rating : 4.4/5 (78 download)
Download or read book Structural Dynamics of Electronic and Photonic Systems written by Ephraim Suhir and published by John Wiley & Sons. This book was released on 2011-04-04 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811539200
Total Pages : 545 pages
Book Rating : 4.8/5 (115 download)
Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Author : Li, Kuan-Ching
Publisher : IGI Global
ISBN 13 : 1605666629
Total Pages : 1018 pages
Book Rating : 4.6/5 (56 download)
Download or read book Handbook of Research on Scalable Computing Technologies written by Li, Kuan-Ching and published by IGI Global. This book was released on 2009-07-31 with total page 1018 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book presents, discusses, shares ideas, results and experiences on the recent important advances and future challenges on enabling technologies for achieving higher performance"--Provided by publisher.
Author : Gerald W. Turnage
Publisher :
ISBN 13 :
Total Pages : 120 pages
Book Rating : 4.3/5 (91 download)
Download or read book Performance of Soils Under Tire Loads written by Gerald W. Turnage and published by . This book was released on 1966 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John Hock Lye Pang
Publisher : Springer Science & Business Media
ISBN 13 : 1461404630
Total Pages : 184 pages
Book Rating : 4.4/5 (614 download)
Download or read book Lead Free Solder written by John Hock Lye Pang and published by Springer Science & Business Media. This book was released on 2011-10-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
Author : Nathaniel Benz
Publisher : Springer Nature
ISBN 13 : 3031606981
Total Pages : 447 pages
Book Rating : 4.0/5 (316 download)
Download or read book NASA Formal Methods written by Nathaniel Benz and published by Springer Nature. This book was released on with total page 447 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : American Society of Echocardiography
Publisher : Elsevier Health Sciences
ISBN 13 : 0323709362
Total Pages : 1191 pages
Book Rating : 4.3/5 (237 download)
Download or read book ASE's Comprehensive Echocardiography E-Book written by American Society of Echocardiography and published by Elsevier Health Sciences. This book was released on 2021-02-18 with total page 1191 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by a team of leading echocardiography experts and endorsed by the American Society of Echocardiography, ASE'S Comprehensive Echocardiography, 3rd Edition, covers the full spectrum of sonography of the heart in one succinct, authoritative resource. This highly regarded text provides must-know information on everything from basic foundations and principles to clinical application, written and edited by ASE members with expertise in each specific area. Case studies, numerous tables, high-quality images and videos highlight the latest uses of echocardiography, including the most recent 2D and 3D advances. - Discusses all the latest methods to assess cardiac chamber size and function, valvular stenosis/regurgitation, cardiomyopathies, coronary artery disease, complications of myocardial infarction, and other cardiac pathologies. - Covers recent advances in critical care echocardiography, cardio-oncology, structural heart disease, interventional/intraoperative echocardiography, strain imaging of left and right heart chambers, multimodality imaging in systemic diseases, and novel 3D techniques. - Contains more than 1,200 updated images: echocardiograms (including 2D, 3D, and Doppler), diagrams, anatomic drawings, algorithmic drawings, and more. - Provides access to nearly 600 full-motion echocardiography video clips. - Keeps you up to date with the latest echocardiography practice guidelines and advanced technologies. - Enhanced eBook version included with purchase. Your enhanced eBook allows you to access all of the text, figures, and references from the book on a variety of devices.
Author : Sanka Ganesan
Publisher : John Wiley & Sons
ISBN 13 : 0471786179
Total Pages : 804 pages
Book Rating : 4.4/5 (717 download)
Download or read book Lead-free Electronics written by Sanka Ganesan and published by John Wiley & Sons. This book was released on 2006-02-17 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Author : Keith Alexander Seffen
Publisher : Cambridge University Press
ISBN 13 : 1108922775
Total Pages : 204 pages
Book Rating : 4.1/5 (89 download)
Download or read book Solving Problems of Simple Structural Mechanics written by Keith Alexander Seffen and published by Cambridge University Press. This book was released on 2022-01-20 with total page 204 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solve problems in elementary structural mechanics thoughtfully and efficiently with this self-contained volume. Covers the basics of structural mechanics and focuses on simple structures, truss frameworks, beams and frames, design choices, and deformity. Carefully interrogates underlying assumptions for efficiencies in working out whilst expounding fundamental principles for a consistent understanding. Heavily connects the practical world of indeterminate structures to their analysis, to underline benefits they impart to the latter: that certain analytical methods provide a wealth of efficient solutions for problems of indeterminate structures compared to determinate ones. Celebrates the beauty of analytical indeterminacy and its relationship to practical structures. Perfect for students invested in structural mechanics, and aims to complement their learning and understanding.
Author : Carl Todd
Publisher : Jessica Kingsley Publishers
ISBN 13 : 1913426300
Total Pages : 307 pages
Book Rating : 4.9/5 (134 download)
Download or read book Managing the Spino-Pelvic-Hip Complex written by Carl Todd and published by Jessica Kingsley Publishers. This book was released on 2022-11-21 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: Managing the Spino-Pelvic-Hip Complex is based on the author's extensive clinical experience of assessing and treating athletes at all levels. For nearly 20 years his work has been in the field of high-performance sport. That experience has informed his clinical reasoning and treatment philosophies which are also based upon lessons learnt from challenging the science through a Doctor of Philosophy degree. The book encompasses a complete management strategy for manual practitioners to use when dealing with ongoing issues pertaining to the spino-pelvic-hip complex. It presents a strategy which aims to simplify functional, biomechanical and bio-psychosocial analysis models that can be used as diagnostic tools to highlight kinetic chain and/or specific segmental restrictions in the spino-pelvic-hip complex. The author gives a rationale for the application of the treatment specific to the needs of the athlete, using the appropriate manual techniques to the lumbar spine, pelvis and hip joint. The treatments are also complemented by strategies for active lifestyle management, incorporating activation techniques and movement control exercises. Managing the Spino-Pelvic-Hip Complex complements the courses that the author has developed and delivers. It can be also used as a stand-alone educational tool and will be helpful for any therapist working within the sporting environment.
Author :
Publisher : Emerald Group Publishing
ISBN 13 : 184663010X
Total Pages : 72 pages
Book Rating : 4.8/5 (466 download)
Download or read book Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging written by and published by Emerald Group Publishing. This book was released on 2006 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.
Author :
Publisher :
ISBN 13 :
Total Pages : 890 pages
Book Rating : 4.:/5 (319 download)
Download or read book NASA Tech Briefs written by and published by . This book was released on 2004 with total page 890 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Vijay Nagarajan
Publisher : Morgan & Claypool Publishers
ISBN 13 : 1681737108
Total Pages : 296 pages
Book Rating : 4.6/5 (817 download)
Download or read book A Primer on Memory Consistency and Cache Coherence written by Vijay Nagarajan and published by Morgan & Claypool Publishers. This book was released on 2020-02-04 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many modern computer systems, including homogeneous and heterogeneous architectures, support shared memory in hardware. In a shared memory system, each of the processor cores may read and write to a single shared address space. For a shared memory machine, the memory consistency model defines the architecturally visible behavior of its memory system. Consistency definitions provide rules about loads and stores (or memory reads and writes) and how they act upon memory. As part of supporting a memory consistency model, many machines also provide cache coherence protocols that ensure that multiple cached copies of data are kept up-to-date. The goal of this primer is to provide readers with a basic understanding of consistency and coherence. This understanding includes both the issues that must be solved as well as a variety of solutions. We present both high-level concepts as well as specific, concrete examples from real-world systems. This second edition reflects a decade of advancements since the first edition and includes, among other more modest changes, two new chapters: one on consistency and coherence for non-CPU accelerators (with a focus on GPUs) and one that points to formal work and tools on consistency and coherence.
