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Author :
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.3/5 (53 download)
Download or read book 2023 IEEE International Conference on Integrated Circuits and Communication Systems (ICICACS). written by and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 : 9781538635063
Total Pages : pages
Book Rating : 4.6/5 (35 download)
Download or read book 2017 2nd International Conference on Integrated Circuits and Microsystems written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : R. Bryant
Publisher : Springer Science & Business Media
ISBN 13 : 3642954324
Total Pages : 435 pages
Book Rating : 4.6/5 (429 download)
Download or read book Third Caltech Conference on Very Large Scale Integration written by R. Bryant and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers in this book were presented at the Third Caltech Conference on Very Large Scale Integration, held March 21-23, 1983 in Pasadena, California. The conference was organized by the Computer Science Depart ment, California Institute of Technology, and was partly supported by the Caltech Silicon Structures Project. This conference focused on the role of systematic methodologies, theoretical models, and algorithms in all phases of the design, verification, and testing of very large scale integrated circuits. The need for such disciplines has arisen as a result of the rapid progress of integrated circuit technology over the past 10 years. This progress has been driven largely by the fabrica tion technology, providing the capability to manufacture very complex elec tronic systems reliably and at low cost. At this point the capability to manufac ture very large scale integrated circuits has exceeded our capability to develop new product designs quickly, reliably, and at a reasonable cost. As a result new designs are undertaken only if the production volume will be large enough to amortize high design costs, products first appear on the market well past their announced delivery date, and reference manuals must be amended to document design flaws. Recent research in universities and in private industry has created an emerg ing science of very large scale integration.
Author : Xiuying Wang
Publisher : World Scientific Publishing Company
ISBN 13 :
Total Pages : 880 pages
Book Rating : 4.3/5 (91 download)
Download or read book The Proceedings of the International Conference on Semiconductor and Integrated Circuit Technology written by Xiuying Wang and published by World Scientific Publishing Company. This book was released on 1986 with total page 880 pages. Available in PDF, EPUB and Kindle. Book excerpt: Patterning technology; Selective doping techniques; Materials; Rapid thermal annealing; Thin film technology; Amorphous silicon; Superconductor electronics; Advanced device technology; MOS and bipolar technology; Circuit design; Silicon on insulator technologies; Yield/reliability; Process characterization; Materials characterization; Fab operations.
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Publisher :
ISBN 13 : 9781728151328
Total Pages : pages
Book Rating : 4.1/5 (513 download)
Download or read book 2019 the 4th International Conference on Integrated Circuits and Microsystems written by and published by . This book was released on 2019 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 : 9781538635049
Total Pages : pages
Book Rating : 4.6/5 (35 download)
Download or read book 2017 2nd International Conference on Integrated Circuits and Microsystems written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Antonio Petraglia
Publisher :
ISBN 13 : 9781595938169
Total Pages : 0 pages
Book Rating : 4.9/5 (381 download)
Download or read book Proceedings of the 20th Annual Conference on Integrated Circuits and Systems Design written by Antonio Petraglia and published by . This book was released on 2007 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 : 9781538683118
Total Pages : pages
Book Rating : 4.6/5 (831 download)
Download or read book ICICM 2018 written by and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Staff
Publisher :
ISBN 13 : 9781538693964
Total Pages : pages
Book Rating : 4.6/5 (939 download)
Download or read book 2019 IEEE Custom Integrated Circuits Conference (CICC) written by IEEE Staff and published by . This book was released on 2019-04-14 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Conference with technical sessions, educational sessions, panel discussions and forums
Author : Xuan-Tu Tran
Publisher :
ISBN 13 : 9781538633779
Total Pages : pages
Book Rating : 4.6/5 (337 download)
Download or read book Proceedings of 2017 7th International Conference on Integrated Circuits, Design, and Verification written by Xuan-Tu Tran and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Rohit Sharma
Publisher : CRC Press
ISBN 13 : 1351831593
Total Pages : 328 pages
Book Rating : 4.3/5 (518 download)
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Author : Sorin Voinigescu
Publisher : Cambridge University Press
ISBN 13 : 0521873029
Total Pages : 921 pages
Book Rating : 4.5/5 (218 download)
Download or read book High-Frequency Integrated Circuits written by Sorin Voinigescu and published by Cambridge University Press. This book was released on 2013-02-28 with total page 921 pages. Available in PDF, EPUB and Kindle. Book excerpt: A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave, and optical fibre circuits using nanoscale CMOS, SiGe BiCMOS, and III-V technologies. Step-by-step design methodologies, end-of chapter problems, and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.
Download or read book 2017 IEEE Custom Integrated Circuits Conference (CICC) written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Staff
Publisher :
ISBN 13 : 9781538683125
Total Pages : pages
Book Rating : 4.6/5 (831 download)
Download or read book 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) written by IEEE Staff and published by . This book was released on 2018-11-24 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ICICM International Conference on Integrated Circuits and Microsystems is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems This conference provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration The previous 2 editions ICICM were sponsored by IEEE and it has been successfully held in Chengdu on November 23 25, 2016 and Nanjing on November 8 11, 2017 The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018) will be held on November 24 26, 2018 in Shanghai, China with the support from University of Electronic Science and Technology of China and Southeast University, China
Author : Vasilis F. Pavlidis
Publisher : Newnes
ISBN 13 : 0124104843
Total Pages : 768 pages
Book Rating : 4.1/5 (241 download)
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author : Aida Todri-Sanial
Publisher : CRC Press
ISBN 13 : 1351830198
Total Pages : 529 pages
Book Rating : 4.3/5 (518 download)
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 529 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author : IEEE Staff
Publisher :
ISBN 13 : 9781509051922
Total Pages : pages
Book Rating : 4.0/5 (519 download)
Download or read book 2017 IEEE Custom Integrated Circuits Conference (CICC) written by IEEE Staff and published by . This book was released on 2017-04-30 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEEE Custom Integrated Circuits Conference (CICC) is the premier conference devoted to IC development CICC emphasizes the education of experienced engineers as well as students while showcasing original, first published innovative analog and digital circuit techniques covering a broad spectrum of technical topics It is a forum for circuit, IC and SoC designers, CAD developers, manufacturers and ASIC users CICC is the conference to find out how to solve design problems and improve circuit design and chip design techniques
