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Die Stacking Architecture
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Book Synopsis Die-stacking Architecture by : Yuan Xie
Download or read book Die-stacking Architecture written by Yuan Xie and published by Springer Nature. This book was released on 2022-05-31 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Book Synopsis Die-stacking Architecture by : Yuan Xie
Download or read book Die-stacking Architecture written by Yuan Xie and published by Morgan & Claypool Publishers. This book was released on 2015-06-01 with total page 129 pages. Available in PDF, EPUB and Kindle. Book excerpt: The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Book Synopsis Progress in VLSI Design and Test by : Hafizur Rahaman
Download or read book Progress in VLSI Design and Test written by Hafizur Rahaman and published by Springer. This book was released on 2012-06-26 with total page 427 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 16th International Symposium on VSLI Design and Test, VDAT 2012, held in Shibpur, India, in July 2012. The 30 revised regular papers presented together with 10 short papers and 13 poster sessions were carefully selected from 135 submissions. The papers are organized in topical sections on VLSI design, design and modeling of digital circuits and systems, testing and verification, design for testability, testing memories and regular logic arrays, embedded systems: hardware/software co-design and verification, emerging technology: nanoscale computing and nanotechnology.
Book Synopsis Three-Dimensional Design Methodologies for Tree-based FPGA Architecture by : Vinod Pangracious
Download or read book Three-Dimensional Design Methodologies for Tree-based FPGA Architecture written by Vinod Pangracious and published by Springer. This book was released on 2015-06-25 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Book Synopsis Thermal Management of Die Stacking Architecture that Includes Memory and Logic Processor by : Bhavani Prasad Dewan Sandur
Download or read book Thermal Management of Die Stacking Architecture that Includes Memory and Logic Processor written by Bhavani Prasad Dewan Sandur and published by ProQuest. This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis focuses on carrying out a parametric study of stacking memory and the logic processor on the same substrate. In present technologies, logic processor and memory packages are located side-by-side on the board or they are packaged separately and then stacked on top of each other (Package-on-package [PoP]). Mixing memory and logic processor in the same stack has advantage and challenges, but requires the integration ability of economies-of-scale. The technology needed for packaging memory and logic dice on the same substrate is completely different as compared to packaging only memory dice or logic dice, or, packaging memory and logic separately and creating a single functional package [PoP]. Geometries needed were generated by using Pro/EngineerRTM Wildfire(TM) 2.0 as a Computer-Aided-Design (CAD) tool and were transferred to ANSYSRTM Workbench(TM) 10.0, where meshed analysis was conducted. Package architectures evaluated were rotated stack, staggered stack utilizing redistributed pads, and stacking with spacers, while all other parameters were held constant. The values of these parameters were determined to give a junction temperature of 100°C, which is an unacceptable value due to wafer level electromigration. A discussion is presented as to what parameters need to be adjusted in order to meet the required thermal design specification. In that light, a list of solutions consisting of increasing the heat transfer co-efficient on top of the package, the use of underfill, improved thermal conductivity of the PCB, and the use of a copper heat spreader were evaluated. Results are evaluated in the light of market segment requirements. (Abstract shortened by UMI.).
Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-05-06 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Book Synopsis Multi-Core Cache Hierarchies by : Rajeev Balasubramonian
Download or read book Multi-Core Cache Hierarchies written by Rajeev Balasubramonian and published by Morgan & Claypool Publishers. This book was released on 2011 with total page 137 pages. Available in PDF, EPUB and Kindle. Book excerpt: A key determinant of overall system performance and power dissipation is the cache hierarchy since access to off-chip memory consumes many more cycles and energy than on-chip accesses. In addition, multi-core processors are expected to place ever higher bandwidth demands on the memory system. All these issues make it important to avoid off-chip memory access by improving the efficiency of the on-chip cache. Future multi-core processors will have many large cache banks connected by a network and shared by many cores. Hence, many important problems must be solved: cache resources must be allocated across many cores, data must be placed in cache banks that are near the accessing core, and the most important data must be identified for retention. Finally, difficulties in scaling existing technologies require adapting to and exploiting new technology constraints.The book attempts a synthesis of recent cache research that has focused on innovations for multi-core processors. It is an excellent starting point for early-stage graduate students, researchers, and practitioners who wish to understand the landscape of recent cache research.The book is suitable as a reference for advanced computer architecture classes as well as for experienced researchers and VLSI engineers.Table of Contents: Basic Elements of Large Cache Design / Organizing Data in CMP Last Level Caches / Policies Impacting Cache Hit Rates / Interconnection Networks within Large Caches / Technology / Concluding Remarks
Book Synopsis Computer Performance Evaluation and Benchmarking by : David Kaeli
Download or read book Computer Performance Evaluation and Benchmarking written by David Kaeli and published by Springer. This book was released on 2009-01-20 with total page 153 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the SPEC Benchmark Workshop 2009 held in Austin, Texas, USA on January 25th, 2009. The 9 papers presented were carefully selected and reviewed for inclusion in the book. The result is a collection of high-quality papers discussing current issues in the area of benchmarking research and technology. The topics covered are: benchmark suites, CPU benchmarking, power/thermal benchmarking, and modeling and sampling techniques.
Book Synopsis Computer Engineering and Technology by : Weixia Xu
Download or read book Computer Engineering and Technology written by Weixia Xu and published by Springer. This book was released on 2016-01-13 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 19th CCF Conference on Computer Engineering and Technology, NCCET 2015, held in Hefei, China, in October 2015. The 18 papers presented were carefully reviewed and selected from 158 submissions. They are organized in topical sections on processor architecture; application specific processors; computer application and software optimization; technology on the horizon.
Book Synopsis Architecture of Computing Systems – ARCS 2015 by : Luís Miguel Pinho Pinho
Download or read book Architecture of Computing Systems – ARCS 2015 written by Luís Miguel Pinho Pinho and published by Springer. This book was released on 2015-03-10 with total page 255 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 28th International Conference on Architecture of Computing Systems, ARCS 2015, held in Porto, Portugal, in March 2015. The 19 papers presented together with three invited papers were carefully reviewed and selected from 45 submissions. The papers are organized in six sessions covering the topics: hardware, design, applications, trust and privacy, real-time issues and a best papers session.
Book Synopsis Architecture of Computing Systems -- ARCS 2014 by : Erik Maehle
Download or read book Architecture of Computing Systems -- ARCS 2014 written by Erik Maehle and published by Springer. This book was released on 2014-02-17 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 27th International Conference on Architecture of Computing Systems, ARCS 2014, held in Lübeck, Germany, in February 2014. The 20 papers presented in this volume were carefully reviewed and selected from 44 submissions. They are organized in topical sections named: parallelization: applications and methods; self-organization and trust; system design; system design and sensor systems; and virtualization: I/O, memory, cloud; dependability: safety, security, and reliability aspects.
Book Synopsis Principles of Secure Processor Architecture Design by : Jakub Szefer
Download or read book Principles of Secure Processor Architecture Design written by Jakub Szefer and published by Morgan & Claypool Publishers. This book was released on 2018-10-18 with total page 175 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the different challenges of secure processor architecture design for architects working in industry who want to add security features to their designs as well as graduate students interested in research on architecture and hardware security. It educates readers about how the different challenges have been solved in the past and what are the best practices, i.e., the principles, for design of new secure processor architectures. Based on the careful review of past work by many computer architects and security researchers, readers also will come to know the five basic principles needed for secure processor architecture design. The book also presents existing research challenges and potential new research directions. Finally, it presents numerous design suggestions, as well as discussing pitfalls and fallacies that designers should avoid. With growing interest in computer security and the protection of the code and data which execute on commodity computers, the amount of hardware security features in today's processors has increased significantly over the recent years. No longer of just academic interest, security features inside processors have been embraced by industry as well, with a number of commercial secure processor architectures available today. This book gives readers insights into the principles behind the design of academic and commercial secure processor architectures. Secure processor architecture research is concerned with exploring and designing hardware features inside computer processors, features which can help protect confidentiality and integrity of the code and data executing on the processor. Unlike traditional processor architecture research that focuses on performance, efficiency, and energy as the first-order design objectives, secure processor architecture design has security as the first-order design objective (while still keeping the others as important design aspects that need to be considered).
Book Synopsis Three Dimensional System Integration by : Antonis Papanikolaou
Download or read book Three Dimensional System Integration written by Antonis Papanikolaou and published by Springer Science & Business Media. This book was released on 2010-12-07 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Book Synopsis 3D IC Stacking Technology by : Banqiu Wu
Download or read book 3D IC Stacking Technology written by Banqiu Wu and published by McGraw Hill Professional. This book was released on 2011-10-14 with total page 543 pages. Available in PDF, EPUB and Kindle. Book excerpt: The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
Book Synopsis Datacenter Design and Management by : Benjamin C. Lee
Download or read book Datacenter Design and Management written by Benjamin C. Lee and published by Morgan & Claypool Publishers. This book was released on 2016-02-01 with total page 123 pages. Available in PDF, EPUB and Kindle. Book excerpt: An era of big data demands datacenters, which house the computing infrastructure that translates raw data into valuable information. This book defines datacenters broadly, as large distributed systems that perform parallel computation for diverse users. These systems exist in multiple forms—private and public—and are built at multiple scales. Datacenter design and management is multifaceted, requiring the simultaneous pursuit of multiple objectives. Performance, efficiency, and fairness are first-order design and management objectives, each which can be viewed from several perspectives. This book surveys datacenter research from a computer architect's perspective, addressing challenges in applications, design, management, server simulation, and system simulation. This perspective complements the rich bodies of work in datacenters as a warehouse-scale system, which study the implications for infrastructure that encloses computing equipment, and in datacenters as a distributed systems, which employ abstract details in processor and memory subsystems. This book is written for first- or second-year graduate students in computer architecture and may be helpful for those in computer systems. The goal of this book is to prepare computer architects for datacenter-oriented research by describing prevalent perspectives and the state-of-the-art.
Book Synopsis Deep Learning for Computer Architects by : Brandon Reagen
Download or read book Deep Learning for Computer Architects written by Brandon Reagen and published by Morgan & Claypool Publishers. This book was released on 2017-08-22 with total page 125 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a primer written for computer architects in the new and rapidly evolving field of deep learning. It reviews how machine learning has evolved since its inception in the 1960s and tracks the key developments leading up to the emergence of the powerful deep learning techniques that emerged in the last decade. Machine learning, and specifically deep learning, has been hugely disruptive in many fields of computer science. The success of deep learning techniques in solving notoriously difficult classification and regression problems has resulted in their rapid adoption in solving real-world problems. The emergence of deep learning is widely attributed to a virtuous cycle whereby fundamental advancements in training deeper models were enabled by the availability of massive datasets and high-performance computer hardware. It also reviews representative workloads, including the most commonly used datasets and seminal networks across a variety of domains. In addition to discussing the workloads themselves, it also details the most popular deep learning tools and show how aspiring practitioners can use the tools with the workloads to characterize and optimize DNNs. The remainder of the book is dedicated to the design and optimization of hardware and architectures for machine learning. As high-performance hardware was so instrumental in the success of machine learning becoming a practical solution, this chapter recounts a variety of optimizations proposed recently to further improve future designs. Finally, it presents a review of recent research published in the area as well as a taxonomy to help readers understand how various contributions fall in context.
Book Synopsis Fundamentals of Parallel Multicore Architecture by : Yan Solihin
Download or read book Fundamentals of Parallel Multicore Architecture written by Yan Solihin and published by CRC Press. This book was released on 2015-11-18 with total page 495 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although multicore is now a mainstream architecture, there are few textbooks that cover parallel multicore architectures. Filling this gap, Fundamentals of Parallel Multicore Architecture provides all the material for a graduate or senior undergraduate course that focuses on the architecture of multicore processors. The book is also useful as a ref
