Advanced Materials And Processes For Microelectronics

Download Advanced Materials And Processes For Microelectronics full books in PDF, epub, and Kindle. Read online Advanced Materials And Processes For Microelectronics ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!

Microelectronic Materials and Processes

Author : Roland Levy
Publisher : Springer Science & Business Media
ISBN 13 : 9780792301547
Total Pages : 1006 pages
Book Rating : 4.3/5 (15 download)

DOWNLOAD NOW!

Book Synopsis Microelectronic Materials and Processes by : Roland Levy

Download or read book Microelectronic Materials and Processes written by Roland Levy and published by Springer Science & Business Media. This book was released on 1989-01-31 with total page 1006 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.

Advanced Materials and Processes

Author : Dragan P. Uskovic
Publisher : Trans Tech Publications
ISBN 13 :
Total Pages : 392 pages
Book Rating : 4.3/5 (91 download)

DOWNLOAD NOW!

Book Synopsis Advanced Materials and Processes by : Dragan P. Uskovic

Download or read book Advanced Materials and Processes written by Dragan P. Uskovic and published by Trans Tech Publications. This book was released on 1998 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern Technology depends upon modern materials. Life as we know it would hardly be possible without the progress that has been made in cutting edge materials science. This is true of both the various theoretical aspects and of the practical engineering applications.

Dielectric Films for Advanced Microelectronics

Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470065419
Total Pages : 508 pages
Book Rating : 4.4/5 (7 download)

DOWNLOAD NOW!

Book Synopsis Dielectric Films for Advanced Microelectronics by : Mikhail Baklanov

Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.

Diffusion Processes in Advanced Technological Materials

Author : Devendra Gupta
Publisher : Springer Science & Business Media
ISBN 13 : 9780080947082
Total Pages : 552 pages
Book Rating : 4.9/5 (47 download)

DOWNLOAD NOW!

Book Synopsis Diffusion Processes in Advanced Technological Materials by : Devendra Gupta

Download or read book Diffusion Processes in Advanced Technological Materials written by Devendra Gupta and published by Springer Science & Business Media. This book was released on 2013-01-15 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.

Advanced Materials & Processes

Author :
Publisher :
ISBN 13 :
Total Pages : 616 pages
Book Rating : 4.:/5 (31 download)

DOWNLOAD NOW!

Book Synopsis Advanced Materials & Processes by :

Download or read book Advanced Materials & Processes written by and published by . This book was released on 2001 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

Author : Evgeni Gusev
Publisher : Springer
ISBN 13 : 9048138078
Total Pages : 310 pages
Book Rating : 4.0/5 (481 download)

DOWNLOAD NOW!

Book Synopsis Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators by : Evgeni Gusev

Download or read book Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators written by Evgeni Gusev and published by Springer. This book was released on 2010-03-03 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: A NATO Advanced Research Workshop (ARW) entitled “Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators” was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific issues that pertain to the use of micro- and nano-electromechanical systems (MEMS and NEMS), devices and technologies in next generation commercial and defen- related applications. Micro- and nano-electromechanical systems represent rather broad and diverse technological areas, such as optical systems (micromirrors, waveguides, optical sensors, integrated subsystems), life sciences and lab equipment (micropumps, membranes, lab-on-chip, membranes, microfluidics), sensors (bio-sensors, chemical sensors, gas-phase sensors, sensors integrated with electronics) and RF applications for signal transmission (variable capacitors, tunable filters and antennas, switches, resonators). From a scientific viewpoint, this is a very multi-disciplinary field, including micro- and nano-mechanics (such as stresses in structural materials), electronic effects (e. g. charge transfer), general electrostatics, materials science, surface chemistry, interface science, (nano)tribology, and optics. It is obvious that in order to overcome the problems surrounding next-generation MEMS/NEMS devices and applications it is necessary to tackle them from different angles: theoreticians need to speak with mechanical engineers, and device engineers and modelers to listen to surface physicists. It was therefore one of the main objectives of the workshop to bring together a multidisciplinary team of distinguished researchers.

Advanced Materials and Processes: High technology applications interfaces and related topics

Author :
Publisher :
ISBN 13 :
Total Pages : 796 pages
Book Rating : 4.F/5 ( download)

DOWNLOAD NOW!

Book Synopsis Advanced Materials and Processes: High technology applications interfaces and related topics by :

Download or read book Advanced Materials and Processes: High technology applications interfaces and related topics written by and published by . This book was released on 1990 with total page 796 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Joining Processes for Dissimilar and Advanced Materials

Author : Pawan Kumar Rakesh
Publisher : Woodhead Publishing
ISBN 13 : 0323860206
Total Pages : 694 pages
Book Rating : 4.3/5 (238 download)

DOWNLOAD NOW!

Book Synopsis Joining Processes for Dissimilar and Advanced Materials by : Pawan Kumar Rakesh

Download or read book Joining Processes for Dissimilar and Advanced Materials written by Pawan Kumar Rakesh and published by Woodhead Publishing. This book was released on 2021-11-13 with total page 694 pages. Available in PDF, EPUB and Kindle. Book excerpt: Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining of similar and dissimilar materials resulting from factors including different thermal coefficients and melting points. Traditional joining processes are ineffective with many newly developed materials. The ever-increasing industrial demands for production efficiency and high-performance materials are also pushing this technology forward. The resulting emergence of advanced micro- and nanoscale material joining technologies, have provided many solutions to these challenges. Drawing on the latest research, this book describes primary and secondary processes for the joining of advanced materials such as metals and alloys, intermetallics, ceramics, glasses, polymers, superalloys, electronic materials and composites in similar and dissimilar combinations. It also covers details of joint design, quality assurance, economics and service life of the product. - Provides valuable information on innovative joining technologies including induction heating of metals, ultrasonic heating, and laser heating at micro- and nanoscale levels - Describes the newly developed modelling, simulation and digitalization of the joining process - Includes a methodology for characterization of joints

Handbook of Semiconductor Manufacturing Technology

Author : Yoshio Nishi
Publisher : CRC Press
ISBN 13 : 9780824787837
Total Pages : 1186 pages
Book Rating : 4.7/5 (878 download)

DOWNLOAD NOW!

Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2000-08-09 with total page 1186 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."

Advanced Materials for Integrated Optical Waveguides

Author : Xingcun Colin Tong Ph.D
Publisher : Springer Science & Business Media
ISBN 13 : 3319015508
Total Pages : 574 pages
Book Rating : 4.3/5 (19 download)

DOWNLOAD NOW!

Book Synopsis Advanced Materials for Integrated Optical Waveguides by : Xingcun Colin Tong Ph.D

Download or read book Advanced Materials for Integrated Optical Waveguides written by Xingcun Colin Tong Ph.D and published by Springer Science & Business Media. This book was released on 2013-10-17 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.

Materials for Advanced Packaging

Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)

DOWNLOAD NOW!

Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Advanced Materials for Printed Flexible Electronics

Author : Colin Tong
Publisher : Springer Nature
ISBN 13 : 3030798046
Total Pages : 641 pages
Book Rating : 4.0/5 (37 download)

DOWNLOAD NOW!

Book Synopsis Advanced Materials for Printed Flexible Electronics by : Colin Tong

Download or read book Advanced Materials for Printed Flexible Electronics written by Colin Tong and published by Springer Nature. This book was released on 2021-10-04 with total page 641 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.

Microchip Fabrication, 5th Ed.

Author : Peter Van Zant
Publisher : McGraw Hill Professional
ISBN 13 : 0071501398
Total Pages : 658 pages
Book Rating : 4.0/5 (715 download)

DOWNLOAD NOW!

Book Synopsis Microchip Fabrication, 5th Ed. by : Peter Van Zant

Download or read book Microchip Fabrication, 5th Ed. written by Peter Van Zant and published by McGraw Hill Professional. This book was released on 2004-06-09 with total page 658 pages. Available in PDF, EPUB and Kindle. Book excerpt: The #1 book in the industry for more than 15 years! Utilizing a straightforward, math-free pathology, this is a novice-friendly guide to the semiconductor fabrication process from raw materials through shipping the finished, packaged device. Challenging quizzes and review summaries make this the perfect learning guide for technicians in training. * NEW chapter on nanotechnology * NEW sections on 300mm wafer processing * Processes and devices, and Green processing * Every chapter updated to reflect the latest processing techniques

Advanced Processes for 193-nm Immersion Lithography

Author : Yayi Wei
Publisher : SPIE Press
ISBN 13 : 0819475572
Total Pages : 338 pages
Book Rating : 4.8/5 (194 download)

DOWNLOAD NOW!

Book Synopsis Advanced Processes for 193-nm Immersion Lithography by : Yayi Wei

Download or read book Advanced Processes for 193-nm Immersion Lithography written by Yayi Wei and published by SPIE Press. This book was released on 2009 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning.

Beyond the Molecular Frontier

Author : National Research Council
Publisher : National Academies Press
ISBN 13 : 0309168392
Total Pages : 238 pages
Book Rating : 4.3/5 (91 download)

DOWNLOAD NOW!

Book Synopsis Beyond the Molecular Frontier by : National Research Council

Download or read book Beyond the Molecular Frontier written by National Research Council and published by National Academies Press. This book was released on 2003-03-19 with total page 238 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemistry and chemical engineering have changed significantly in the last decade. They have broadened their scopeâ€"into biology, nanotechnology, materials science, computation, and advanced methods of process systems engineering and controlâ€"so much that the programs in most chemistry and chemical engineering departments now barely resemble the classical notion of chemistry. Beyond the Molecular Frontier brings together research, discovery, and invention across the entire spectrum of the chemical sciencesâ€"from fundamental, molecular-level chemistry to large-scale chemical processing technology. This reflects the way the field has evolved, the synergy at universities between research and education in chemistry and chemical engineering, and the way chemists and chemical engineers work together in industry. The astonishing developments in science and engineering during the 20th century have made it possible to dream of new goals that might previously have been considered unthinkable. This book identifies the key opportunities and challenges for the chemical sciences, from basic research to societal needs and from terrorism defense to environmental protection, and it looks at the ways in which chemists and chemical engineers can work together to contribute to an improved future.

Remanufacturing and Advanced Machining Processes for New Materials and Components

Author : Е.S. Gevorkyan
Publisher : Taylor & Francis
ISBN 13 : 1000528669
Total Pages : 204 pages
Book Rating : 4.0/5 (5 download)

DOWNLOAD NOW!

Book Synopsis Remanufacturing and Advanced Machining Processes for New Materials and Components by : Е.S. Gevorkyan

Download or read book Remanufacturing and Advanced Machining Processes for New Materials and Components written by Е.S. Gevorkyan and published by Taylor & Francis. This book was released on 2022-03-22 with total page 204 pages. Available in PDF, EPUB and Kindle. Book excerpt: Remanufacturing and Advanced Machining Processes for Materials and Components presents current and emerging techniques for machining of new materials and restoration of components, as well as surface engineering methods aimed at prolonging the life of industrial systems. It examines contemporary machining processes for new materials, methods of protection and restoration of components, and smart machining processes. • Details a variety of advanced machining processes, new materials joining techniques, and methods to increase machining accuracy • Presents innovative methods for protection and restoration of components primarily from the perspective of remanufacturing and protective surface engineering • Discusses smart machining processes, including computer-integrated manufacturing and rapid prototyping, and smart materials • Provides a comprehensive summary of state-of-the-art in every section and a description of manufacturing methods • Describes the applications in recovery and enhancing purposes and identifies contemporary trends in industrial practice, emphasizing resource savings and performance prolongation for components and engineering systems The book is aimed at a range of readers, including graduate-level students, researchers, and engineers in mechanical, materials, and manufacturing engineering, especially those focused on resource savings, renovation, and failure prevention of components in engineering systems.

Microelectronic Interconnections and Assembly

Author : G.G. Harman
Publisher : Springer Science & Business Media
ISBN 13 : 9401151350
Total Pages : 295 pages
Book Rating : 4.4/5 (11 download)

DOWNLOAD NOW!

Book Synopsis Microelectronic Interconnections and Assembly by : G.G. Harman

Download or read book Microelectronic Interconnections and Assembly written by G.G. Harman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.