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Author :
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (72 download)
Download or read book Design, Process Integration, and Characterization for Microelectronics written by and published by . This book was released on 2002 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Alexander Starikov
Publisher : Society of Photo Optical
ISBN 13 : 9780819444394
Total Pages : 628 pages
Book Rating : 4.4/5 (443 download)
Download or read book Design, Process Integration, and Characterization for Microelectronics written by Alexander Starikov and published by Society of Photo Optical. This book was released on 2002 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Badih El-Kareh
Publisher : Springer
ISBN 13 : 3030150852
Total Pages : 648 pages
Book Rating : 4.0/5 (31 download)
Download or read book Silicon Analog Components written by Badih El-Kareh and published by Springer. This book was released on 2019-08-07 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications; Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing.
Author :
Publisher :
ISBN 13 :
Total Pages : 634 pages
Book Rating : 4.3/5 (91 download)
Download or read book Design and Process Integration for Microelectronic Manufacturing written by and published by . This book was released on 2006 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Author : Lars W. Liebmann
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 336 pages
Book Rating : 4.F/5 ( download)
Download or read book Design and Process Integration for Microelectronic Manufacturing II [sic] written by Lars W. Liebmann and published by SPIE-International Society for Optical Engineering. This book was released on 2004 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : Artur Balasinski
Publisher : CRC Press
ISBN 13 : 1439817154
Total Pages : 249 pages
Book Rating : 4.4/5 (398 download)
Download or read book Semiconductors written by Artur Balasinski and published by CRC Press. This book was released on 2018-09-03 with total page 249 pages. Available in PDF, EPUB and Kindle. Book excerpt: Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples. Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and researchers defining product architecture and research programs.
Author : Charles J. Alpert
Publisher : CRC Press
ISBN 13 : 1420013483
Total Pages : 1024 pages
Book Rating : 4.4/5 (2 download)
Download or read book Handbook of Algorithms for Physical Design Automation written by Charles J. Alpert and published by CRC Press. This book was released on 2008-11-12 with total page 1024 pages. Available in PDF, EPUB and Kindle. Book excerpt: The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in
Author : Deepraj Soni
Publisher : Springer Nature
ISBN 13 : 3030576825
Total Pages : 185 pages
Book Rating : 4.0/5 (35 download)
Download or read book Hardware Architectures for Post-Quantum Digital Signature Schemes written by Deepraj Soni and published by Springer Nature. This book was released on 2020-10-27 with total page 185 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores C-based design, implementation, and analysis of post-quantum cryptography (PQC) algorithms for signature generation and verification. The authors investigate NIST round 2 PQC algorithms for signature generation and signature verification from a hardware implementation perspective, especially focusing on C-based design, power-performance-area-security (PPAS) trade-offs and design flows targeting FPGAs and ASICs. Describes a comprehensive set of synthesizable c code base as well as the hardware implementations for the different types of PQC algorithms including lattice-based, code-based, and multivariate-based; Demonstrates the hardware (FPGA and ASIC) and hardware-software optimizations and trade-offs of the NIST round 2 signature-based PQC algorithms; Enables designers to build hardware implementations that are resilient to a variety of side-channels.
Author : Vasilis F. Pavlidis
Publisher : Newnes
ISBN 13 : 0124104843
Total Pages : 768 pages
Book Rating : 4.1/5 (241 download)
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author : Saumil S. Shah
Publisher :
ISBN 13 :
Total Pages : 282 pages
Book Rating : 4.3/5 (91 download)
Download or read book Leakage Power Analysis and Optimization in Deep-Submicron Technologies Under Process Variation written by Saumil S. Shah and published by . This book was released on 2007 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : National Research Council
Publisher : National Academies Press
ISBN 13 : 0309176670
Total Pages : 228 pages
Book Rating : 4.3/5 (91 download)
Download or read book Unit Manufacturing Processes written by National Research Council and published by National Academies Press. This book was released on 1995-01-03 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Manufacturing, reduced to its simplest form, involves the sequencing of product forms through a number of different processes. Each individual step, known as an unit manufacturing process, can be viewed as the fundamental building block of a nation's manufacturing capability. A committee of the National Research Council has prepared a report to help define national priorities for research in unit processes. It contains an organizing framework for unit process families, criteria for determining the criticality of a process or manufacturing technology, examples of research opportunities, and a prioritized list of enabling technologies that can lead to the manufacture of products of superior quality at competitive costs. The study was performed under the sponsorship of the National Science Foundation and the Defense Department's Manufacturing Technology Program.
Author : John R. Howell
Publisher : CRC Press
ISBN 13 : 1000257835
Total Pages : 967 pages
Book Rating : 4.0/5 (2 download)
Download or read book Thermal Radiation Heat Transfer written by John R. Howell and published by CRC Press. This book was released on 2020-12-10 with total page 967 pages. Available in PDF, EPUB and Kindle. Book excerpt: The seventh edition of this classic text outlines the fundamental physical principles of thermal radiation, as well as analytical and numerical techniques for quantifying radiative transfer between surfaces and within participating media. The textbook includes newly expanded sections on surface properties, electromagnetic theory, scattering and absorption of particles, and near-field radiative transfer, and emphasizes the broader connections to thermodynamic principles. Sections on inverse analysis and Monte Carlo methods have been enhanced and updated to reflect current research developments, along with new material on manufacturing, renewable energy, climate change, building energy efficiency, and biomedical applications. Features: Offers full treatment of radiative transfer and radiation exchange in enclosures. Covers properties of surfaces and gaseous media, and radiative transfer equation development and solutions. Includes expanded coverage of inverse methods, electromagnetic theory, Monte Carlo methods, and scattering and absorption by particles. Features expanded coverage of near-field radiative transfer theory and applications. Discusses electromagnetic wave theory and how it is applied to thermal radiation transfer. This textbook is ideal for Professors and students involved in first-year or advanced graduate courses/modules in Radiative Heat Transfer in engineering programs. In addition, professional engineers, scientists and researchers working in heat transfer, energy engineering, aerospace and nuclear technology will find this an invaluable professional resource. Over 350 surface configuration factors are available online, many with online calculation capability. Online appendices provide information on related areas such as combustion, radiation in porous media, numerical methods, and biographies of important figures in the history of the field. A Solutions Manual is available for instructors adopting the text.
Author : Thomas Dillinger
Publisher : Prentice Hall
ISBN 13 : 0135657687
Total Pages : 855 pages
Book Rating : 4.1/5 (356 download)
Download or read book VLSI Design Methodology Development written by Thomas Dillinger and published by Prentice Hall. This book was released on 2019-06-17 with total page 855 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Complete, Modern Tutorial on Practical VLSI Chip Design, Validation, and Analysis As microelectronics engineers design complex chips using existing circuit libraries, they must ensure correct logical, physical, and electrical properties, and prepare for reliable foundry fabrication. VLSI Design Methodology Development focuses on the design and analysis steps needed to perform these tasks and successfully complete a modern chip design. Microprocessor design authority Tom Dillinger carefully introduces core concepts, and then guides engineers through modeling, functional design validation, design implementation, electrical analysis, and release to manufacturing. Writing from the engineer’s perspective, he covers underlying EDA tool algorithms, flows, criteria for assessing project status, and key tradeoffs and interdependencies. This fresh and accessible tutorial will be valuable to all VLSI system designers, senior undergraduate or graduate students of microelectronics design, and companies offering internal courses for engineers at all levels. Reflect complexity, cost, resources, and schedules in planning a chip design project Perform hierarchical design decomposition, floorplanning, and physical integration, addressing DFT, DFM, and DFY requirements Model functionality and behavior, validate designs, and verify formal equivalency Apply EDA tools for logic synthesis, placement, and routing Analyze timing, noise, power, and electrical issues Prepare for manufacturing release and bring-up, from mastering ECOs to qualification This guide is for all VLSI system designers, senior undergraduate or graduate students of microelectronics design, and companies offering internal courses for engineers at all levels. It is applicable to engineering teams undertaking new projects and migrating existing designs to new technologies.
Author : Alfred Kwok-Kit Wong
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 628 pages
Book Rating : 4.3/5 (91 download)
Download or read book Design for Manufacturability Through Design-process Integration written by Alfred Kwok-Kit Wong and published by SPIE-International Society for Optical Engineering. This book was released on 2007 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : Philip Garrou
Publisher : John Wiley & Sons
ISBN 13 : 3527670122
Total Pages : 484 pages
Book Rating : 4.5/5 (276 download)
Download or read book Handbook of 3D Integration, Volume 3 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2014-04-22 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Author : Kenneth W. Tobin
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 240 pages
Book Rating : 4.3/5 (91 download)
Download or read book Process and Materials Characterization and Diagnostics in IC Manufacturing written by Kenneth W. Tobin and published by SPIE-International Society for Optical Engineering. This book was released on 2003 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Alexander Starikov
Publisher : Society of Photo Optical
ISBN 13 : 9780819448477
Total Pages : 418 pages
Book Rating : 4.4/5 (484 download)
Download or read book Design and Process Integration for Microelectronic Manufacturing II written by Alexander Starikov and published by Society of Photo Optical. This book was released on 2003 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:
