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Characterization And Measurement Circuit Design For A Novel Low Noise And High Sensitivity Mems Capacitive Accelerometer
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Book Synopsis Characterization and Measurement Circuit Design for a Novel Low Noise and High Sensitivity MEMS Capacitive Accelerometer by : Nicolas Wood
Download or read book Characterization and Measurement Circuit Design for a Novel Low Noise and High Sensitivity MEMS Capacitive Accelerometer written by Nicolas Wood and published by . This book was released on 2018 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis MEMS Accelerometers by : Mahmoud Rasras
Download or read book MEMS Accelerometers written by Mahmoud Rasras and published by MDPI. This book was released on 2019-05-27 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Book Synopsis MEMS Accelerometers by : Ibrahim (Abe) M. Elfadel
Download or read book MEMS Accelerometers written by Ibrahim (Abe) M. Elfadel and published by . This book was released on 2019 with total page 1 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Book Synopsis MEMS Silicon Oscillating Accelerometers and Readout Circuits by : Xu, Yong Ping
Download or read book MEMS Silicon Oscillating Accelerometers and Readout Circuits written by Xu, Yong Ping and published by River Publishers. This book was released on 2019-02-12 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.
Book Synopsis Design of a Monolithic 3dof Mems Capacitive Accelerometer by : Muhammad Shuja Khan
Download or read book Design of a Monolithic 3dof Mems Capacitive Accelerometer written by Muhammad Shuja Khan and published by LAP Lambert Academic Publishing. This book was released on 2011-07 with total page 92 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sensors and devices, based on micromachining technology, known as micro-electro-mechanicalsystems or MEMS, have been received increasing attention so far in recent years. Micromachined inertial sensors, consisting of accelerometers and gyroscopes, are one of the most important types of silicon-based sensor. MEMS capacitive accelerometers have been extensively used in automobiles, inertial navigation systems, earth quake detection and many other bio-medical applications. This book deals with the design of a monolithic 3DOF MEMS capacitive accelerometer using both analytical and numerical techniques. Monolithic accelerometer is a single structure having three individual single axis Accelerometers on a single substrate and utilizes a surface micromachining technology using standard PolyMUMPs process. The designed accelerometer is 3mmx3.1mm in size, has low mechanical noise floor, high sense capacitance and high sensitivity along in-plane (x and y) and out-of-plane (z) axes. Performing a detailed finite element analysis in ANSYS 11.o, physical level simulation has been done to verify the deflection for x, y and z axes with respect to the applied acceleration (g).
Book Synopsis Design and optimization of a novel tri-axial miniature ear-plug piezoresistive accelerometer with nanoscale piezoresistors by : Marco Messina
Download or read book Design and optimization of a novel tri-axial miniature ear-plug piezoresistive accelerometer with nanoscale piezoresistors written by Marco Messina and published by GRIN Verlag. This book was released on 2017-12-12 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: Doctoral Thesis / Dissertation from the year 2013 in the subject Design (Industry, Graphics, Fashion), grade: N/A, Cranfield University, language: English, abstract: This work aims at the advancement of state-of-art accelerometer design and optimization methodology by developing an ear-plug accelerometer for race car drivers based on a novel mechanical principle. The accelerometer is used for the measurements of head acceleration when an injurious event occurs. Main requirements for such sensor are miniaturization (2×2 mm), because the device must be placed into the driver earpiece, and its measurement accuracy (i.e. high sensitivity, low crosstalk and low nonlinearity) since the device is used for safety monitoring purpose. A micro-electro-mechanical system (MEMS)-based (bulk micromachined) piezoresistive accelerometer was selected as enabling technology for the development of the sensor. The primary accelerometer elements that can be manipulated during the design stage are: the sensing element (piezoresistors), the micromechanical structure and the measurements circuit. Each of these elements has been specifically designed in order to maximize the sensor performance and to achieve the miniaturization required for the studied application. To achieve accelerometer high sensitivity and miniaturization silicon nanowires (SiNWs) as nanometer scale piezoresistors are adopted as sensing elements. Currently this technology is at an infancy stage, but very promising through the exploitation of the “Giant piezoresistance effect” of SiNWs. This work then measures the potential of the SiNWs as nanoscale piezoresistors by calculating the major performance indexes, both electrical and mechanical, of the novel accelerometer. The results clearly demonstrate that the use of nanoscale piezoresistors boosts the sensitivity by 30 times in comparison to conventional microscale piezoresistors. A feasibility study on nanowires fabrication by both top-down and bottom-up approaches is also carried out. The micromechanical structure used for the design of the accelerometer is an optimized highly symmetric geometry chosen for its self-cancelling property. This work, for the first time, presents an optimization process of the accelerometer micromechanical structure based on a novel mechanical principle, which simultaneously increases the sensitivity and reduces the cross-sensitivity progressively. In the open literature among highly symmetric geometries no other study has to date reported enhancement of the electrical sensitivity and reduction of the cross-talk at the same time.
Book Synopsis Novel Metal Electrodeposition and the Recent Application by : Masato Sone
Download or read book Novel Metal Electrodeposition and the Recent Application written by Masato Sone and published by BoD – Books on Demand. This book was released on 2019-03-06 with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gold and noble metals have been attractive to humans from ancient times because of their beautiful features. In modern society, noble metals, especially gold, play important roles as components in electronic devices because of their high electrical conductivity, chemical stability, and density. In the field of MEMS devices, the demand for continuous miniaturization and sensitivity enhancement is always high. Especially for MEMS accelerometers, sensitivity is affected by Brownian noise, and components with sufficient mass are needed to suppress this noise. Therefore, it is difficult to reduce the dimensions of components to allow further miniaturization of the device. This book presents recent progress in noble metal electrodeposition and applications of gold-based materials in the realization of highly sensitive CMOS-MEMS accelerometers.
Book Synopsis Design and Fabrication of Self-packaged, Flexible MEMs Accelerometer and Aluminum Nitride Tactile Sensors by : Md Sohel Mahmood
Download or read book Design and Fabrication of Self-packaged, Flexible MEMs Accelerometer and Aluminum Nitride Tactile Sensors written by Md Sohel Mahmood and published by . This book was released on 2019 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: The work presented in this dissertation describes the design, fabrication and characterization of a Micro Electro Mechanical System (MEMS) capacitive accelerometer on a flexible substrate. To facilitate the bending of the accelerometers and make them mountable on a curved surface, polyimide was used as a flexible substrate. Considering its high glass transition temperature and low thermal expansion coefficient, PI5878G was chosen as the underlying flexible substrate. Three different sizes of accelerometers were designed in CoventorWare® software which utilizes Finite Element Method (FEM) to numerically perform various analyses. Capacitance simulation under acceleration, modal analysis, stress and pull-in study were performed in CoventorWare®. A double layer UV-LIGA technique was deployed to electroplate the proof mass for increased sensitivity. The proof mass of the accelerometers was perforated to lower the damping force as well as to facilitate the ashing process of the underlying sacrificial layer. Three different sizes of accelerometers were fabricated and subsequently characterized. The largest accelerometer demonstrated a sensitivity of 187 fF/g at its resonant frequency of 800 Hz. It also showed excellent noise performance with a signal to noise ratio (SNR) of 100:1. The accelerometers were also placed on curved surfaces having radii of 3.8 cm, 2.5 cm and 2.0 cm for flexibility analysis. The sensitivity of the largest device was obtained to be 168 fF/g on a curved surface of 2.0 cm radius. The radii of robotic index and thumb fingertips are 1.0 cm and 3.5 cm, respectively. Therefore, these accelerometers are fully compatible with robotics as well as prosthetics. The accelerometers were later encapsulated by Kapton® superstrate in vacuum environment. Kapton® is a polyimide film which possesses similar glass transition temperature and thermal expansion coefficient to that of the underlying substrate PI5878G. The thickness of the superstrate was optimized to place the intermediate accelerometer on a plane of zero stress. The Kapton® films were pre-etched before bonding to the device wafer, thus avoiding spin-coating a photoresist layer at high rpm and possibly damaging the already released micro-accelerometers in the device wafer. The packaged accelerometers were characterized in the same way the open accelerometers were characterized on both flat and curved surfaces. After encapsulation, the sensitivity of the largest accelerometer on a flat and a curved surface with 2.0 cm radius were obtained to be 195 fF/g and 174 fF/f, respectively. All three accelerometers demonstrated outstanding noise performance after vacuum packaging with an SNR of 100:1. Further analysis showed that the contribution from the readout circuitry is the most dominant noise component followed by the Brownian noise of the accelerometers. The developed stresses in different layers of the accelerometers upon bending the substrates were analyzed. The stresses in all cases were below the yield strength of the respective layer materials. AlN cantilevers as tactile sensors were also fabricated and characterized on a flexible substrate. Ti was utilized as the bottom and the top electrode for its smaller lattice mismatch to AlN compared to Pt and Al. The piezoelectric layer of AlN was annealed after sputtering which resulted in excellent crystalline orientation. The XRD peak corresponding to AlN (002) plane was obtained at 36.54o. The fabricated AlN cantilevers were capable of sensing pressures from 100 kPa to 850 kPa which includes soft touching of human index finger and grasping of an object. The sensitivities of the cantilevers were between 1.90 × 10-4 V/kPa and 2.04 × 10-4 V/kPa. The stresses inside the AlN and Ti layer, developed upon full bending, were below the yield strength of the respective layer materials.
Book Synopsis Piezoelectric Accelerometers with Integral Electronics by : Felix Levinzon
Download or read book Piezoelectric Accelerometers with Integral Electronics written by Felix Levinzon and published by Springer. This book was released on 2016-09-17 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an invaluable reference to Piezoelectric Accelerometers with Integral Electronics (IEPE). It describes the design and performance parameters of IEPE accelerometers and their key elements, PE transducers and FET-input amplifiers. Coverage includes recently designed, low-noise and high temperature IEPE accelerometers. Readers will benefit from the detailed noise analysis of the IEPE accelerometer, which enables estimation of its noise floor and noise limits. Other topics useful for designers of low-noise, high temperature silicon-based electronics include noise analysis of FET amplifiers, experimental investigation and comparison of low-frequency noise in different JFETs and MOSFETs, and ultra-low-noise JFETs (at level of 0.6 nV/√Hz). The discussion also includes ultra-low-noise (at level of 3 ng/√Hz) seismic IEPE accelerometers and high temperature (up to 175 ̊C) triaxial and single axis miniature IEPE accelerometers, along with key factors for their design. • Provides a comprehensive reference to the design and performance of IEPE accelerometers, including low-noise and high temperature IEPE sensors; • Includes noise analysis of the IEPE accelerometer, which enables estimation of the its noise floor and noise limits; • Describes recently design of ultra-low-noise (at level of 3 ng/√Hz) IEPE seismic accelerometers and high temperature (up to 175 ̊C) triaxial and single axis miniature IEPE accelerometers; • Compares low-frequency noise in different JFETs and MOSFETs including measurement results of ultra-low-noise (at level of 0.6 nV/√Hz) JFET; • Presents key factors for design of low-noise and high temperature IEPE accelerometer and their electronics.
Book Synopsis High-sensitivity, Low-noise, Multi-axis Capacitive Micro-accelerometers by : Junseok Chae
Download or read book High-sensitivity, Low-noise, Multi-axis Capacitive Micro-accelerometers written by Junseok Chae and published by . This book was released on 2003 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Optical MEMS written by Huikai Xie and published by MDPI. This book was released on 2019-08-06 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a printed edition of the Special Issue Optical MEMS that was published in Micromachines
Book Synopsis Surface-micromachined Capacitive Accelerometers in Above-IC Integration Methods by : Ahmad Alfaifi
Download or read book Surface-micromachined Capacitive Accelerometers in Above-IC Integration Methods written by Ahmad Alfaifi and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: "This thesis proposes a methodology to optimize the design of capacitive accelerometers. This is achieved through a systematic improvement procedure of the closing-gaps accelerometers design. This is used to find the optimum electrode dimensions that would result in the highest sensitivity, within a specified area. The method is verified through the simulation and fabrication of different variations of two designs, then comparing the results with the expected values from analytical optimization methods. The prototypes are fabricated in a commercial process, which imposed limitations on the sizes of the possible accelerometer designs. A survey of prior published works shows the importance of the optimization technique suggested here to increase the performance of these types of sensors, when no fabrication restrictions exist.The thesis also introduces a novel low cross-sensitivity dual-axis capacitive accelerometer design. The device is fabricated in a silicon-on-insulator (SOI) process and its fabrication is finalized by an in-house release step. The device measures 1 mm × 1 mm, with four (4) proof masses that are able to sense accelerations in the X- and Y-axes independently. Two commercial capacitance-to-digital converters are used to read the outputs of both axes of the device in a system in package implementation. The fabricated device exhibits a sensitivity of 16.83 fF/g, while keeping the measured cross-sensitivity to less than 1 % throughout the ±4 g linear range. The rotational motion and Z accelerations have no impact on the device X and Y readings, thanks to the device's particular geometry and differential nature.In addition, the thesis presents a novel design of a 3D high-sensitivity lateral capacitive accelerometer. The accelerometer design utilizes the whole area of the sensor for both the sensing and proof masses, which cancels the tradeoff needed in conventional 2D designs. The design model of the accelerometer is developed to target the highest possible performance. A Z-shaped innovative design of the supporting beams is developed to limit the vertical displacement within the used submicron gap. The accelerometer measures 500 × 500 [mu]m2 and achieves 58 fF/g sensitivity in a ±4 g range in an open-loop system. Suggestions are provided to decrease the 1.4 mg noise floor of the device.Finally, the thesis describes a 3D surface micromachining platform process for above-IC integration. This method uses non-conductive materials with attractive mechanical properties to fabricate micro-electromechanical systems (MEMS) devices. The fixed structures are created using a polyimide layer, while the moving structures are built using silicon nitride (SiN). A 240-nm thin parylene-N polymer layer is used as a sacrificial layer to largely define the capacitive gaps and enable dry release. The photolithography steps are limited to four, in order to ensure a simple and low-cost process. The process has a thermal budget of 300 °C, which should be safe for processing above CMOS integrated circuits. While the used materials provide good results, this process is not limited to these specific materials, and others can be used if needed." --
Book Synopsis Mems Accelerometer Modelling and Noise Analysis by : Biter Boga Inaltekin
Download or read book Mems Accelerometer Modelling and Noise Analysis written by Biter Boga Inaltekin and published by LAP Lambert Academic Publishing. This book was released on 2011-09 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro Electro Mechanical Systems (MEMS) have an extensive use in different areas of technology. Inertial sensors (accelerometers and gyroscopes) are one of the most widely used devices fabricated using MEMS technology. MEMS accelerometers play an important role in different application areas such as automotive, inertial navigation, guidance, industry, space applications etc. because of low cost, small size, low power, and high reliability. This book presents a detailed SIMULINK model for a conventional capacitive sigma-delta accelerometer system consisting of a MEMS accelerometer, closed-loop readout electronics, and signal processing units (e.g. decimation filters). By using this model, it is possible to estimate the performance of the full accelerometer system including individual noise components, operation range, open loop sensitivity, scale factor, etc. The developed model has been verified through test results using a capacitive MEMS accelerometer, full-custom designed readout electronics, and signal processing unit implemented on a FPGA.
Book Synopsis 17th IEEE International Conference on Micro Electro Mechanical Systems by :
Download or read book 17th IEEE International Conference on Micro Electro Mechanical Systems written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2004 with total page 926 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design and Optimization of a Novel Tri-axial Miniature Ear-plug Piezoresistive Accelerometer with Nanoscale Piezoresistors by : M. Messina
Download or read book Design and Optimization of a Novel Tri-axial Miniature Ear-plug Piezoresistive Accelerometer with Nanoscale Piezoresistors written by M. Messina and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This work aims at the advancement of state-of-art accelerometer design and optimization methodology by developing an ear-plug accelerometer for race car drivers based on a novel mechanical principle. The accelerometer is used for the measurements of head acceleration when an injurious event occurs. Main requirements for such sensor are miniaturization (2×2 mm), because the device must be placed into the driver earpiece, and its measurement accuracy (i.e. high sensitivity, low crosstalk and low nonlinearity) since the device is used for safety monitoring purpose. A micro-electro-mechanical system (MEMS)-based (bulk micromachined) piezoresistive accelerometer was selected as enabling technology for the development of the sensor. The primary accelerometer elements that can be manipulated during the design stage are: the sensing element (piezoresistors), the micromechanical structure and the measurements circuit. Each of these elements has been specifically designed in order to maximize the sensor performance and to achieve the miniaturization required for the studied application. To achieve accelerometer high sensitivity and miniaturization silicon nanowires (SiNWs) as nanometer scale piezoresistors are adopted as sensing elements. Currently this technology is at an infancy stage, but very promising through the exploitation of the "Giant piezoresistance effect" of SiNWs. This work then measures the potential of the SiNWs as nanoscale piezoresistors by calculating the major performance indexes, both electrical and mechanical, of the novel accelerometer. The results clearly demonstrate that the use of nanoscale piezoresistors boosts the sensitivity by 30 times in comparison to conventional microscale piezoresistors. A feasibility study on nanowires fabrication by both top-down and bottom-up approaches is also carried out. The micromechanical structure used for the design of the accelerometer is an optimized highly symmetric geometry chosen for its self-cancelling property. This work, for the first time, presents an optimization process of the accelerometer micromechanical structure based on a novel mechanical principle, which simultaneously increases the sensitivity and reduces the cross-sensitivity progressively. In the open literature among highly symmetric geometries no other study has to date reported enhancement of the electrical sensitivity and reduction of the cross-talk at the same time. Moreover the novel mechanical principle represents advancement in the accelerometer design and optimization methodology by studying the influence of a uniform mass moment of inertia of the accelerometer proof mass on the sensor performance. Finally, an optimal accelerometer design is proposed and an optimized measurement circuit is also specifically designed to maximize the performance of the accelerometer. The new proposed accelerometer design is capable of increasing the sensor sensitivity of all axes, in particular the Z-axis increases of almost 5 times in respect to the current state-of-art-technology in piezoresistive accelerometer. This occurs thanks to the particular newly developed approach of combination of beams, proof mass geometry and measurement circuit design, together with the use of silicon nanowires as nanoscale piezoresistors. Furthermore the cross-sensitivity is simultaneously minimized for a maximal performance. The sum of the cross-sensitivity of all axes is equal to 0.4%, well below the more than 5% of the state-of-art technology counterpart reported in the literature. Future work is finally outlined and includes the electro-mechanical characterization of the silicon nanowires and the fabrication of the proposed accelerometer prototype that embeds bottom up SiNWs as nanoscale piezoresistors.
Book Synopsis An Electrical-stimulus-only BIST IC for Capacitive MEMS Accelerometer Sensitivity Characterization by : Muhlis Kenan Ozel
Download or read book An Electrical-stimulus-only BIST IC for Capacitive MEMS Accelerometer Sensitivity Characterization written by Muhlis Kenan Ozel and published by . This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Testing and calibration constitute a significant part of the overall manufacturing cost of microelectromechanical system (MEMS) devices. Developing a low-cost testing and calibration scheme applicable at the user side that ensures the continuous reliability and accuracy is a crucial need. The main purpose of testing is to eliminate defective devices and to verify the qualifications of a product is met. The calibration process for capacitive MEMS devices, for the most part, entails the determination of the mechanical sensitivity. In this work, a physical-stimulus-free built-in-self-test (BIST) integrated circuit (IC) design characterizing the sensitivity of capacitive MEMS accelerometers is presented. The BIST circuity can extract the amplitude and phase response of the acceleration sensor's mechanics under electrical excitation within 0.55% of error with respect to its mechanical sensitivity under the physical stimulus. Sensitivity characterization is performed using a low computation complexity multivariate linear regression model. The BIST circuitry maximizes the use of existing analog and mixed-signal readout signal chain and the host processor core, without the need for computationally expensive Fast Fourier Transform (FFT)-based approaches. The BIST IC is designed and fabricated using the 0.18-μm CMOS technology. The sensor analog front-end and BIST circuitry are integrated with a three-axis, low-g capacitive MEMS accelerometer in a single hermetically sealed package. The BIST circuitry occupies 0.3 mm2 with a total readout IC area of 1.0 mm2 and consumes 8.9 mW during self-test operation.
Book Synopsis Analysis and Design Principles of MEMS Devices by : Minhang Bao
Download or read book Analysis and Design Principles of MEMS Devices written by Minhang Bao and published by Elsevier. This book was released on 2005-04-12 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sensors and actuators are now part of our everyday life and appear in many appliances, such as cars, vending machines and washing machines. MEMS (Micro Electro Mechanical Systems) are micro systems consisting of micro mechanical sensors, actuators and micro electronic circuits. A variety of MEMS devices have been developed and many mass produced, but the information on these is widely dispersed in the literature. This book presents the analysis and design principles of MEMS devices. The information is comprehensive, focusing on microdynamics, such as the mechanics of beam and diaphragm structures, air damping and its effect on the motion of mechanical structures. Using practical examples, the author examines problems associated with analysis and design, and solutions are included at the back of the book. The ideal advanced level textbook for graduates, Analysis and Design Principles of MEMS Devices is a suitable source of reference for researchers and engineers in the field. * Presents the analysis and design principles of MEMS devices more systematically than ever before. * Includes the theories essential for the analysis and design of MEMS includes the dynamics of micro mechanical structures * A problem section is included at the end of each chapter with answers provided at the end of the book.
