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2016 International Reliability Physics Symposium
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Book Synopsis ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis by : ASM International
Download or read book ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2017-12-01 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Book Synopsis Recent Advances in PMOS Negative Bias Temperature Instability by : Souvik Mahapatra
Download or read book Recent Advances in PMOS Negative Bias Temperature Instability written by Souvik Mahapatra and published by Springer Nature. This book was released on 2021-11-25 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers advances in Negative Bias Temperature Instability (NBTI) and will prove useful to researchers and professionals in the semiconductor devices areas. NBTI continues to remain as an important reliability issue for CMOS transistors and circuits. Development of NBTI resilient technology relies on utilizing suitable stress conditions, artifact free measurements and accurate physics-based models for the reliable determination of degradation at end-of-life, as well as understanding the process, material and device architectural impacts. This book discusses: Ultra-fast measurements and modelling of parametric drift due to NBTI in different transistor architectures: planar bulk and FDSOI p-MOSFETs, p-FinFETs and GAA-SNS p-FETs, with Silicon and Silicon Germanium channels. BTI Analysis Tool (BAT), a comprehensive physics-based framework, to model the measured time kinetics of parametric drift during and after DC and AC stress, at different stress and recovery biases and temperature, as well as pulse duty cycle and frequency. The Reaction Diffusion (RD) model is used for generated interface traps, Transient Trap Occupancy Model (TTOM) for charge occupancy of the generated interface traps and their contribution, Activated Barrier Double Well Thermionic (ABDWT) model for hole trapping in pre-existing bulk gate insulator traps, and Reaction Diffusion Drift (RDD) model for bulk trap generation in the BAT framework; NBTI parametric drift is due to uncorrelated contributions from the trap generation (interface, bulk) and trapping processes. Analysis and modelling of Nitrogen incorporation into the gate insulator, Germanium incorporation into the channel, and mechanical stress effects due to changes in the transistor layout or device dimensions; similarities and differences of (100) surface dominated planar and GAA MOSFETs and (110) sidewall dominated FinFETs are analysed.
Book Synopsis Dependable Multicore Architectures at Nanoscale by : Marco Ottavi
Download or read book Dependable Multicore Architectures at Nanoscale written by Marco Ottavi and published by Springer. This book was released on 2017-08-28 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides comprehensive coverage of the dependability challenges in today's advanced computing systems. It is an in-depth discussion of all the technological and design-level techniques that may be used to overcome these issues and analyzes various dependability-assessment methods. The impact of individual application scenarios on the definition of challenges and solutions is considered so that the designer can clearly assess the problems and adjust the solution based on the specifications in question. The book is composed of three sections, beginning with an introduction to current dependability challenges arising in complex computing systems implemented with nanoscale technologies, and of the effect of the application scenario. The second section details all the fault-tolerance techniques that are applicable in the manufacture of reliable advanced computing devices. Different levels, from technology-level fault avoidance to the use of error correcting codes and system-level checkpointing are introduced and explained as applicable to the different application scenario requirements. Finally the third section proposes a roadmap of future trends in and perspectives on the dependability and manufacturability of advanced computing systems from the special point of view of industrial stakeholders. Dependable Multicore Architectures at Nanoscale showcases the original ideas and concepts introduced into the field of nanoscale manufacturing and systems reliability over nearly four years of work within COST Action IC1103 MEDIAN, a think-tank with participants from 27 countries. Academic researchers and graduate students working in multi-core computer systems and their manufacture will find this book of interest as will industrial design and manufacturing engineers working in VLSI companies.
Book Synopsis ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis by : ASM International
Download or read book ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Book Synopsis Long-Term Reliability of Nanometer VLSI Systems by : Sheldon Tan
Download or read book Long-Term Reliability of Nanometer VLSI Systems written by Sheldon Tan and published by Springer Nature. This book was released on 2019-09-12 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques. Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models; Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects; Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels; Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors and datacenters.
Book Synopsis Noise in Nanoscale Semiconductor Devices by : Tibor Grasser
Download or read book Noise in Nanoscale Semiconductor Devices written by Tibor Grasser and published by Springer Nature. This book was released on 2020-04-26 with total page 724 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book summarizes the state-of-the-art, regarding noise in nanometer semiconductor devices. Readers will benefit from this leading-edge research, aimed at increasing reliability based on physical microscopic models. Authors discuss the most recent developments in the understanding of point defects, e.g. via ab initio calculations or intricate measurements, which have paved the way to more physics-based noise models which are applicable to a wider range of materials and features, e.g. III-V materials, 2D materials, and multi-state defects. Describes the state-of-the-art, regarding noise in nanometer semiconductor devices; Enables readers to design more reliable semiconductor devices; Offers the most up-to-date information on point defects, based on physical microscopic models.
Book Synopsis Miniaturized Transistors by : Lado Filipovic
Download or read book Miniaturized Transistors written by Lado Filipovic and published by MDPI. This book was released on 2019-06-24 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: What is the future of CMOS? Sustaining increased transistor densities along the path of Moore's Law has become increasingly challenging with limited power budgets, interconnect bandwidths, and fabrication capabilities. In the last decade alone, transistors have undergone significant design makeovers; from planar transistors of ten years ago, technological advancements have accelerated to today's FinFETs, which hardly resemble their bulky ancestors. FinFETs could potentially take us to the 5-nm node, but what comes after it? From gate-all-around devices to single electron transistors and two-dimensional semiconductors, a torrent of research is being carried out in order to design the next transistor generation, engineer the optimal materials, improve the fabrication technology, and properly model future devices. We invite insight from investigators and scientists in the field to showcase their work in this Special Issue with research papers, short communications, and review articles that focus on trends in micro- and nanotechnology from fundamental research to applications.
Book Synopsis Springer Handbook of Semiconductor Devices by : Massimo Rudan
Download or read book Springer Handbook of Semiconductor Devices written by Massimo Rudan and published by Springer Nature. This book was released on 2022-11-10 with total page 1680 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Book Synopsis Electromigration in Metals by : Paul S. Ho
Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Book Synopsis Design Rules in a Semiconductor Foundry by : Eitan N. Shauly
Download or read book Design Rules in a Semiconductor Foundry written by Eitan N. Shauly and published by CRC Press. This book was released on 2022-11-30 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Book Synopsis Emerging Applications of Low Dimensional Magnets by : Ram K. Gupta
Download or read book Emerging Applications of Low Dimensional Magnets written by Ram K. Gupta and published by CRC Press. This book was released on 2022-11-28 with total page 335 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low-dimensional magnetic materials find their wide applications in many areas, including spintronics, memory devices, catalysis, biomedical, sensors, electromagnetic shielding, aerospace, and energy. This book provides a comprehensive discussion on magnetic nanomaterials for emerging applications. Fundamentals along with applications of low-dimensional magnetic materials in spintronics, catalysis, memory, biomedicals, toxic waste removal, aerospace, telecommunications, batteries, supercapacitors, flexible electronics, and many more are covered in detail to provide a full spectrum of their advanced applications. This book offers fresh aspects of nanomagnetic materials and innovative directions to scientists, researchers, and students. It will be of particular interest to materials scientists, engineers, physicists, chemists, and researchers in electronic and spintronic industries, and is suitable as a textbook for undergraduate and graduate studies.
Book Synopsis Understanding Logic Locking by : Kimia Zamiri Azar
Download or read book Understanding Logic Locking written by Kimia Zamiri Azar and published by Springer Nature. This book was released on 2023-10-24 with total page 385 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book demonstrates the breadth and depth of IP protection through logic locking, considering both attacker/adversary and defender/designer perspectives. The authors draw a semi-chronological picture of the evolution of logic locking during the last decade, gathering and describing all the DO’s and DON’Ts in this approach. They describe simple-to-follow scenarios and guide readers to navigate/identify threat models and design/evaluation flow for further studies. Readers will gain a comprehensive understanding of all fundamentals of logic locking.
Book Synopsis Advanced CMOS-Compatible Semiconductor Devices 18 by : J. A. Martino
Download or read book Advanced CMOS-Compatible Semiconductor Devices 18 written by J. A. Martino and published by The Electrochemical Society. This book was released on 2018-05-04 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Topics in Splines and Applications by : Young Kinh-Nhue Truong
Download or read book Topics in Splines and Applications written by Young Kinh-Nhue Truong and published by BoD – Books on Demand. This book was released on 2018-06-06 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: Splines provide a significant tool for the design of computationally economical curves and surfaces for the construction of various objects like automobiles, ship hulls, airplane fuselages and wings, propeller blades, shoe insoles, bottles, etc. It also contributes in the description of geological, physical, statistical, and even medical phenomena. Spline methods have proven to be indispensable in a variety of modern industries, including computer vision, robotics, signal and image processing, visualization, textile, graphic designs, and even media. This book aims to provide a valuable source on splines and their applications. It focuses on collecting and disseminating information in various disciplines including computer-aided geometric design, computer graphics, data visualization, data fitting, power systems, clinical and epidemiologic studies, disease detection, regression curves, social media, and biological studies. The book is useful for researchers, scientists, practitioners, and many others who seek state-of-the-art techniques and applications using splines. It is also useful for undergraduate senior students as well as graduate students in the areas of computer science, engineering, health science, statistics, and mathematics. Each chapter also provides useful information on software developments and their extensions.
Book Synopsis Microelectronics Fialure Analysis Desk Reference, Seventh Edition by : Tejinder Gandhi
Download or read book Microelectronics Fialure Analysis Desk Reference, Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Book Synopsis Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules by : Hsinjin Edwin Yang
Download or read book Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules written by Hsinjin Edwin Yang and published by William Andrew. This book was released on 2019-06-13 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules describes the durability and reliability behavior of polymers used in Si-photovoltaic modules and systems, particularly in terms of physical aging and degradation process/mechanisms, characterization methods, accelerated exposure chamber and testing, module level testing, and service life prediction. The book compares polymeric materials to traditional materials used in solar applications, explaining the degradation pathways of the different elements of a photovoltaic module, including encapsulant, front sheet, back sheet, wires and connectors, adhesives, sealants, and more. In addition, users will find sections on the tests needed for the evaluation of polymer degradation and aging, as well as accelerated tests to aid in materials selection. As demand for photovoltaics continues to grow globally, with polymer photovoltaics offering significantly lower production costs compared to earlier approaches, this book will serve as a welcome resource on new avenues. - Provides comprehensive coverage of photovoltaic polymers, from fundamental degradation mechanisms, to specific case studies of durability and materials failure - Offers practical, actionable information in relation to service life prediction of photovoltaic modules and accelerated testing for materials selection - Includes up-to-date information and interpretation of safety regulations and testing of photovoltaic modules and materials
