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Author : Johan Liu
Publisher :
ISBN 13 : 9780901150370
Total Pages : 432 pages
Book Rating : 4.1/5 (53 download)
Download or read book Conductive Adhesives for Electronics Packaging written by Johan Liu and published by . This book was released on 1999 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yi (Grace) Li
Publisher : Springer Science & Business Media
ISBN 13 : 0387887830
Total Pages : 445 pages
Book Rating : 4.3/5 (878 download)
Download or read book Electrical Conductive Adhesives with Nanotechnologies written by Yi (Grace) Li and published by Springer Science & Business Media. This book was released on 2009-10-08 with total page 445 pages. Available in PDF, EPUB and Kindle. Book excerpt: “Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author : Rajesh Gomatam
Publisher : BRILL
ISBN 13 : 9004165924
Total Pages : 434 pages
Book Rating : 4.0/5 (41 download)
Download or read book Electrically Conductive Adhesives written by Rajesh Gomatam and published by BRILL. This book was released on 2008-12-23 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Author : M O Alam
Publisher : Elsevier
ISBN 13 : 0857092898
Total Pages : 279 pages
Book Rating : 4.8/5 (57 download)
Download or read book Advanced Adhesives in Electronics written by M O Alam and published by Elsevier. This book was released on 2011-05-25 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Author : Rongwei Zhang
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (757 download)
Download or read book Novel Conductive Adhesives for Electronic Packaging Applications written by Rongwei Zhang and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Isotropically conductive adhesives (ICAs) are promising as a lead-free interconnect material; However, ICAs have a higher resistivity compared to tin/lead solder. The higher resistivity of ICAs results from the large contact resistance between conductive fillers. Several novel approaches to engineer the interface between electrically conductive fillers were studied to develop highly conductive ICAs. Shown in this dissertation are three methodologies to reduce contact resistance: low temperature sintering, fast sintering and in-situ reduction. Furthermore, two approaches, surface modification and in-situ protection, were developed to prevent oxidation and corrosion of silver-coated copper flakes to produce low cost ICAs. The findings and insights in this dissertation significantly contribute to (1) understanding of filler-filler, filler-polymer and structure-property relationships of ICAs; (2) the structural design and formulation of high performance ICAs; and (3) the wider use of ICAs in emerging applications such as printed electronics and solar cells.
Download or read book 3rd International Seminar on Conductive Adhesives in Electronics Packaging written by and published by . This book was released on 1995 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ephraim Suhir
Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)
Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author : James J. Licari
Publisher : William Andrew
ISBN 13 : 1437778909
Total Pages : 415 pages
Book Rating : 4.4/5 (377 download)
Download or read book Adhesives Technology for Electronic Applications written by James J. Licari and published by William Andrew. This book was released on 2011-06-24 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.512 pages Approx.512 pages
Author : John Lau
Publisher : McGraw Hill Professional
ISBN 13 : 9780071386241
Total Pages : 718 pages
Book Rating : 4.3/5 (862 download)
Download or read book Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials written by John Lau and published by McGraw Hill Professional. This book was released on 2002-08-23 with total page 718 pages. Available in PDF, EPUB and Kindle. Book excerpt: An engineer's guidebook demonstrating non-toxic electronics manufacturing processes
Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 :
Total Pages : 680 pages
Book Rating : 4.3/5 (91 download)
Download or read book Electronics Manufacturing written by John H. Lau and published by McGraw Hill Professional. This book was released on 2003 with total page 680 pages. Available in PDF, EPUB and Kindle. Book excerpt: An engineer's guidebook demonstrating non-toxic electronics manufacturing processes
Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 1351835548
Total Pages : 937 pages
Book Rating : 4.3/5 (518 download)
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 937 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Yi Li
Publisher :
ISBN 13 :
Total Pages : 36 pages
Book Rating : 4.:/5 (179 download)
Download or read book Recent Advances of Conductive Adhesives as a Lead-free Alternative in Electronic Packaging written by Yi Li and published by . This book was released on 2006 with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : C.P. Wong
Publisher : Springer Science & Business Media
ISBN 13 : 1441900403
Total Pages : 761 pages
Book Rating : 4.4/5 (419 download)
Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C.P. Wong and published by Springer Science & Business Media. This book was released on 2009-12-23 with total page 761 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author : K. L. Mittal
Publisher : John Wiley & Sons
ISBN 13 : 1118831349
Total Pages : 293 pages
Book Rating : 4.1/5 (188 download)
Download or read book Adhesion in Microelectronics written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2014-08-25 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Author : Rajesh R. Gomatam
Publisher :
ISBN 13 :
Total Pages : 798 pages
Book Rating : 4.:/5 (97 download)
Download or read book Modeling Fatigue Behavior of Silver Filled Electronically Conductive Adhesives written by Rajesh R. Gomatam and published by . This book was released on 2002 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronically conductive adhesives (ECA) have been used for electronics packaging applications. Today, this technology is currently being used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions. and in various other electronic equipments [1]. ECAs are used mainly for two purposes in electronic packaging. They are either used to bond, and electrically connect two different conducting substrates such as a piezoelectric device to steel substrates, or as an undertill in flip-chip on board applications (FCOB) in surface mount applications [2, 3]. The durability of any adhesive joint is influenced by the properties of adhesive/tiller type, adherend/substrate, and also the environmental conditions the joints are subjected to. Also, apart from the above-mentioned parameters, the presence of stresses in the form of residual stresses, or stresses developed during thermal cycling has a profound influence on the joint efficiency and its durability. In electronic devices, cyclic stress manifests itself through the thermal mismatch between the chip and the substrate, which in turn limits the lifetime of the joint [4, 5, 6, 7]. One of the major questions that need to be addressed is the estimation and prediction of the real service life of conductive adhesive joints. Exposing the adhesive to the major stresses and determining how these stresses affect its service life can answer this question. In order to conduct service life evaluations. samples must be prepared, exposed to environment stresses for extended lengths of time, and then tested. This dissertation is focused in addressing these critical issues mentioned above, and related to ECAs in electronic packaging. In this study, we intend to investigate the interactions between adhesive-filler, adherend surface, and environmental conditions in both static and dynamic fatigue conditions, using a wide array of experiments, to elucidate these effects, and their interrelations. Finally, we intend to develop a comprehensive life predictive model for design engineers using ECAs for electronic packaging, incorporating the properties of adhesive, adherend, and environmental conditions such as temperature, humidity, and different stress states.
Download or read book Electrical and Mechanical Characterization of MWNT Filled Conductive Adhesive for Electronics Packaging written by and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
