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Author : Alfred K. K. Wong
Publisher :
ISBN 13 : 9780819461995
Total Pages : pages
Book Rating : 4.4/5 (619 download)
Download or read book Design and Process Integration for Microelectronic Manufacturing 4 written by Alfred K. K. Wong and published by . This book was released on 2006-02-15 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Alfred Kwok-Kit Wong
Publisher : Society of Photo Optical
ISBN 13 : 9780819461995
Total Pages : 526 pages
Book Rating : 4.4/5 (619 download)
Download or read book Design and Process Integration for Microelectronic Manufacturing IV written by Alfred Kwok-Kit Wong and published by Society of Photo Optical. This book was released on 2006 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Author :
Publisher :
ISBN 13 :
Total Pages : 634 pages
Book Rating : 4.3/5 (91 download)
Download or read book Design and Process Integration for Microelectronic Manufacturing written by and published by . This book was released on 2006 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Alexander Starikov
Publisher : Society of Photo Optical
ISBN 13 : 9780819448477
Total Pages : 418 pages
Book Rating : 4.4/5 (484 download)
Download or read book Design and Process Integration for Microelectronic Manufacturing II written by Alexander Starikov and published by Society of Photo Optical. This book was released on 2003 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:
![Download Design and Process Integration for Microelectronic Manufacturing II [sic] PDF Online Free](https://books.google.com/books/content/images/frontcover/iPZRAQAAIAAJ?fife=w200-h370)
Author : Lars W. Liebmann
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 336 pages
Book Rating : 4.F/5 ( download)
Download or read book Design and Process Integration for Microelectronic Manufacturing II [sic] written by Lars W. Liebmann and published by SPIE-International Society for Optical Engineering. This book was released on 2004 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : Eitan N. Shauly
Publisher : CRC Press
ISBN 13 : 1000631354
Total Pages : 831 pages
Book Rating : 4.0/5 (6 download)
Download or read book Design Rules in a Semiconductor Foundry written by Eitan N. Shauly and published by CRC Press. This book was released on 2022-11-30 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Author : Klaus D. Sattler
Publisher : CRC Press
ISBN 13 : 1420075519
Total Pages : 782 pages
Book Rating : 4.4/5 (2 download)
Download or read book Handbook of Nanophysics written by Klaus D. Sattler and published by CRC Press. This book was released on 2010-09-17 with total page 782 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many bottom-up and top-down techniques for nanomaterial and nanostructure generation have enabled the development of applications in nanoelectronics and nanophotonics. Handbook of Nanophysics: Nanoelectronics and Nanophotonics explores important recent applications of nanophysics in the areas of electronics and photonics. Each peer-reviewed c
Author : Artur Balasinski
Publisher : CRC Press
ISBN 13 : 1351833995
Total Pages : 250 pages
Book Rating : 4.3/5 (518 download)
Download or read book Semiconductors written by Artur Balasinski and published by CRC Press. This book was released on 2018-09-03 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples. Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and researchers defining product architecture and research programs.
Author : Alfred Kwok-Kit Wong
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 628 pages
Book Rating : 4.3/5 (91 download)
Download or read book Design for Manufacturability Through Design-process Integration written by Alfred Kwok-Kit Wong and published by SPIE-International Society for Optical Engineering. This book was released on 2007 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : Michael L. Rieger
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 : 9780819480552
Total Pages : 358 pages
Book Rating : 4.4/5 (85 download)
Download or read book Design for Manufacturability Through Design-process Integration IV written by Michael L. Rieger and published by SPIE-International Society for Optical Engineering. This book was released on 2010 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : Alexander Starikov
Publisher : Society of Photo Optical
ISBN 13 : 9780819444394
Total Pages : 628 pages
Book Rating : 4.4/5 (443 download)
Download or read book Design, Process Integration, and Characterization for Microelectronics written by Alexander Starikov and published by Society of Photo Optical. This book was released on 2002 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : W. Dale Compton
Publisher : National Academies Press
ISBN 13 : 0309038448
Total Pages : 248 pages
Book Rating : 4.3/5 (9 download)
Download or read book Design and Analysis of Integrated Manufacturing Systems written by W. Dale Compton and published by National Academies Press. This book was released on 1988-02-01 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design and Analysis of Integrated Manufacturing Systems is a fresh look at manufacturing from a systems point of view. This collection of papers from a symposium sponsored by the National Academy of Engineering explores the need for new technologies, the more effective use of new tools of analysis, and the improved integration of all elements of manufacturing operations, including machines, information, and humans. It is one of the few volumes to include detailed proposals for research that match the needs of industry.
Author : Henry G. Hughes
Publisher : The Electrochemical Society
ISBN 13 : 9781566772068
Total Pages : 286 pages
Book Rating : 4.7/5 (72 download)
Download or read book Proceedings of the Symposium on Microstructures and Microfabricated Systems IV written by Henry G. Hughes and published by The Electrochemical Society. This book was released on 1998 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 1206 pages
Book Rating : 4.3/5 (91 download)
Download or read book American Book Publishing Record written by and published by . This book was released on 2006 with total page 1206 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 : 0071785159
Total Pages : 513 pages
Book Rating : 4.0/5 (717 download)
Download or read book Through-Silicon Vias for 3D Integration written by John H. Lau and published by McGraw Hill Professional. This book was released on 2012-08-05 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging
Author : Artur Balasinski
Publisher : CRC Press
ISBN 13 : 9781138075412
Total Pages : 248 pages
Book Rating : 4.0/5 (754 download)
Download or read book Semiconductors written by Artur Balasinski and published by CRC Press. This book was released on 2017-10-12 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That�s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples. Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and researchers defining product architecture and research programs.
Author : National Research Council
Publisher : National Academies Press
ISBN 13 : 0309176670
Total Pages : 228 pages
Book Rating : 4.3/5 (91 download)
Download or read book Unit Manufacturing Processes written by National Research Council and published by National Academies Press. This book was released on 1995-01-03 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Manufacturing, reduced to its simplest form, involves the sequencing of product forms through a number of different processes. Each individual step, known as an unit manufacturing process, can be viewed as the fundamental building block of a nation's manufacturing capability. A committee of the National Research Council has prepared a report to help define national priorities for research in unit processes. It contains an organizing framework for unit process families, criteria for determining the criticality of a process or manufacturing technology, examples of research opportunities, and a prioritized list of enabling technologies that can lead to the manufacture of products of superior quality at competitive costs. The study was performed under the sponsorship of the National Science Foundation and the Defense Department's Manufacturing Technology Program.
