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Author :
Publisher :
ISBN 13 :
Total Pages : 730 pages
Book Rating : 4.3/5 (91 download)
Download or read book Advanced Metallization Conference in ... written by and published by . This book was released on 2007 with total page 730 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9781509003860
Total Pages : pages
Book Rating : 4.0/5 (38 download)
Download or read book 2016 IEEE International Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC) written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Darrell Erb
Publisher :
ISBN 13 :
Total Pages : 922 pages
Book Rating : 4.3/5 (91 download)
Download or read book Advanced Metallization Conference 2004 (AMC 2004) written by Darrell Erb and published by . This book was released on 2005 with total page 922 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mihal E. Gross
Publisher : Mrs Conference Proceedings
ISBN 13 :
Total Pages : 806 pages
Book Rating : 4.E/5 ( download)
Download or read book Advanced Metallization Conference 1999 (AMC 1999): Volume 15 written by Mihal E. Gross and published by Mrs Conference Proceedings. This book was released on 2000 with total page 806 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author :
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ISBN 13 :
Total Pages : 920 pages
Book Rating : 4.E/5 ( download)
Download or read book Advanced Metallization Conference 2002 (AMC 2002) written by and published by . This book was released on 2003 with total page 920 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mehul Naik
Publisher : Materials Research Society
ISBN 13 : 9781605111254
Total Pages : 769 pages
Book Rating : 4.1/5 (112 download)
Download or read book Advanced Metallization Conference 2008 (AMC 2008): written by Mehul Naik and published by Materials Research Society. This book was released on 2009-01-01 with total page 769 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.
Author : Andrew J. McKerrow
Publisher : Materials Research Society
ISBN 13 : 9781558999923
Total Pages : 0 pages
Book Rating : 4.9/5 (999 download)
Download or read book Advanced Metallization Conference 2007 (AMC 2007): Volume 23 written by Andrew J. McKerrow and published by Materials Research Society. This book was released on 2008-01-01 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Advanced Metallization Conference - held in Albany, New York, and Tokyo, Japan - marked its 24th anniversary in 2007. These two sister conferences form a unique "one conference at two sites" that focuses on latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. Great progress has been made in ULSI metallization, but new challenges in performance, reliability and integration are expected as dimension continues to shrink. The importance of continued basic research in nanoscience and technology, using either metal wires or new materials such as carbon nanotubes, was declared key to the future of ULSI interconnects.
Author :
Publisher :
ISBN 13 : 9781617822810
Total Pages : 309 pages
Book Rating : 4.8/5 (228 download)
Download or read book Advanced Metallization Conference 2010 written by and published by . This book was released on 2010 with total page 309 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Staff
Publisher :
ISBN 13 : 9781509003877
Total Pages : pages
Book Rating : 4.0/5 (38 download)
Download or read book 2016 IEEE International Interconnect Technology Conference Advanced Metallization Conference (IITC AMC) written by IEEE Staff and published by . This book was released on 2016-05-23 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The IITC AMC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology
Author : Daniel C. Edelstein
Publisher : Materials Research Society
ISBN 13 : 9781605112183
Total Pages : 0 pages
Book Rating : 4.1/5 (121 download)
Download or read book Advanced Metallization Conference 2009 (AMC 2009): Volume 25 written by Daniel C. Edelstein and published by Materials Research Society. This book was released on 2010-08-02 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 1119966868
Total Pages : 616 pages
Book Rating : 4.1/5 (199 download)
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author : Andrew J. McKerrow
Publisher : Materials Research Society
ISBN 13 : 9781558996700
Total Pages : 0 pages
Book Rating : 4.9/5 (967 download)
Download or read book Advanced Metallization Conference 2001 (AMC 2001): Volume 17 written by Andrew J. McKerrow and published by Materials Research Society. This book was released on 2002-01-01 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Leading-edge advanced metallization schemes, as applied to VLSI interconnects, include the introduction of novel metals systems and novel dielectric materials. Technological advances highlighted at AMC 2001 include the latest developments in integrating copper metallization with low-dielectric constant materials, and evaluations of the reliability of such interconnects. Recently, in both industry and academia there has been increased interest in basic research as applied to the field of vertical integration. Since the problems that affect vertical integration are similar to those of VLSI interconnects, it is natural to include the topic here. In fact, it is anticipated that cross fertilization between the fields of VLSI metallization and vertical interconnect will yield a viable technical solution to the problem of multichip integration. This book offers a comprehensive look at the current state of the art of VLSI interconnects. Topics include: process integration; vertical integration and advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other technologies; and CMP and automation.
Author : Sywert H. Brongersma
Publisher : Materials Research Society
ISBN 13 : 9781558998650
Total Pages : 755 pages
Book Rating : 4.9/5 (986 download)
Download or read book Advanced Metallization Conference 2005 (AMC 2005): written by Sywert H. Brongersma and published by Materials Research Society. This book was released on 2006-01-01 with total page 755 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.
Author : IEEE Staff
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.3/5 (53 download)
Download or read book 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC MAM) written by IEEE Staff and published by . This book was released on 2023-05-22 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interconnect Technology, Design, Reliability, Modelling
Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566773799
Total Pages : 364 pages
Book Rating : 4.7/5 (737 download)
Download or read book Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics written by and published by The Electrochemical Society. This book was released on 2003 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Krishna Seshan
Publisher : William Andrew
ISBN 13 : 0128123125
Total Pages : 470 pages
Book Rating : 4.1/5 (281 download)
Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2018-02-23 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics
Author : Stephen W. Russell
Publisher : Materials Research Society
ISBN 13 : 9781558999473
Total Pages : 693 pages
Book Rating : 4.9/5 (994 download)
Download or read book Advanced Metallization Conference 2006 (AMC 2006): written by Stephen W. Russell and published by Materials Research Society. This book was released on 2007-01-01 with total page 693 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Advanced Metallization Conference 2006 - held in Tokyo and San Diego, California - highlights both current state-of-the-art and ongoing challenges associated with multilevel interconnects. Technical leaders from around the world gathered to discuss developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Contributions to the volume focus on design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices. A keynote address by H.-S. Philip Wong, Stanford University, on 'Nanostructured Materials for Interconnects' is featured.
