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Design Fundamentals Of High Temperature Composites Intermetallics And Metal Ceramics Systems
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Book Synopsis Design Fundamentals of High Temperature Composites, Intermetallics, and Metal-ceramics Systems by : Ray Y. Lin
Download or read book Design Fundamentals of High Temperature Composites, Intermetallics, and Metal-ceramics Systems written by Ray Y. Lin and published by Minerals, Metals, & Materials Society. This book was released on 1996 with total page 474 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focusing on the physico-chemical fundamentals of advanced material processing, this volume addresses composite interface stability, modeling of interfacial reactions, defects in intermetallic compounds, thermodynamics and kinetics of interfacial reactions, solidification and phase equilibria, fundamentals of high-temperature materials joining, and the relationship between chemical and mechanical stabilities. This is the first time that, collectively, both thermodynamic and kinetic issues are addressed for metal and ceramic composites as well as intermetallics.
Book Synopsis Handbook of Wafer Bonding by : Peter Ramm
Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2011-11-17 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Book Synopsis Intermetallic Compounds by : Mahmood Aliofkhazraei
Download or read book Intermetallic Compounds written by Mahmood Aliofkhazraei and published by BoD – Books on Demand. This book was released on 2018-05-30 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intermetallic compounds are usually brittle with high melting points. Their properties are often found among ceramic and metallic materials. In most cases, their hot corrosion resistance and simultaneously hardness are important. One of the main applications of intermetallic compounds is for superalloy turbine blades in which they show appropriate high-temperature-related properties. This book collects new developments about intermetallic compounds and their recent usages.
Book Synopsis International Aerospace Abstracts by :
Download or read book International Aerospace Abstracts written by and published by . This book was released on 1997 with total page 654 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Environmental Effects on Engineered Materials by : Russell H. Jones
Download or read book Environmental Effects on Engineered Materials written by Russell H. Jones and published by CRC Press. This book was released on 2001-03-29 with total page 499 pages. Available in PDF, EPUB and Kindle. Book excerpt: This invaluable reference provides a comprehensive overview of corrosion and environmental effects on metals, intermetallics, glossy metals, ceramics and composites of metals, and ceramics and polymer materials. It surveys numerous options for various applications involving environments and guidance in materials selection and substitution. Exploring a wide range of environments, including aqueous and high-temperature surroundings, Environmental Effects on Engineered Materials examines specific material-environmental interactions; corrosion rates and material limitations; preventive measurements against corrosion; utilization of older materials in recent applications; the use of new materials for existing equipment; and more.
Book Synopsis Industrial Applications Of Electron Microscopy by : Zhigang Li
Download or read book Industrial Applications Of Electron Microscopy written by Zhigang Li and published by CRC Press. This book was released on 2002-12-04 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing proven strategies for solutions to research, development, and production dilemmas, this reference details the instrumentation and underlying principles for utilization of electron microscopy in the manufacturing, automotive, semiconductor, photographic film, pharmaceutical, chemical, mineral, forensic, glass, and pulp and paper industries
Book Synopsis Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele by : C. Colinge
Download or read book Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele written by C. Colinge and published by The Electrochemical Society. This book was released on 2010-10 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2004-05-14 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Download or read book 国立国会図書館所蔵科学技術関係欧文会議錄目錄 written by and published by . This book was released on 1997 with total page 1594 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Kokuritsu Kokkai Toshokan shozō kagaku gijutsu kankei Ōbun kaigiroku mokuroku by : Kokuritsu Kokkai Toshokan (Japan)
Download or read book Kokuritsu Kokkai Toshokan shozō kagaku gijutsu kankei Ōbun kaigiroku mokuroku written by Kokuritsu Kokkai Toshokan (Japan) and published by . This book was released on 1997 with total page 1596 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings in Print written by and published by . This book was released on 1996 with total page 614 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Processing and Design Issues in High Temperature Materials by : N. S. Stoloff
Download or read book Processing and Design Issues in High Temperature Materials written by N. S. Stoloff and published by Tms. This book was released on 1996 with total page 445 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the proceedings of the Engineering Foundation Conference on Processing and Design Issues in High Temperature Materials held in Davos, Switzerland, May 19-24, 1996. The conference addressed current concerns of developers and users of high temperature materials, including superalloys, ceramics, intermetallics, and composites. Discussion areas include alloy design principles; microstructures and mechanical properties of potentially competitive materials such as ceramics and intermetallics, as well as their composites; environmental effects on mechanical properties; and other environmental issues such as oxidation.
Book Synopsis Index of Conference Proceedings by : British Library. Document Supply Centre
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 1997 with total page 938 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis High-temperature Structural Materials by : Robert Cahn
Download or read book High-temperature Structural Materials written by Robert Cahn and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Conventional materials, such as nickel based alloys, will not be able to match the required performance specifications for the future generation of high temperature materials. This book reviews the characteristics and potential of a wide range of candidate superalloy replacements, such as ceramics, intermetallics, and their composites. Particular attention is devoted to the problems of processing and design with these materials.
Book Synopsis High-Temperature Ordered Intermetallic Alloys VII: Volume 460 by : C. C. Koch
Download or read book High-Temperature Ordered Intermetallic Alloys VII: Volume 460 written by C. C. Koch and published by . This book was released on 1997-07-30 with total page 818 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book focuses specifically on processing and microstructural control, alloy design, mechanical properties and industrial applications. Examples of structural applications of the 'mature' intermetallics, TiAl and Ni3Al are also featured.
Book Synopsis Encyclopedia of Materials by : K. H. J. Buschow
Download or read book Encyclopedia of Materials written by K. H. J. Buschow and published by . This book was released on 2001 with total page 1160 pages. Available in PDF, EPUB and Kindle. Book excerpt: Accompanyind CR-ROM conrtains The Encyclopedia of Materials Science and Technology on a web access disc.
Book Synopsis The Effects of Ternary Alloying on the Defect Structure and Mechanical Properties of B2 Compounds by : Lee M. Pike
Download or read book The Effects of Ternary Alloying on the Defect Structure and Mechanical Properties of B2 Compounds written by Lee M. Pike and published by . This book was released on 1997 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt:
