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Company Profiles Chipsip Technology Co Ltd
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Download or read book Fabless written by Daniel Nenni and published by Createspace Independent Publishing Platform. This book was released on 2014 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this book is to illustrate the magnificence of the fabless semiconductor ecosystem, and to give credit where credit is due. We trace the history of the semiconductor industry from both a technical and business perspective. We argue that the development of the fabless business model was a key enabler of the growth in semiconductors since the mid-1980s. Because business models, as much as the technology, are what keep us thrilled with new gadgets year after year, we focus on the evolution of the electronics business. We also invited key players in the industry to contribute chapters. These "In Their Own Words" chapters allow the heavyweights of the industry to tell their corporate history for themselves, focusing on the industry developments (both in technology and business models) that made them successful, and how they in turn drive the further evolution of the semiconductor industry.
Book Synopsis 3D Flash Memories by : Rino Micheloni
Download or read book 3D Flash Memories written by Rino Micheloni and published by Springer. This book was released on 2016-05-26 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.
Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Book Synopsis Foldable Flex and Thinned Silicon Multichip Packaging Technology by : John W. Balde
Download or read book Foldable Flex and Thinned Silicon Multichip Packaging Technology written by John W. Balde and published by Springer Science & Business Media. This book was released on 2003-01-31 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This book is organized to report on the developments in this technology, but with special additional material and emphasis. The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors, all leaders in this technical field, explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications. It is an advocacy book in this respect - advocacy for the use of a technology that is already mature, and advocacy for exploring ways to make it even more capable for the future. It will also do more than discuss the present; it will point out the deficiencies of the constructions, the needed availability of good flex material, the use of newer flex materials, such as LCP, and the implications from the use of the Integrated Mesh Power Systems to enhance the capability for future designs. Lastly it will discuss the serious problem of heat removal if multiple microprocessors are included.
Book Synopsis Semiconductor Advanced Packaging by : John H. Lau
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Book Synopsis Dulling the Cutting Edge: How Patent-Related Policies and Practices Hamper Innovation in China by : Dan Prud‘homme
Download or read book Dulling the Cutting Edge: How Patent-Related Policies and Practices Hamper Innovation in China written by Dan Prud‘homme and published by European Chamber. This book was released on 2012-08-22 with total page 235 pages. Available in PDF, EPUB and Kindle. Book excerpt: This study’s statistical analysis shows that patent quality and innovation in China deserve improvement, and an in-depth legal, management science, and economic analysis in the study shows that various patent-related policies and practices actually hamper patent quality and innovation in China. Over 50 recommendations for reform are provided. The study is divided into four chapters, summaries of which are as follows: Although China became the world leader in quantity of domestically filed patent applications in 2011, the quality of these patents needs improvement. Also, while certain innovation in China is rising, the country’s actual innovation appears over-hyped by some sources. There appears to be an overly heavy focus on government-set quantitative patent targets in China, which can hamper patent quality and innovation. This overemphasis involves over 10 national-level and over 150 municipal/provincial quantitative patent targets, mostly to be met by 2015, which are also linked to performance evaluations for SoEs, Party officials and government ministries, universities and research institutes, and other entities. China has a wide-range of other policies, many of which are at least partially meant to encourage patents, that can actually discourage quality patents, and highest-quality patents in particular, and innovation. Examples of these policies include a variety of measures with requirements for “indigenous intellectual property rights” that are linked to financial incentives (many of which are unrelated to government procurement); a range of other government-provided financial incentives for patent development (e.g. certain patent filing subsidies); inappropriate inventor remuneration rules; discriminatory standardization approaches; and a wide range of others. There are a host of concerns surrounding rules and procedures for patent application review and those for enforcement of patent disputes that can hamper building of quality patents and innovation in China. These include concerns about abuse of patent rights, difficulties invalidating utility models, and a wide range of other issues.
Book Synopsis Heterogeneous Integrations by : John H. Lau
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Download or read book Augmented Reality written by Jon Peddie and published by Springer. This book was released on 2017-04-19 with total page 349 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an in-depth exploration of the field of augmented reality (AR) in its entirety and sets out to distinguish AR from other inter-related technologies like virtual reality (VR) and mixed reality (MR). The author presents AR from its initial philosophies and early developments, to its current technologies and its impact on our modern society, to its possible future developments; providing readers with the tools to understand issues relating to defining, building, and using our perception of what is represented in our perceived reality, and ultimately how we assimilate and react to this information. Augmented Reality: Where We Will All Live can be used as a comprehensive guide to the field of AR and provides valuable insights for technologists, marketers, business managers, educators and academics who are interested in the field of augmented reality; its concepts, history, practices and the science behind this rapidly advancing field of research and development.
Book Synopsis Fan-Out Wafer-Level Packaging by : John H. Lau
Download or read book Fan-Out Wafer-Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
Book Synopsis Micro and Smart Systems by : G. K. Ananthasuresh
Download or read book Micro and Smart Systems written by G. K. Ananthasuresh and published by Wiley Global Education. This book was released on 2012-04-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microsystems are systems that integrate, on a chip or a package, one or more of many different categories of microdevices. As the past few decades were dominated by the development and rapid miniaturization of circuitry, the current and coming decades are witnessing a similar revolution in the miniaturization of sensors, actuators, and electronics; and communication, control and power devices. Applications ranging from biomedicine to warfare are driving rapid innovation and growth in the field, which is pushing this topic into graduate and undergraduate curricula in electrical, mechanical, and biomedical engineering.
Book Synopsis Multiactivity in Social Interaction by : Pentti Haddington
Download or read book Multiactivity in Social Interaction written by Pentti Haddington and published by John Benjamins Publishing Company. This book was released on 2014-09-15 with total page 299 pages. Available in PDF, EPUB and Kindle. Book excerpt: Doing more than one thing at the same time – a phenomenon that is often called ‘multitasking’ – is characteristic to many situations in everyday and professional life. Although we all experience it, its real time features remain understudied. Multiactivity in Social Interaction: Beyond multitasking offers a fresh view to the phenomenon by presenting studies that explore how two or more activities can be related and made co-relevant as people interact with one another. The studies build on the basis that multiactivity is a social, verbal and embodied phenomenon. They investigate multiactivity by using video recordings of real-life interactions from a range of different contexts, such as medical settings, office workplaces and car driving. With the companion collection Interacting with Objects: Language, materiality, and social activity, the book advances understanding of the complex organisation and accomplishment of social interaction, especially the significance of embodiment, materiality, participation and temporality. A close appreciation of how people use language and interact for and during multiactivity will not only interest researchers in language and social interaction, communication studies and discourse analysis, but will be very valuable for scholars in cognitive sciences, psychology and sociology.
Book Synopsis Intellectual Property for Integrated Circuits by : Kiat Seng Yeo
Download or read book Intellectual Property for Integrated Circuits written by Kiat Seng Yeo and published by J. Ross Publishing. This book was released on 2010 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intellectual Property for Integrated Circuits provides inventors with the know-how to effectively search for and interpret prior arts and equips them with the knowledge to be granted exclusive rights to control the results of their creativity and to benefit financially from those rights.
Book Synopsis 3D Integration for VLSI Systems by : Chuan Seng Tan
Download or read book 3D Integration for VLSI Systems written by Chuan Seng Tan and published by CRC Press. This book was released on 2016-04-19 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Book Synopsis Stable Isotope Probing by : Marc G. Dumont
Download or read book Stable Isotope Probing written by Marc G. Dumont and published by Humana. This book was released on 2020-08-13 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides definitive methods to perform stable isotope probing (SIP) experiments, covering a wide spectrum of stable isotope techniques used in microbial ecology, such as methods to target and analyze labeled DNA, rRNA, mRNA, protein, and PLFA. Protocols to study stable isotope fractionation by microbial pathways, the analysis of labeled communities with Raman microscopy, Chip-SIM, as well as quantitative SIP (qSIP) and high-resolution SIP (HR-SIP) are also featured. Written for the highly successful Methods in Molecular Biology series, chapters include introductions to their respective topics, lists of the necessary materials and reagents, step-by-step, readily reproducible laboratory protocols, and tips on troubleshooting and avoiding known pitfalls. Authoritative and practical, Stable Isotope Probing: Methods and Protocols provides readers with up-to-date protocols ranging from basic to the most sophisticated applications of SIP and will benefit anyone pursuing this exciting area of study.
Book Synopsis Automotive Sensory Systems by : C. Nwagboso
Download or read book Automotive Sensory Systems written by C. Nwagboso and published by Springer Science & Business Media. This book was released on 1993-06-30 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: The rapidly growing need for mobility has brought with it a major challenge for improvement in the operation and utilization of automotive systems. The economical, environmental and safety constraints imposed by the increase in the number of road vehicles and subsequent government policies also require substantial product development through the application of infor mation technology. This involves the enhancement of vehicle informatics and telematic systems with additional sensors and systems. The advance in the design and development of automotive sensory systems is so rapid that there is urgent need for the experts involved in the technology to work together to provide a reference book for the engineer of today and tomorrow. This motivated me to spend two years researching the topics and the basis on which such a book should be written. The result is the present compilation of the work of international experts on the state-of-the-art in the field of automotive sensory systems. Thus, a unique collection has been created for the reference of all those concerned with, or interested in, the design and development of modern, safe and intelligent vehicles. Although this book is intended for engineers, managers, scientists, academicians and policy makers, students should also find it valuable. To meet the requirements of students the basics are explained in simple terms; however, it is hoped that others will appreciate this approach, since most of us are well aware that gaps remain in our knowledge of the elements of our profession.
Book Synopsis Juniper QFX10000 Series by : Douglas Richard Hanks Jr.
Download or read book Juniper QFX10000 Series written by Douglas Richard Hanks Jr. and published by "O'Reilly Media, Inc.". This book was released on 2016-07-28 with total page 269 pages. Available in PDF, EPUB and Kindle. Book excerpt: Like the popular guides The MX Series and Juniper QFX5100 Series, this practical book--written by the same author--introduces new QFX10000 concepts in switching and virtualization, specifically in the core of the data center network. The Juniper QFX10000 Series from Juniper Networks is a game-changer. This new book by Douglas Hanks is the authoritative guide.
Book Synopsis Cracking Digital VLSI Verification Interview by : Robin Garg
Download or read book Cracking Digital VLSI Verification Interview written by Robin Garg and published by . This book was released on 2016-03-13 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: How should I prepare for a Digital VLSI Verification Interview? What all topics do I need to know before I turn up for an interview? What all concepts do I need to brush up? What all resources do I have at my disposal for preparation? What does an Interviewer expect in an Interview? These are few questions almost all individuals ponder upon before an interview. If you have these questions in your mind, your search ends here as keeping these questions in their minds, authors have written this book that will act as a golden reference for candidates preparing for Digital VLSI Verification Interviews. Aim of this book is to enable the readers practice and grasp important concepts that are applicable to Digital VLSI Verification domain (and Interviews) through Question and Answer approach. To achieve this aim, authors have not restricted themselves just to the answer. While answering the questions in this book, authors have taken utmost care to explain underlying fundamentals and concepts. This book consists of 500+ questions covering wide range of topics that test fundamental concepts through problem statements (a common interview practice which the authors have seen over last several years). These questions and problem statements are spread across nine chapters and each chapter consists of questions to help readers brush-up, test, and hone fundamental concepts that form basis of Digital VLSI Verification. The scope of this book however, goes beyond technical concepts. Behavioral skills also form a critical part of working culture of any company. Hence, this book consists of a section that lists down behavioral interview questions as well. Topics covered in this book:1. Digital Logic Design (Number Systems, Gates, Combinational, Sequential Circuits, State Machines, and other Design problems)2. Computer Architecture (Processor Architecture, Caches, Memory Systems)3. Programming (Basics, OOP, UNIX/Linux, C/C++, Perl)4. Hardware Description Languages (Verilog, SystemVerilog)5. Fundamentals of Verification (Verification Basics, Strategies, and Thinking problems)6. Verification Methodologies (UVM, Formal, Power, Clocking, Coverage, Assertions)7. Version Control Systems (CVS, GIT, SVN)8. Logical Reasoning/Puzzles (Related to Digital Logic, General Reasoning, Lateral Thinking)9. Non Technical and Behavioral Questions (Most commonly asked)In addition to technical and behavioral part, this book touches upon a typical interview process and gives a glimpse of latest interview trends. It also lists some general tips and Best-Known-Methods to enable the readers follow correct preparation approach from day-1 of their preparations. Knowing what an Interviewer looks for in an interviewee is always an icing on the cake as it helps a person prepare accordingly. Hence, authors of this book spoke to few leaders in the semiconductor industry and asked their personal views on "What do they look for while Interviewing candidates and how do they usually arrive at a decision if a candidate should be hired?". These leaders have been working in the industry from many-many years now and they have interviewed lots of candidates over past several years. Hear directly from these leaders as to what they look for in candidates before hiring them. Enjoy reading this book. Authors are open to your feedback. Please do provide your valuable comments, ratings, and reviews.
