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Chemical Mechanical Planarization In Ic Device Manufacturing Iii
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Book Synopsis Chemical Mechanical Planarization in IC Device Manufacturing III by : Robert Leon Opila
Download or read book Chemical Mechanical Planarization in IC Device Manufacturing III written by Robert Leon Opila and published by The Electrochemical Society. This book was released on 2000 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).
Book Synopsis Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication by : Jianfeng Luo
Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication written by Jianfeng Luo and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver
Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Book Synopsis Chemical Mechanical Planarization IV by : R. L. Opila
Download or read book Chemical Mechanical Planarization IV written by R. L. Opila and published by The Electrochemical Society. This book was released on 2001 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing by : Robert Leon Opila
Download or read book Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing written by Robert Leon Opila and published by The Electrochemical Society. This book was released on 1998 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Chemical Mechanical Planarization VI by : Sudipta Seal
Download or read book Chemical Mechanical Planarization VI written by Sudipta Seal and published by The Electrochemical Society. This book was released on 2003 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microelectronic Applications of Chemical Mechanical Planarization by : Yuzhuo Li
Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2008 with total page 734 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: Provides in-depth coverage of a wide range of state-of-the-art technologies and applications Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Book Synopsis Chemical Mechanical Planarization of Microelectronic Materials by : Joseph M. Steigerwald
Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Book Synopsis Advances in Chemical Mechanical Planarization (CMP) by : Babu Suryadevara
Download or read book Advances in Chemical Mechanical Planarization (CMP) written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Book Synopsis Proceedings of the First International Symposium on Chemical Mechanical Planarization by : Iqbal Ali
Download or read book Proceedings of the First International Symposium on Chemical Mechanical Planarization written by Iqbal Ali and published by The Electrochemical Society. This book was released on 1997 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thin Film Materials, Processes, and Reliability by : G. S. Mathad
Download or read book Thin Film Materials, Processes, and Reliability written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Tribology In Chemical-Mechanical Planarization by : Hong Liang
Download or read book Tribology In Chemical-Mechanical Planarization written by Hong Liang and published by CRC Press. This book was released on 2005-03-01 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.
Book Synopsis Copper Interconnect Technology by : Tapan Gupta
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Book Synopsis Encyclopedia of Chemical Processing by : Sunggyu Lee
Download or read book Encyclopedia of Chemical Processing written by Sunggyu Lee and published by Taylor & Francis US. This book was released on 2006 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Supplying nearly 350 expertly-written articles on technologies that can maximize and enhance the research and production phases of current and emerging chemical manufacturing practices and techniques, this second edition provides gold standard articles on the methods, practices, products, and standards recently influencing the chemical industries. New material includes: design of key unit operations involved with chemical processes; design, unit operation, and integration of reactors and separation systems; process system peripherals such as pumps, valves, and controllers; analytical techniques and equipment; current industry practices; and pilot plant design and scale-up criteria.
Book Synopsis Encyclopedia of Chemical Processing (Online) by : Sunggyu Lee
Download or read book Encyclopedia of Chemical Processing (Online) written by Sunggyu Lee and published by CRC Press. This book was released on 2005-11-01 with total page 3338 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition Encyclopedia supplies nearly 350 gold standard articles on the methods, practices, products, and standards influencing the chemical industries. It offers expertly written articles on technologies at the forefront of the field to maximize and enhance the research and production phases of current and emerging chemical manufacturing practices and techniques. This collecting of information is of vital interest to chemical, polymer, electrical, mechanical, and civil engineers, as well as chemists and chemical researchers. A complete reconceptualization of the classic reference series the Encyclopedia of Chemical Processing and Design, whose first volume published in 1976, this resource offers extensive A-Z treatment of the subject in five simultaneously published volumes, with comprehensive indexing of all five volumes in the back matter of each tome. It includes material on the design of key unit operations involved with chemical processes; the design, unit operation, and integration of reactors and separation systems; process system peripherals such as pumps, valves, and controllers; analytical techniques and equipment; and pilot plant design and scale-up criteria. This reference contains well-researched sections on automation, equipment, design and simulation, reliability and maintenance, separations technologies, and energy and environmental issues. Authoritative contributions cover chemical processing equipment, engineered systems, and laboratory apparatus currently utilized in the field. It also presents expert overviews on key engineering science topics in property predictions, measurements and analysis, novel materials and devices, and emerging chemical fields. ALSO AVAILABLE ONLINE This Taylor & Francis encyclopedia is also available through online subscription, offering a variety of extra benefits for both researchers, students, and librarians, including: Citation tracking and alerts Active reference linking Saved searches and marked lists HTML and PDF format options Contact Taylor and Francis for more information or to inquire about subscription options and print/online combination packages. US: (Tel) 1.888.318.2367; (E-mail) [email protected] International: (Tel) +44 (0) 20 7017 6062; (E-mail) [email protected]
Book Synopsis Electrochemical Processing in ULSI Fabrication III by : Panayotis C. Andricacos
Download or read book Electrochemical Processing in ULSI Fabrication III written by Panayotis C. Andricacos and published by The Electrochemical Society. This book was released on 2002 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Held May 2000 in Toronto, Canada, as part of the 197th meeting of the Electrochemical Society."--Pref.
Book Synopsis Microelectronic Applications of Chemical Mechanical Planarization by : Yuzhuo Li
Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
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