2016 IEEE International Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC)

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Publisher :
ISBN 13 : 9781509003860
Total Pages : pages
Book Rating : 4.0/5 (38 download)

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Book Synopsis 2016 IEEE International Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC) by :

Download or read book 2016 IEEE International Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC) written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

2016 IEEE International Interconnect Technology Conference Advanced Metallization Conference (IITC AMC)

Download 2016 IEEE International Interconnect Technology Conference Advanced Metallization Conference (IITC AMC) PDF Online Free

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Publisher :
ISBN 13 : 9781509003877
Total Pages : pages
Book Rating : 4.0/5 (38 download)

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Book Synopsis 2016 IEEE International Interconnect Technology Conference Advanced Metallization Conference (IITC AMC) by : IEEE Staff

Download or read book 2016 IEEE International Interconnect Technology Conference Advanced Metallization Conference (IITC AMC) written by IEEE Staff and published by . This book was released on 2016-05-23 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The IITC AMC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology

Handbook of Thin Film Deposition

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Publisher : William Andrew
ISBN 13 : 0128123125
Total Pages : 472 pages
Book Rating : 4.1/5 (281 download)

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Book Synopsis Handbook of Thin Film Deposition by : Krishna Seshan

Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2018-02-23 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics

Advances in Chemical Mechanical Planarization (CMP)

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Publisher : Woodhead Publishing
ISBN 13 : 0128218193
Total Pages : 650 pages
Book Rating : 4.1/5 (282 download)

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Book Synopsis Advances in Chemical Mechanical Planarization (CMP) by : Babu Suryadevara

Download or read book Advances in Chemical Mechanical Planarization (CMP) written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Nano Interconnects

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Publisher : CRC Press
ISBN 13 : 1000504298
Total Pages : 239 pages
Book Rating : 4.0/5 (5 download)

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Book Synopsis Nano Interconnects by : Afreen Khursheed

Download or read book Nano Interconnects written by Afreen Khursheed and published by CRC Press. This book was released on 2021-12-23 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.

CMOS Past, Present and Future

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Publisher : Woodhead Publishing
ISBN 13 : 0081021402
Total Pages : 280 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis CMOS Past, Present and Future by : Henry Radamson

Download or read book CMOS Past, Present and Future written by Henry Radamson and published by Woodhead Publishing. This book was released on 2018-04-03 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements. Addresses challenges and opportunities for the use of CMOS Covers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic components Provides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities

Springer Handbook of Semiconductor Devices

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Publisher : Springer Nature
ISBN 13 : 3030798275
Total Pages : 1680 pages
Book Rating : 4.0/5 (37 download)

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Book Synopsis Springer Handbook of Semiconductor Devices by : Massimo Rudan

Download or read book Springer Handbook of Semiconductor Devices written by Massimo Rudan and published by Springer Nature. This book was released on 2022-11-10 with total page 1680 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.

Design Rules in a Semiconductor Foundry

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Publisher : CRC Press
ISBN 13 : 1000631354
Total Pages : 831 pages
Book Rating : 4.0/5 (6 download)

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Book Synopsis Design Rules in a Semiconductor Foundry by : Eitan N. Shauly

Download or read book Design Rules in a Semiconductor Foundry written by Eitan N. Shauly and published by CRC Press. This book was released on 2022-11-30 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.

Nanocarbon Electronics

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Publisher : CRC Press
ISBN 13 : 1000064719
Total Pages : 279 pages
Book Rating : 4.0/5 ( download)

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Book Synopsis Nanocarbon Electronics by : Changjian Zhou

Download or read book Nanocarbon Electronics written by Changjian Zhou and published by CRC Press. This book was released on 2020-12-30 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive review of research on applications of carbon nanotubes (CNTs) and graphene to electronic devices. As nanocarbons in general, and CNTs and graphene in particular, are becoming increasingly recognized as the most promising materials for future generations of electronic devices, including transistors, sensors, and interconnects, a knowledge gap still exists between the basic science of nanocarbons and their feasibility for cost-effective product manufacturing. The book highlights some of the issues surrounding this missing link by providing a detailed review of the nanostructure and electronic properties, materials, and device fabrication and of the structure–property–application relationships.

Handbook of Silicon Wafer Cleaning Technology

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Publisher : William Andrew
ISBN 13 : 032351085X
Total Pages : 794 pages
Book Rating : 4.3/5 (235 download)

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Book Synopsis Handbook of Silicon Wafer Cleaning Technology by : Karen Reinhardt

Download or read book Handbook of Silicon Wafer Cleaning Technology written by Karen Reinhardt and published by William Andrew. This book was released on 2018-03-16 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process

Semiconductor Memories and Systems

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Publisher : Woodhead Publishing
ISBN 13 : 0128209461
Total Pages : 364 pages
Book Rating : 4.1/5 (282 download)

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Book Synopsis Semiconductor Memories and Systems by : Andrea Redaelli

Download or read book Semiconductor Memories and Systems written by Andrea Redaelli and published by Woodhead Publishing. This book was released on 2022-06-07 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor Memories and Systems provides a comprehensive overview of the current state of semiconductor memory at the technology and system levels. After an introduction on market trends and memory applications, the book focuses on mainstream technologies, illustrating their current status, challenges and opportunities, with special attention paid to scalability paths. Technologies discussed include static random access memory (SRAM), dynamic random access memory (DRAM), non-volatile memory (NVM), and NAND flash memory. Embedded memory and requirements and system level needs for storage class memory are also addressed. Each chapter covers physical operating mechanisms, fabrication technologies, and the main challenges to scalability. Finally, the work reviews the emerging trends for storage class memory, mainly focusing on the advantages and opportunities of phase change based memory technologies. Features contributions from experts from leading companies in semiconductor memory Discusses physical operating mechanisms, fabrication technologies and paths to scalability for current and emerging semiconductor memories Reviews primary memory technologies, including SRAM, DRAM, NVM and NAND flash memory Includes emerging storage class memory technologies such as phase change memory

Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 8

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Publisher : The Electrochemical Society
ISBN 13 : 1607688344
Total Pages : 188 pages
Book Rating : 4.6/5 (76 download)

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Book Synopsis Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 8 by : F. Roozeboom

Download or read book Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 8 written by F. Roozeboom and published by The Electrochemical Society. This book was released on 2018-05-04 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Zinc Oxide Based Nano Materials and Devices

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Publisher : BoD – Books on Demand
ISBN 13 : 1789239575
Total Pages : 148 pages
Book Rating : 4.7/5 (892 download)

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Book Synopsis Zinc Oxide Based Nano Materials and Devices by : , Prof. Dr. Ahmed Nahhas

Download or read book Zinc Oxide Based Nano Materials and Devices written by , Prof. Dr. Ahmed Nahhas and published by BoD – Books on Demand. This book was released on 2019-10-09 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a review of recent advances in ZnO-based nanomaterials and devices. ZnO as a nanomaterial has gained substantial interest in the research area of wide bandgap semiconductors and is considered to be one of the major candidates for electronic and photonic applications. ZnO has distinguished and interesting electrical and optical properties and is considered to be a potential material in optoelectronic applications such as solar cells, surface acoustic wave devices, and UV emitters. ZnO's unique properties have attracted several researchers to study its electrical and optical properties. As a nanostructured material, ZnO exhibits many advantages for nanodevices. Moreover, it has the ability to absorb the UV radiation.

3D Microelectronic Packaging

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Publisher : Springer
ISBN 13 : 3319445863
Total Pages : 465 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2017-01-20 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Selected Papers from the 20th European Workshop on Materials for Advanced Metallization 2011 (held Together with the International Interconnect Technology Conference IITC 2011) ; [... was Held in ... Dresden Congress Center, Germany ... from May 8 - 12, 2011 ... 34 Papers]

Download Selected Papers from the 20th European Workshop on Materials for Advanced Metallization 2011 (held Together with the International Interconnect Technology Conference IITC 2011) ; [... was Held in ... Dresden Congress Center, Germany ... from May 8 - 12, 2011 ... 34 Papers] PDF Online Free

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Publisher :
ISBN 13 :
Total Pages : 172 pages
Book Rating : 4.:/5 (931 download)

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Book Synopsis Selected Papers from the 20th European Workshop on Materials for Advanced Metallization 2011 (held Together with the International Interconnect Technology Conference IITC 2011) ; [... was Held in ... Dresden Congress Center, Germany ... from May 8 - 12, 2011 ... 34 Papers] by :

Download or read book Selected Papers from the 20th European Workshop on Materials for Advanced Metallization 2011 (held Together with the International Interconnect Technology Conference IITC 2011) ; [... was Held in ... Dresden Congress Center, Germany ... from May 8 - 12, 2011 ... 34 Papers] written by and published by . This book was released on 2013 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Atomic Layer Deposition for Semiconductors

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Publisher : Springer Science & Business Media
ISBN 13 : 146148054X
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Atomic Layer Deposition for Semiconductors by : Cheol Seong Hwang

Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.

2021 IEEE International Interconnect Technology Conference (IITC)

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Publisher :
ISBN 13 : 9781728176338
Total Pages : pages
Book Rating : 4.1/5 (763 download)

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Book Synopsis 2021 IEEE International Interconnect Technology Conference (IITC) by : IEEE Staff

Download or read book 2021 IEEE International Interconnect Technology Conference (IITC) written by IEEE Staff and published by . This book was released on 2021-07-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading edge research in the field of advanced metallization and 3D integration for ULSI IC applications The conference includes papers on all aspects of BEOL MOL interconnects and metallization, including design, unit process, integration and reliability