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Author : Yixiao Wang
Publisher :
ISBN 13 : 9783959003285
Total Pages : pages
Book Rating : 4.0/5 (32 download)
Download or read book Chip-on-Flex Packaging of Optoelectronic Devices Using Optodic Bonding written by Yixiao Wang and published by . This book was released on 2019 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Badih El-Kareh
Publisher : Springer
ISBN 13 : 1493927515
Total Pages : 634 pages
Book Rating : 4.4/5 (939 download)
Download or read book Silicon Analog Components written by Badih El-Kareh and published by Springer. This book was released on 2015-06-04 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.
Author : Adolf Goetzberger
Publisher :
ISBN 13 : 9781119033769
Total Pages : 237 pages
Book Rating : 4.0/5 (337 download)
Download or read book Crystalline Silicon Solar Cells written by Adolf Goetzberger and published by . This book was released on 1998 with total page 237 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : F. Patrick McCluskey
Publisher : CRC Press
ISBN 13 : 9780849396236
Total Pages : 354 pages
Book Rating : 4.3/5 (962 download)
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Author : Ho-Ming Tong
Publisher : Springer Science & Business Media
ISBN 13 : 1441957685
Total Pages : 562 pages
Book Rating : 4.4/5 (419 download)
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author : Norbert Kaiser
Publisher : Springer
ISBN 13 : 3540363866
Total Pages : 510 pages
Book Rating : 4.5/5 (43 download)
Download or read book Optical Interference Coatings written by Norbert Kaiser and published by Springer. This book was released on 2013-06-29 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Designed to give a concise but complete overview of the field, this book features contributions written by leading experts in the various areas. Topics include design, materials, film growth, deposition including large area, characterization and monitoring, and mechanical stress.
Author : Francis Vanek
Publisher : McGraw Hill Professional
ISBN 13 : 0071800131
Total Pages : 705 pages
Book Rating : 4.0/5 (718 download)
Download or read book Sustainable Transportation Systems Engineering written by Francis Vanek and published by McGraw Hill Professional. This book was released on 2014-05-06 with total page 705 pages. Available in PDF, EPUB and Kindle. Book excerpt: Engineer and implement sustainable transportation solutions Featuring in-depth coverage of passenger and freight transportation, this comprehensive resource discusses contemporary transportation systems and options for improving their sustainability. The book addresses vehicle and infrastructure design, economics, environmental concerns, energy security, and alternative energy sources and platforms. Worked-out examples, case studies, illustrations, equations, and end-of-chapter problems are also included in this practical guide. Sustainable Transportation Systems Engineering covers: Background on energy security and climate change Systems analysis tools and techniques Individual choices and transportation demand Transportation systems and vehicle design Physical design of transportation infrastructure Congestion mitigation in urban passenger transportation Role of intelligent transportation systems Public transportation and multimodal solutions Personal mobility and accessibility Intercity passenger transportation Freight transportation function and current trends Freight modal and supply chain management approaches Spatial and geographic aspects of freight transportation Alternative fuels and platforms Electricity and hydrogen as alternative fuels Bioenergy resources and systems Transportation security and planning for extreme weather events PRAISE FOR SUSTAINABLE TRANSPORTATION SYSTEMS ENGINEERING: "This book addresses one of the great challenges of the 21st century--how to transform our resource-intensive passenger and freight transportation system into a set of low-carbon, economically efficient, and socially equitable set of services." -- Dan Sperling, Professor and Director, Institute of Transportation Studies, University of California, Davis, author of Two Billion Cars: Driving toward Sustainability "...provides a rich tool kit for students of sustainable transportation, embracing a systems approach. The authors aptly blend engineering, economics, and environmental impact analysis approaches." -- Susan Shaheen, Professor, Department of Civil and Environmental Engineering, and Co-Director, Transportation Sustainability Research Center, University of California, Berkeley
Author : Francis Vanek
Publisher : McGraw Hill Professional
ISBN 13 : 0071640940
Total Pages : 554 pages
Book Rating : 4.0/5 (716 download)
Download or read book Energy Systems Engineering: Evaluation and Implementation written by Francis Vanek and published by McGraw Hill Professional. This book was released on 2008-06-15 with total page 554 pages. Available in PDF, EPUB and Kindle. Book excerpt: Market: energy professionals including analysts, system engineers, mechanical engineers, and electrical engineers Problems and worked-out equations use SI units
Author : Jay Inslee
Publisher : Island Press
ISBN 13 : 1597266493
Total Pages : 411 pages
Book Rating : 4.5/5 (972 download)
Download or read book Apollo's Fire written by Jay Inslee and published by Island Press. This book was released on 2009-08-13 with total page 411 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book the authors make the case for renewable energy and renewable energy policy. Each chapter begins with an inspiring story by someone working in renewable energy or a related field.
Author : Choong-Un Kim
Publisher : Elsevier
ISBN 13 : 0857093754
Total Pages : 353 pages
Book Rating : 4.8/5 (57 download)
Download or read book Electromigration in Thin Films and Electronic Devices written by Choong-Un Kim and published by Elsevier. This book was released on 2011-08-28 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. - Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits - Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration - Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure
Author : Guillermo Huerta Cuellar
Publisher :
ISBN 13 : 9781838803742
Total Pages : pages
Book Rating : 4.8/5 (37 download)
Download or read book Optical Fiber Applications written by Guillermo Huerta Cuellar and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Tim Byrnes
Publisher : Cambridge University Press
ISBN 13 : 1108982115
Total Pages : 291 pages
Book Rating : 4.1/5 (89 download)
Download or read book Quantum Atom Optics written by Tim Byrnes and published by Cambridge University Press. This book was released on 2021-08-05 with total page 291 pages. Available in PDF, EPUB and Kindle. Book excerpt: The rapid development of quantum technologies has driven a revolution in related research areas such as quantum computation and communication, and quantum materials. The first prototypes of functional quantum devices are beginning to appear, frequently created using ensembles of atoms, which allow the observation of sensitive, quantum effects, and have important applications in quantum simulation and matter wave interferometry. This modern text offers a self-contained introduction to the fundamentals of quantum atom optics and atomic many-body matter wave systems. Assuming a familiarity with undergraduate quantum mechanics, this book will be accessible for graduate students and early career researchers moving into this important new field. A detailed description of the underlying theory of quantum atom optics is given, before development of the key, quantum, technological applications, such as atom interferometry, quantum simulation, quantum metrology, and quantum computing.
Author : Robert A Boudreau
Publisher : CRC Press
ISBN 13 : 9780367392604
Total Pages : 416 pages
Book Rating : 4.3/5 (926 download)
Download or read book Passive Micro-Optical Alignment Methods written by Robert A Boudreau and published by CRC Press. This book was released on 2019-08-30 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: The most expensive phase in the manufacture of micro-optical components and fiber optics is also one of the most performance-critical: optical alignment of the components. The increasing degree of miniaturization makes this an especially challenging task. Active alignment methods result in higher costs and awkward processes, and for some applications, they simply are not possible. Passive Micro-Optical Alignment Methods introduces the passive alignment methods that are currently available and illustrates them with many examples, references, and critiques. The first book dedicated to passive alignment, it begins with an overview of the current activities, requirements, and general results of passive optical alignments, followed by three sections of in-depth analysis. The first of these discusses mechanical passive alignment, highlighting silicon waferboard, solder, and "Jitney" technologies as well as application of mechanical alignment to 3D free-space interconnects. The next section describes the various visual alignment techniques applied to Planar Lightwave Circuits (PLCs) and low-cost plastic and surface mount packaging. The final section details various utilities that aid passive alignment and their resulting tradeoffs and demonstrates Monte Carlo analysis to evaluate the potential of a given method. Passive Micro-Optical Alignment Methods provides the tools necessary to meet the challenge of precision and low-cost alignment for applications that require micron or sub-micron tolerance.
Author : B. G. Yacobi
Publisher : American Scientific Publishers
ISBN 13 :
Total Pages : 200 pages
Book Rating : 4.F/5 ( download)
Download or read book Adhesive Bonding in Photonics Assembly and Packaging written by B. G. Yacobi and published by American Scientific Publishers. This book was released on 2003 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 9783319832098
Total Pages : 969 pages
Book Rating : 4.8/5 (32 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2018-06-08 with total page 969 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Michael R. Feldman
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 212 pages
Book Rating : 4.3/5 (91 download)
Download or read book Optoelectronic Packaging written by Michael R. Feldman and published by SPIE-International Society for Optical Engineering. This book was released on 1996 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt:
