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Author : Advanced Packaging Conference
Publisher :
ISBN 13 :
Total Pages : 300 pages
Book Rating : 4.:/5 (255 download)
Download or read book Advanced Packaging Conference written by Advanced Packaging Conference and published by . This book was released on 2005 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Advanced Packaging Conference
Publisher :
ISBN 13 :
Total Pages : 200 pages
Book Rating : 4.:/5 (249 download)
Download or read book Advanced Packaging Conference written by Advanced Packaging Conference and published by . This book was released on 2004 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Advanced Packaging Conference
Publisher :
ISBN 13 :
Total Pages : 220 pages
Book Rating : 4.:/5 (249 download)
Download or read book Advanced Packaging Conference written by Advanced Packaging Conference and published by . This book was released on 2003 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 290 pages
Book Rating : 4.:/5 (318 download)
Download or read book Proceedings, 2002 International Conference on Advanced Packaging and Systems written by and published by . This book was released on 2002 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Packaging written by and published by . This book was released on 2008-11 with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Download or read book Advanced Packaging written by and published by . This book was released on 2008-03 with total page 52 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Download or read book Advanced Packaging written by and published by . This book was released on 2008-07 with total page 40 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Download or read book International Symposium and Exhibition on Advanced Packaging Materials written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Packaging written by and published by . This book was released on 2008-11 with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author :
Publisher : International Society of Hybrid
ISBN 13 : 9780930815592
Total Pages : 349 pages
Book Rating : 4.8/5 (155 download)
Download or read book International Symposium on Advanced Packaging Materials written by and published by International Society of Hybrid. This book was released on 2000 with total page 349 pages. Available in PDF, EPUB and Kindle. Book excerpt: These conference proceedings cover such topics as: high density packaging materials; automotive electronics; system level packaging; chip scale packaging; optoelectronics; power packaging; sensors; actuators, and MEMS; flex circuits; and thermal management.
Download or read book Advanced Packaging written by and published by . This book was released on 2008-08 with total page 56 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author : North Atlantic Treaty Organization. Advisory Group for Aerospace Research and Development
Publisher :
ISBN 13 : 9789283600046
Total Pages : pages
Book Rating : 4.6/5 ( download)
Download or read book AGARD Conference Proceedings written by North Atlantic Treaty Organization. Advisory Group for Aerospace Research and Development and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9784904090176
Total Pages : pages
Book Rating : 4.0/5 (91 download)
Download or read book 2016 International Conference on Electronics Packaging (ICEP). written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9781424402601
Total Pages : 200 pages
Book Rating : 4.4/5 (26 download)
Download or read book IEEE International Symposium and Exhibition on Advanced Packaging Materials written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2006-01-01 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9784991191138
Total Pages : 0 pages
Book Rating : 4.1/5 (911 download)
Download or read book 2022 International Conference on Electronics Packaging (ICEP 2022) written by and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
