5th Electronics Packaging Technology Conference

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Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000)

Author : Thiam Beng Lim
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 492 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) by : Thiam Beng Lim

Download or read book Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) written by Thiam Beng Lim and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.

Proceedings of the Technical Conference

Author :
Publisher :
ISBN 13 :
Total Pages : 656 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Proceedings of the Technical Conference by :

Download or read book Proceedings of the Technical Conference written by and published by . This book was released on 1985 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003)

Author :
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (18 download)

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Book Synopsis Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003) by :

Download or read book Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003) written by and published by . This book was released on 2004 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings of 2nd Electronics Packaging Technology Conference

Author : Andrew A. O. Tay
Publisher :
ISBN 13 : 9780780351417
Total Pages : 380 pages
Book Rating : 4.3/5 (514 download)

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Book Synopsis Proceedings of 2nd Electronics Packaging Technology Conference by : Andrew A. O. Tay

Download or read book Proceedings of 2nd Electronics Packaging Technology Conference written by Andrew A. O. Tay and published by . This book was released on 1998 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation EPTC '98 provides a forum for package development engineers, scientists & researchers to present their findings & innovations, & to exchange ideas in electronic packaging technology. The organizers aim was to establish EPTC as a major electronic packaging conference in the South East Asian region where the bulk of the world's electronic packaging activities is taking place. Partial Contents: Chip Scale Packaging & its Impact on PCB Substrate Technology; Electrical Design of High Performance Packages; Thermal Management of Electronic Packages & Systems; Flip Chip Technology.

5th Electronics Packaging Technology Conference

Author : Mahadevan K. Iyer
Publisher : IEEE Computer Society Press
ISBN 13 : 9780780382053
Total Pages : 854 pages
Book Rating : 4.3/5 (82 download)

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Book Synopsis 5th Electronics Packaging Technology Conference by : Mahadevan K. Iyer

Download or read book 5th Electronics Packaging Technology Conference written by Mahadevan K. Iyer and published by IEEE Computer Society Press. This book was released on 2003 with total page 854 pages. Available in PDF, EPUB and Kindle. Book excerpt:

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

Author : IEEE Staff
Publisher :
ISBN 13 : 9781538630433
Total Pages : pages
Book Rating : 4.6/5 (34 download)

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Book Synopsis 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) by : IEEE Staff

Download or read book 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) written by IEEE Staff and published by . This book was released on 2017-12-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging Advanced Flip chip, 2 5D & 3D, PoP, embedded passives & actives on substrates, System in Packaging, embedded chip packaging technologies, Panel level packaging, RF, Microwave & Millimeter wave, Power and Rugged Electronics Packaging etc TSV Wafer Level Packaging Wafer level packaging ( Fan in Fan out), embedded chip packaging, 2 5D 3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc Interconnection Technologies Au Ag Cu Al Wire bond Wedge bond technology, Flip chip & Cu pillar, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb free) etc Emerging Technologies Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc Materials and Processing advanced materials such 3D materials, photoresist, polymer dielectrics, solder materials, die attach, underfill, Substrates, etc

EPTC

Author :
Publisher :
ISBN 13 : 9781538630426
Total Pages : pages
Book Rating : 4.6/5 (34 download)

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Book Synopsis EPTC by :

Download or read book EPTC written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Materials for Advanced Packaging

Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 969 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 969 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Author : Muhannad S. Bakir
Publisher : Artech House
ISBN 13 : 1596932473
Total Pages : 551 pages
Book Rating : 4.5/5 (969 download)

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Book Synopsis Integrated Interconnect Technologies for 3D Nanoelectronic Systems by : Muhannad S. Bakir

Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

TSV 3D RF Integration

Author : Shenglin Ma
Publisher : Elsevier
ISBN 13 : 0323996035
Total Pages : 294 pages
Book Rating : 4.3/5 (239 download)

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Book Synopsis TSV 3D RF Integration by : Shenglin Ma

Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods Offers a systematic and comparative literature review of HR-Si interposer technology by topic Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems Gives a systematic and accessible accounting on this leading technology

Interconnect Reliability in Advanced Memory Device Packaging

Author : Chong Leong, Gan
Publisher : Springer Nature
ISBN 13 : 3031267087
Total Pages : 223 pages
Book Rating : 4.0/5 (312 download)

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Book Synopsis Interconnect Reliability in Advanced Memory Device Packaging by : Chong Leong, Gan

Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Structural Dynamics of Electronic and Photonic Systems

Author : Ephraim Suhir
Publisher : John Wiley & Sons
ISBN 13 : 047088679X
Total Pages : 610 pages
Book Rating : 4.4/5 (78 download)

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Book Synopsis Structural Dynamics of Electronic and Photonic Systems by : Ephraim Suhir

Download or read book Structural Dynamics of Electronic and Photonic Systems written by Ephraim Suhir and published by John Wiley & Sons. This book was released on 2011-04-04 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.

2011 IEEE 13th Electronics Packaging Technology Conference

Author : Components, Packaging, and Manufacturing Technology Society
Publisher :
ISBN 13 : 9781457719837
Total Pages : 838 pages
Book Rating : 4.7/5 (198 download)

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Book Synopsis 2011 IEEE 13th Electronics Packaging Technology Conference by : Components, Packaging, and Manufacturing Technology Society

Download or read book 2011 IEEE 13th Electronics Packaging Technology Conference written by Components, Packaging, and Manufacturing Technology Society and published by . This book was released on 2011-12-10 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt:

ICEPT 2003

Author : International Conference on Electronic Packaging Technology
Publisher :
ISBN 13 : 9780780381681
Total Pages : 517 pages
Book Rating : 4.3/5 (816 download)

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Book Synopsis ICEPT 2003 by : International Conference on Electronic Packaging Technology

Download or read book ICEPT 2003 written by International Conference on Electronic Packaging Technology and published by . This book was released on 2003 with total page 517 pages. Available in PDF, EPUB and Kindle. Book excerpt:

2012 IEEE 14th Electronics Packaging Technology Conference

Author :
Publisher :
ISBN 13 :
Total Pages : 653 pages
Book Rating : 4.:/5 (86 download)

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Book Synopsis 2012 IEEE 14th Electronics Packaging Technology Conference by :

Download or read book 2012 IEEE 14th Electronics Packaging Technology Conference written by and published by . This book was released on 2012 with total page 653 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Flexible Electronic Packaging and EncapsulationTechnology

Author : Wei Huang
Publisher : John Wiley & Sons
ISBN 13 : 3527353593
Total Pages : 389 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Flexible Electronic Packaging and EncapsulationTechnology by : Wei Huang

Download or read book Flexible Electronic Packaging and EncapsulationTechnology written by Wei Huang and published by John Wiley & Sons. This book was released on 2024-06-04 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)

Author : IEEE Staff
Publisher :
ISBN 13 : 9781479969951
Total Pages : pages
Book Rating : 4.9/5 (699 download)

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Book Synopsis 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) by : IEEE Staff

Download or read book 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) written by IEEE Staff and published by . This book was released on 2014-12-03 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging, TSV Wafer Level Packaging, Interconnection Technologies, Emerging Technologies, Materials & Processes, Electrical Modeling & Simulations Mechanical Modeling & Simulations Thermal Characterization & Cooling Solutions, Quality & Reliability, Wafer Package Testing & Characterization