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2016 International Symposium On 3d Power Electronics Integration And Manufacturing 3d Peim
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Book Synopsis 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) by : IEEE Staff
Download or read book 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) written by IEEE Staff and published by . This book was released on 2016-06-13 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This symposium brings together practitioners and researchers in the power electronics industry to discuss, identify, and roadmap developments in circuits and systems enabled through advancements in 3D packaging, integration, and manufacturing technologies A focus of the symposium is on state of the art manufacturing technologies used in the design and processing of power electronics systems
Download or read book 3D-PEIM written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). by :
Download or read book 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). written by and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 3D Power Electronics Integration and Manufacturing (3D-PEIM), International Symposium on by :
Download or read book 3D Power Electronics Integration and Manufacturing (3D-PEIM), International Symposium on written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) by : IEEE Staff
Download or read book 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) written by IEEE Staff and published by . This book was released on 2018-06-25 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Advancements in 3D integrated, embedded, and additively manufactured packaging for smaller, lighter, more efficient, and sustainable power electronic products
Book Synopsis 3D Industrial Printing with Polymers by : Johannes Karl Fink
Download or read book 3D Industrial Printing with Polymers written by Johannes Karl Fink and published by John Wiley & Sons. This book was released on 2018-11-30 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D industrial printing has become mainstream in manufacturing. This unique book is the first to focus on polymers as the printing material. The scientific literature with respect to 3D printing is collated in this monograph. The book opens with a chapter on foundational issues such and presents a broad overview of 3D printing procedures and the materials used therein. In particular, the methods of 3d printing are discussed and the polymers and composites used for 3d printing are detailed. The book details the main fields of applications areas which include electric and magnetic uses, medical applications, and pharmaceutical applications. Electric and magnetic uses include electronic materials, actuators, piezoelectric materials, antennas, batteries and fuel cells. Medical applications are organ manufacturing, bone repair materials, drug-eluting coronary stents, and dental applications. The pharmaceutical applications are composite tablets, transdermal drug delivery, and patient-specific liquid capsules. A special chapter deals with the growing aircraft and automotive uses for 3D printing, such as with manufacturing of aircraft parts and aircraft cabins. In the field of cars, 3D printing is gaining importance for automotive parts (brake components, drives), for the fabrication of automotive repair systems, and even 3D printed vehicles.
Book Synopsis Advanced Multiphasing Switched-Capacitor DC-DC Converters by : Nicolas Butzen
Download or read book Advanced Multiphasing Switched-Capacitor DC-DC Converters written by Nicolas Butzen and published by Springer Nature. This book was released on 2020-07-03 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gives a detailed analysis of switched-capacitor DC-DC converters that are entirely integrated on a single chip and establishes that these converters are mainly limited by the large parasitic coupling, the low capacitor energy density, and the fact that switched-capacitor converter topologies only have a fixed voltage conversion ratio. The authors introduce the concept of Advanced Multiphasing as a way to circumvent these limitations by having multiple out-of-phase parallel converter cores interact with each other to minimize capacitor charging losses, leading to several techniques that demonstrate record efficiency and power-density, and even a fundamentally new type of switched-capacitor topology that has a continuously-scalable conversion ratio. Provides single-source reference to the recently-developed Advanced Multiphasing concept; Enables greatly improved performance and capabilities in fully integrated switched-capacitor converters; Enables readers to design DC-DC converters, where multiple converter cores are put in parallel and actively interact with each other over several phases to improve their capabilities.
Book Synopsis Thermal and Electro-Thermal System Simulation by : Márta Rencz
Download or read book Thermal and Electro-Thermal System Simulation written by Márta Rencz and published by MDPI. This book was released on 2019-11-18 with total page 222 pages. Available in PDF, EPUB and Kindle. Book excerpt: With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
Book Synopsis Next-Generation ADCs, High-Performance Power Management, and Technology Considerations for Advanced Integrated Circuits by : Andrea Baschirotto
Download or read book Next-Generation ADCs, High-Performance Power Management, and Technology Considerations for Advanced Integrated Circuits written by Andrea Baschirotto and published by Springer Nature. This book was released on 2019-10-24 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on the 18 tutorials presented during the 28th workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, including next-generation analog-to-digital converters , high-performance power management systems and technology considerations for advanced IC design. For anyone involved in analog circuit research and development, this book will be a valuable summary of the state-of-the-art in these areas. Provides a summary of the state-of-the-art in analog circuit design, written by experts from industry and academia; Presents material in a tutorial-based format; Includes coverage of next-generation analog-to-digital converters, high-performance power management systems, and technology considerations for advanced IC design.
Book Synopsis Current Topics in iPSCs Technology by : Alexander Birbrair
Download or read book Current Topics in iPSCs Technology written by Alexander Birbrair and published by Academic Press. This book was released on 2022-01-18 with total page 638 pages. Available in PDF, EPUB and Kindle. Book excerpt: Current Topics in iPSCs provides a deep analysis of the underlying fundamentals that support short and mid-term developments and milestones in the business of mesenchymal stem cell therapies. This volume explores the next frontier of MSC therapies and how the transformational potential of therapeutic adult cells will be realised in all therapy areas. The impacts of clinical and economic benefits are dissected throughout each of the chapters. Written by thought leaders in the field for those curious about the interface of science and business. Explores the strategy at the forefront of the science of mesenchymal stem cells Provides an overview of all therapy areas where MSC and MSC-derived products can be used therapeutically Depicts transformational changes in healthcare that enable the implementation of MSC-powered technology platforms
Book Synopsis Polymers for 3D Printing by : Joanna Izdebska-Podsiadły
Download or read book Polymers for 3D Printing written by Joanna Izdebska-Podsiadły and published by William Andrew. This book was released on 2022-06-05 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymers for 3D Printing: Methods, Properties, and Characteristics provides a detailed guide to polymers for 3D printing, bridging the gap between research and practice, and enabling engineers, technicians and designers to utilise and implement this technology for their products or applications. Presents the properties, attributes, and potential applications of the polymeric materials used in 3D printing Analyses and compares the available methods for 3D printing, with an emphasis on the latest cutting-edge technologies Enables the reader to select and implement the correct 3D printing technology, according to polymer properties or product requirements
Book Synopsis Die-Attach Materials for High Temperature Applications in Microelectronics Packaging by : Kim S. Siow
Download or read book Die-Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Download or read book Electric Vehicles written by Yiqing Yuan and published by SAE International. This book was released on 2024-07-25 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dive into the future of automotive engineering with our latest book, Electric Vehicles: Theory and Design. As the world shifts towards sustainable mobility, this indispensable guide offers a deep dive into the cutting-edge world of electric vehicles (EVs). Authored by an industry expert with a background in combustion engineering, this book bridges the gap between traditional automotive knowledge and the electrified future. From the basics of EV theory to advanced design principles, this book covers every aspect of EV engineering. Whether you're an experienced EV engineer or just entering the field, you'll find invaluable insights, technical requirements, and practical recommendations to navigate the complex world of EV engineering.Forget outdated references – this book delivers up-to-date information on EVs and their essential components, including cutting-edge battery systems, propulsion technology, and intelligent subsystems. Plus, explore the latest trends in electrification, autonomous driving, connectivity, and shared mobility, and stay ahead of the curve in this rapidly evolving industry. Perfect for automotive professionals, students, and scholars, this book serves as your roadmap to success in the electric vehicle revolution. Don't miss out – grab your copy today and become an expert in shaping the future of sustainable mobility! (ISBN 9781468607734, ISBN 9781468607741, ISBN 9781468607758, DOI https://doi.org/10.4271/9781468607741)
Book Synopsis More-than-Moore Devices and Integration for Semiconductors by : Francesca Iacopi
Download or read book More-than-Moore Devices and Integration for Semiconductors written by Francesca Iacopi and published by Springer Nature. This book was released on 2023-02-17 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Book Synopsis Applications of Power Electronics by : Frede Blaabjerg
Download or read book Applications of Power Electronics written by Frede Blaabjerg and published by MDPI. This book was released on 2019-06-24 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power electronics technology is still an emerging technology, and it has found its way into many applications, from renewable energy generation (i.e., wind power and solar power) to electrical vehicles (EVs), biomedical devices, and small appliances, such as laptop chargers. In the near future, electrical energy will be provided and handled by power electronics and consumed through power electronics; this not only will intensify the role of power electronics technology in power conversion processes, but also implies that power systems are undergoing a paradigm shift, from centralized distribution to distributed generation. Today, more than 1000 GW of renewable energy generation sources (photovoltaic (PV) and wind) have been installed, all of which are handled by power electronics technology. The main aim of this book is to highlight and address recent breakthroughs in the range of emerging applications in power electronics and in harmonic and electromagnetic interference (EMI) issues at device and system levels as discussed in robust and reliable power electronics technologies, including fault prognosis and diagnosis technique stability of grid-connected converters and smart control of power electronics in devices, microgrids, and at system levels.
