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Computer Aided Design In Electronic Packaging
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Book Synopsis Computer Aided Design in Electronic Packaging by : American Society of Mechanical Engineers. Winter Annual Meeting
Download or read book Computer Aided Design in Electronic Packaging written by American Society of Mechanical Engineers. Winter Annual Meeting and published by . This book was released on 1992 with total page 100 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronics Computer Aided Design by : Phil L. Jones
Download or read book Electronics Computer Aided Design written by Phil L. Jones and published by Manchester University Press. This book was released on 1989 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Development of a Knowledge Model for the Computer-aided Design for Reliability of Electronic Packaging Systems by : Injoong Kim
Download or read book Development of a Knowledge Model for the Computer-aided Design for Reliability of Electronic Packaging Systems written by Injoong Kim and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic systems such as cell phones, computers, consumer electronics, and implantable medical devices consist of subsystems which in turn consist of other subsystems and components. When such systems are designed, fabricated, assembled, and tested, they need to meet reliability, cost, performance, and other targets for being competitive. The design of reliable electronic packaging systems in a systematic and timely manner requires a consistent and unified method for allocating, predicting, and assessing reliability and for recommending design changes at the component and system level with consideration of both random and wearout failures. Accordingly, this dissertation presents a new unified knowledge modeling method for System Design for Reliability (SDfR) called the Reliability Object Model (ROM) method. The ROM method consistently addresses both reliability allocation and assessment for systems composed of series and parallel subsystems. The effectiveness of the ROM method has been demonstrated for allocating, predicting, and assessing reliability, and the results show that ROM is more effective compared to existing methods, providing richer semantics, unified techniques, and improved SDfR quality. Furthermore, this dissertation develops representative reliability metrics for random and wearout failures, and incorporates such metrics into ROM together with representative algorithms for allocation, assessment, and design change recommendations. Finally, this research implemented the ROM method in a computing framework and demonstrated its applicability using several relevant microelectronic system test cases and prototype SDfR tools.
Book Synopsis CAE/CAD Application to Electronic Packaging by : D. Agonafer
Download or read book CAE/CAD Application to Electronic Packaging written by D. Agonafer and published by . This book was released on 1994 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Computer-aided Design by : Raphael Kaplinsky
Download or read book Computer-aided Design written by Raphael Kaplinsky and published by . This book was released on 1982 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :Computer-Aided Life-Cycle Engineering Electronic Packaging Research Center Publisher : ISBN 13 : Total Pages : pages Book Rating :4.:/5 (454 download)
Book Synopsis Computer-Aided Life-Cycle Engineering Electronic Packaging Research Center Publications by : Computer-Aided Life-Cycle Engineering Electronic Packaging Research Center
Download or read book Computer-Aided Life-Cycle Engineering Electronic Packaging Research Center Publications written by Computer-Aided Life-Cycle Engineering Electronic Packaging Research Center and published by . This book was released on 1988 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Publications issued by the Computer-Aided Life-Cycle Engineering Electronic Packaging Research Center including reports and news releases.
Book Synopsis Application of CAE/CAD to Electronic Systems by : D. Agonafer
Download or read book Application of CAE/CAD to Electronic Systems written by D. Agonafer and published by . This book was released on 1996 with total page 136 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the November 1996 symposium sponsored by the Computer Aided Design for Electronic Packaging Committee of the Electrical and Electronic Packaging Division. Contains 15 papers, including several related to the use of computer simulations to solve complex packaging problems related to th
Book Synopsis Handbook of Electronic Package Design by : Michael Pecht
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 910 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Book Synopsis Printed Circuits Design by : Gerald L. Ginsberg
Download or read book Printed Circuits Design written by Gerald L. Ginsberg and published by McGraw-Hill Companies. This book was released on 1991 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: This exceptional, all-inclusive design manual covers-in unequalled detail-all aspects of printed circuits & their applications, including how to design printed circuit boards for efficient, cost-effective manufacturing & how to design boards that incorporate surface-mounted components. Indispensable for all electronics engineers, this valuable working reference includes: basic considerations-background, overview, specification & standards, terms, & definitions; interconnecting structure selection-single-sided rigid printed wiring boards, double-sided rigid printed wiring boards, multilayer rigid printed wiring boards, flexible printed wiring boards, rigid/flexible printed wiring boards, molded printed wiring boards, & supported plane structures; material selection-base laminates, reinforcements, conductors, platings & coatings, supporting planes, & constraining cores; component selection-discrete components, integrated circuits, interconnect components, electromechanical components, & hardware; performance co
Book Synopsis Computer Aided Design of Printed Circuits by : Charles J. Simon
Download or read book Computer Aided Design of Printed Circuits written by Charles J. Simon and published by . This book was released on 1987 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook Of Electronics Packaging Design and Engineering by : Bernard S. Matisoff
Download or read book Handbook Of Electronics Packaging Design and Engineering written by Bernard S. Matisoff and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: • Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. • Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. • Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.
Book Synopsis Manufacturing Challenges in Electronic Packaging by : Y.C. Lee
Download or read book Manufacturing Challenges in Electronic Packaging written by Y.C. Lee and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Book Synopsis Investigations in Computer-aided Design for Numerically Controlled Production by : John Erwin Ward
Download or read book Investigations in Computer-aided Design for Numerically Controlled Production written by John Erwin Ward and published by . This book was released on 1969 with total page 42 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Book Synopsis High Performance Design Automation For Multi-chip Modules And Packages by : Jun Dong Cho
Download or read book High Performance Design Automation For Multi-chip Modules And Packages written by Jun Dong Cho and published by World Scientific. This book was released on 1996-06-12 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Book Synopsis A System for Computer-aided Design of Printed Circuit Boards by : T. Pietsch
Download or read book A System for Computer-aided Design of Printed Circuit Boards written by T. Pietsch and published by . This book was released on 1986 with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt: A general purpose system for interactive computer-aided design of printed circuit boards is described. Included boards is described. Included are details for encoding a circuit diagram in the computer, the placement of electronic component packages, the determination of a link/wire list and the routing of this list to obtain a wire layout. Design documentation in the form of component schedules and layout drawings are produced so that artwork can be generated on a Gerber drafting machine. A feature of the system is the method by which the routers find different size wire-paths on successive grids of increasing resolution. The use of this method approximately halves the routing time and increases the link connection rate by over 15%.
Book Synopsis Electronic Product Design for Automated Manufacturing by : Richard Stillwell
Download or read book Electronic Product Design for Automated Manufacturing written by Richard Stillwell and published by Routledge. This book was released on 2018-02-06 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analyzes all phases of the electronic product design process, including management, planning, quality control, design, manufacturing, and automation. A reference/textbook for students and professionals in such fields as electronics, manufacturing, circuit design, computer science. Annotation copyrig
