Ectc 2017

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Advanced Driver Assistance Systems and Autonomous Vehicles

Author : Yan Li
Publisher : Springer Nature
ISBN 13 : 9811950539
Total Pages : 628 pages
Book Rating : 4.8/5 (119 download)

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Book Synopsis Advanced Driver Assistance Systems and Autonomous Vehicles by : Yan Li

Download or read book Advanced Driver Assistance Systems and Autonomous Vehicles written by Yan Li and published by Springer Nature. This book was released on 2022-10-28 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology

Chiplet Design and Heterogeneous Integration Packaging

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811999171
Total Pages : 542 pages
Book Rating : 4.8/5 (119 download)

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Book Synopsis Chiplet Design and Heterogeneous Integration Packaging by : John H. Lau

Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau and published by Springer Nature. This book was released on 2023-03-27 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119313988
Total Pages : 634 pages
Book Rating : 4.1/5 (193 download)

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Book Synopsis Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by : Beth Keser

Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-20 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Semiconductor Advanced Packaging

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)

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Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Electronic Enclosures, Housings and Packages

Author : Frank Suli
Publisher : Woodhead Publishing
ISBN 13 : 008102391X
Total Pages : 490 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis Electronic Enclosures, Housings and Packages by : Frank Suli

Download or read book Electronic Enclosures, Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-01 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.

Semiconductor Process Integration 10

Author : J. Murota
Publisher : The Electrochemical Society
ISBN 13 : 1607688212
Total Pages : 325 pages
Book Rating : 4.6/5 (76 download)

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Book Synopsis Semiconductor Process Integration 10 by : J. Murota

Download or read book Semiconductor Process Integration 10 written by J. Murota and published by The Electrochemical Society. This book was released on with total page 325 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Heterogeneous Integrations

Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811372241
Total Pages : 381 pages
Book Rating : 4.8/5 (113 download)

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Book Synopsis Heterogeneous Integrations by : John H. Lau

Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Encapsulation Technologies for Electronic Applications

Author : Haleh Ardebili
Publisher : William Andrew
ISBN 13 : 0128119799
Total Pages : 510 pages
Book Rating : 4.1/5 (281 download)

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Book Synopsis Encapsulation Technologies for Electronic Applications by : Haleh Ardebili

Download or read book Encapsulation Technologies for Electronic Applications written by Haleh Ardebili and published by William Andrew. This book was released on 2018-10-23 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them

Direct Copper Interconnection for Advanced Semiconductor Technology

Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028640
Total Pages : 463 pages
Book Rating : 4.0/5 (4 download)

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Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Fan-Out Wafer-Level Packaging

Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811088845
Total Pages : 319 pages
Book Rating : 4.8/5 (11 download)

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Book Synopsis Fan-Out Wafer-Level Packaging by : John H. Lau

Download or read book Fan-Out Wafer-Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Transportation Electrification

Author : Ahmed A. Mohamed
Publisher : John Wiley & Sons
ISBN 13 : 1119812321
Total Pages : 564 pages
Book Rating : 4.1/5 (198 download)

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Book Synopsis Transportation Electrification by : Ahmed A. Mohamed

Download or read book Transportation Electrification written by Ahmed A. Mohamed and published by John Wiley & Sons. This book was released on 2023-01-05 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Transportation Electrification Dive deep into the latest breakthroughs in electrified modes of transport In Transportation Electrification, an accomplished team of researchers and industry experts delivers a unique synthesis of detailed analyses of recent breakthroughs in several modes of electric transportation and a holistic overview of how those advances can or cannot be applied to other modes of transportation. The editors include resources that examine electric aircraft, rolling stock, watercraft, and vehicle transportation types and comparatively determine their stages of development, distinctive and common barriers to advancement, challenges, gaps in technology, and possible solutions to developmental problems. This book offers readers a breadth of foundational knowledge combined with a deep understanding of the issues afflicting each mode of transportation. It acts as a roadmap and policy framework for transportation companies to guide the electrification of transportation vessels. Readers will benefit from an overview of key standards and regulations in the electrified transportation industry, as well as: A thorough introduction to the various modes of electric transportation, including recent advances in each mode, and the technological and policy challenges posed by them An exploration of different vehicle systems, including recent advanced in hybrid and EV powertrain architectures and advanced energy management strategies Discussions of electrified aircraft, including advanced technologies and architecture optimizations for cargo air vehicle, passenger air vehicles, and heavy lift vertical take-off and landing craft In-depth examinations of rolling stock and watercraft-type vehicles, and special vehicles, including various system architectures and energy storage systems relevant to each Perfect for practicing professionals in the electric transport industry, Transportation Electrification is also a must-read resource for standardization body members, regulators, officials, policy makers, and undergraduate students in electrical and electronics engineering.

Interconnect Reliability in Advanced Memory Device Packaging

Author : Chong Leong, Gan
Publisher : Springer Nature
ISBN 13 : 3031267087
Total Pages : 223 pages
Book Rating : 4.0/5 (312 download)

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Book Synopsis Interconnect Reliability in Advanced Memory Device Packaging by : Chong Leong, Gan

Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119793890
Total Pages : 324 pages
Book Rating : 4.1/5 (197 download)

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Book Synopsis Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces by : Beth Keser

Download or read book Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-06 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.

Lead Free Solders

Author : Abhijit Kar
Publisher : BoD – Books on Demand
ISBN 13 : 1789854598
Total Pages : 96 pages
Book Rating : 4.7/5 (898 download)

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Book Synopsis Lead Free Solders by : Abhijit Kar

Download or read book Lead Free Solders written by Abhijit Kar and published by BoD – Books on Demand. This book was released on 2019-10-02 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Author : Lih-Tyng Hwang
Publisher : John Wiley & Sons
ISBN 13 : 1119289661
Total Pages : 602 pages
Book Rating : 4.1/5 (192 download)

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Book Synopsis 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by : Lih-Tyng Hwang

Download or read book 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility written by Lih-Tyng Hwang and published by John Wiley & Sons. This book was released on 2018-03-29 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

Flexible, Wearable, and Stretchable Electronics

Author : Katsuyuki Sakuma
Publisher : CRC Press
ISBN 13 : 042955897X
Total Pages : 460 pages
Book Rating : 4.4/5 (295 download)

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Book Synopsis Flexible, Wearable, and Stretchable Electronics by : Katsuyuki Sakuma

Download or read book Flexible, Wearable, and Stretchable Electronics written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2020-11-20 with total page 460 pages. Available in PDF, EPUB and Kindle. Book excerpt: Remarkable progress has been achieved within recent years in developing flexible, wearable, and stretchable (FWS) electronics. These electronics will play an increasingly significant role in the future of electronics and will open new product paradigms that conventional semiconductors are not capable of. This is because flexible electronics will allow us to build flexible circuits and devices on a substrate that can be bent, stretched, or folded without losing functionality. This revolutionary change will impact how we interact with the world around us. Future electronic devices will use flexible electronics as part of ambient intelligence and ubiquitous computing for many different applications such as consumer electronics, medical, healthcare, and security devices. Thus, these devices have the potential to create a huge market all over the world. Flexible, Wearable, and Stretchable Electronics, provide a comprehensive technological review of the state-of-the-art developments in FWS electronics. This book offers the reader a taste of what is possible with FWS electronics and describes how these electronics can provide unique solutions for a wide variety of applications. Furthermore, the book introduces and explains new applications of flexible technology that has opened up the future of FWS electronics.

Integrated Nanophotonics

Author : Peng Yu
Publisher : John Wiley & Sons
ISBN 13 : 3527833048
Total Pages : 389 pages
Book Rating : 4.5/5 (278 download)

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Book Synopsis Integrated Nanophotonics by : Peng Yu

Download or read book Integrated Nanophotonics written by Peng Yu and published by John Wiley & Sons. This book was released on 2023-05-31 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Nanophotonics Helps readers understand the important advances in nanophotonics materials development and their latest applications This book introduces the current state of and emerging trends in the development of integrated nanophotonics. Written by three well-qualified authors, it systematically reviews the knowledge of integrated nanophotonics from theory to the most recent technological developments. It also covers the applications of integrated nanophotonics in essential areas such as neuromorphic computing, biosensing, and optical communications. Lastly, it brings together the latest advancements in the key principles of photonic integrated circuits, plus the recent advances in tackling the barriers in photonic integrated circuits. Sample topics included in this comprehensive resource include: Platforms for integrated nanophotonics, including lithium niobate nanophotonics, indium phosphide nanophotonics, silicon nanophotonics, and nonlinear optics for integrated photonics The devices and technologies for integrated nanophotonics in on-chip light sources, optical packaging of photonic integrated circuits, optical interconnects, and light processing devices Applications on neuromorphic computing, biosensing, LIDAR, and computing for AI and artificial neural network and deep learning Materials scientists, physicists, and physical chemists can use this book to understand the totality of cutting-edge theory, research, and applications in the field of integrated nanophotonics.