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Author : IEEE Staff
Publisher :
ISBN 13 : 9781457719813
Total Pages : pages
Book Rating : 4.7/5 (198 download)
Download or read book 2011 IEEE 13th Electronics Packaging Technology Conference written by IEEE Staff and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Components, Packaging, and Manufacturing Technology Society
Publisher :
ISBN 13 : 9781457719837
Total Pages : 838 pages
Book Rating : 4.7/5 (198 download)
Download or read book 2011 IEEE 13th Electronics Packaging Technology Conference written by Components, Packaging, and Manufacturing Technology Society and published by . This book was released on 2011-12-10 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th written by and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : YongAn Huang
Publisher : Springer
ISBN 13 : 981133627X
Total Pages : 287 pages
Book Rating : 4.8/5 (113 download)
Download or read book Modeling and Application of Flexible Electronics Packaging written by YongAn Huang and published by Springer. This book was released on 2019-04-23 with total page 287 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Author :
Publisher :
ISBN 13 : 9781479928323
Total Pages : pages
Book Rating : 4.9/5 (283 download)
Download or read book 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Preeti S Chauhan
Publisher : Springer Science & Business Media
ISBN 13 : 1461457610
Total Pages : 254 pages
Book Rating : 4.4/5 (614 download)
Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Author : S. W. Ricky Lee
Publisher : John Wiley & Sons
ISBN 13 : 1118881559
Total Pages : 256 pages
Book Rating : 4.1/5 (188 download)
Download or read book From LED to Solid State Lighting written by S. W. Ricky Lee and published by John Wiley & Sons. This book was released on 2021-09-17 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
Author : Duixian Liu
Publisher : John Wiley & Sons
ISBN 13 : 1119556643
Total Pages : 416 pages
Book Rating : 4.1/5 (195 download)
Download or read book Antenna-in-Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-10 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author :
Publisher : ASM International
ISBN 13 : 1627082735
Total Pages : 540 pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author : Michael J. McGrath
Publisher : Apress
ISBN 13 : 1430260149
Total Pages : 321 pages
Book Rating : 4.4/5 (32 download)
Download or read book Sensor Technologies written by Michael J. McGrath and published by Apress. This book was released on 2014-01-23 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sensor Technologies: Healthcare, Wellness and Environmental Applications explores the key aspects of sensor technologies, covering wired, wireless, and discrete sensors for the specific application domains of healthcare, wellness and environmental sensing. It discusses the social, regulatory, and design considerations specific to these domains. The book provides an application-based approach using real-world examples to illustrate the application of sensor technologies in a practical and experiential manner. The book guides the reader from the formulation of the research question, through the design and validation process, to the deployment and management phase of sensor applications. The processes and examples used in the book are primarily based on research carried out by Intel or joint academic research programs. “Sensor Technologies: Healthcare, Wellness and Environmental Applications provides an extensive overview of sensing technologies and their applications in healthcare, wellness, and environmental monitoring. From sensor hardware to system applications and case studies, this book gives readers an in-depth understanding of the technologies and how they can be applied. I would highly recommend it to students or researchers who are interested in wireless sensing technologies and the associated applications.” Dr. Benny Lo Lecturer, The Hamlyn Centre, Imperial College of London “This timely addition to the literature on sensors covers the broad complexity of sensing, sensor types, and the vast range of existing and emerging applications in a very clearly written and accessible manner. It is particularly good at capturing the exciting possibilities that will occur as sensor networks merge with cloud-based ‘big data’ analytics to provide a host of new applications that will impact directly on the individual in ways we cannot fully predict at present. It really brings this home through the use of carefully chosen case studies that bring the overwhelming concept of 'big data' down to the personal level of individual life and health.” Dermot Diamond Director, National Centre for Sensor Research, Principal Investigator, CLARITY Centre for Sensor Web Technologies, Dublin City University "Sensor Technologies: Healthcare, Wellness and Environmental Applications takes the reader on an end-to-end journey of sensor technologies, covering the fundamentals from an engineering perspective, introducing how the data gleaned can be both processed and visualized, in addition to offering exemplar case studies in a number of application domains. It is a must-read for those studying any undergraduate course that involves sensor technologies. It also provides a thorough foundation for those involved in the research and development of applied sensor systems. I highly recommend it to any engineer who wishes to broaden their knowledge in this area!" Chris Nugent Professor of Biomedical Engineering, University of Ulster
Download or read book IEEE 15th Electronics Packaging Technology Conference written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yan Li
Publisher : Springer Nature
ISBN 13 : 9811950539
Total Pages : 628 pages
Book Rating : 4.8/5 (119 download)
Download or read book Advanced Driver Assistance Systems and Autonomous Vehicles written by Yan Li and published by Springer Nature. This book was released on 2022-10-28 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology
Author : Navid Asadizanjani
Publisher : Springer Nature
ISBN 13 : 3030626091
Total Pages : 193 pages
Book Rating : 4.0/5 (36 download)
Download or read book Physical Assurance written by Navid Asadizanjani and published by Springer Nature. This book was released on 2021-02-15 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Author : W.-P. Dow
Publisher : The Electrochemical Society
ISBN 13 : 1607688549
Total Pages : 57 pages
Book Rating : 4.6/5 (76 download)
Download or read book Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB written by W.-P. Dow and published by The Electrochemical Society. This book was released on 2018-09-21 with total page 57 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Haleh Ardebili
Publisher : William Andrew
ISBN 13 : 0128119799
Total Pages : 510 pages
Book Rating : 4.1/5 (281 download)
Download or read book Encapsulation Technologies for Electronic Applications written by Haleh Ardebili and published by William Andrew. This book was released on 2018-10-23 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
Author : A. S. M. International
Publisher : ASM International
ISBN 13 : 1627080740
Total Pages : 561 pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2014 written by A. S. M. International and published by ASM International. This book was released on 2014-11-01 with total page 561 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Author : Marcin Słoma
Publisher : Walter de Gruyter GmbH & Co KG
ISBN 13 : 3110793601
Total Pages : 154 pages
Book Rating : 4.1/5 (17 download)
Download or read book Additive Manufacturing of Structural Electronics written by Marcin Słoma and published by Walter de Gruyter GmbH & Co KG. This book was released on 2024-05-06 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt: Additive manufacturing, also called rapid prototyping or 3D printing is a disruptive manufacturing technique with a significant impact in electronics. With 3D printing, bulk objects with circuitry are embedded in the volume of an element or conformally coated on the surface of existing parts, allowing design and manufacturing of smaller and lighter products with fast customisation. The book covers both materials selection and techniques. The scope also covers the research areas of additive manufacturing of passive and active components, sensors, energy storage, bioelectronics and more.
