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Author :
Publisher :
ISBN 13 :
Total Pages : 1046 pages
Book Rating : 4.:/5 (318 download)
Download or read book 2003 International Symposium on Microelectronics written by and published by . This book was released on 2003 with total page 1046 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : J. A. Martino
Publisher : The Electrochemical Society
ISBN 13 : 9781566773898
Total Pages : 476 pages
Book Rating : 4.7/5 (738 download)
Download or read book Microelectronics Technology and Devices, SBMICRO 2003 written by J. A. Martino and published by The Electrochemical Society. This book was released on 2003 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9780930815622
Total Pages : 886 pages
Book Rating : 4.8/5 (156 download)
Download or read book 2000 International Symposium on Microelectronics written by and published by . This book was released on 2000 with total page 886 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Fred D. Barlow, III
Publisher : CRC Press
ISBN 13 : 1420018965
Total Pages : 456 pages
Book Rating : 4.4/5 (2 download)
Download or read book Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and published by CRC Press. This book was released on 2018-10-03 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author : Ephraim Suhir
Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)
Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author : Suman Lata Tripathi
Publisher : CRC Press
ISBN 13 : 1000168158
Total Pages : 379 pages
Book Rating : 4.0/5 (1 download)
Download or read book Advanced VLSI Design and Testability Issues written by Suman Lata Tripathi and published by CRC Press. This book was released on 2020-08-18 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book facilitates the VLSI-interested individuals with not only in-depth knowledge, but also the broad aspects of it by explaining its applications in different fields, including image processing and biomedical. The deep understanding of basic concepts gives you the power to develop a new application aspect, which is very well taken care of in this book by using simple language in explaining the concepts. In the VLSI world, the importance of hardware description languages cannot be ignored, as the designing of such dense and complex circuits is not possible without them. Both Verilog and VHDL languages are used here for designing. The current needs of high-performance integrated circuits (ICs) including low power devices and new emerging materials, which can play a very important role in achieving new functionalities, are the most interesting part of the book. The testing of VLSI circuits becomes more crucial than the designing of the circuits in this nanometer technology era. The role of fault simulation algorithms is very well explained, and its implementation using Verilog is the key aspect of this book. This book is well organized into 20 chapters. Chapter 1 emphasizes on uses of FPGA on various image processing and biomedical applications. Then, the descriptions enlighten the basic understanding of digital design from the perspective of HDL in Chapters 2–5. The performance enhancement with alternate material or geometry for silicon-based FET designs is focused in Chapters 6 and 7. Chapters 8 and 9 describe the study of bimolecular interactions with biosensing FETs. Chapters 10–13 deal with advanced FET structures available in various shapes, materials such as nanowire, HFET, and their comparison in terms of device performance metrics calculation. Chapters 14–18 describe different application-specific VLSI design techniques and challenges for analog and digital circuit designs. Chapter 19 explains the VLSI testability issues with the description of simulation and its categorization into logic and fault simulation for test pattern generation using Verilog HDL. Chapter 20 deals with a secured VLSI design with hardware obfuscation by hiding the IC’s structure and function, which makes it much more difficult to reverse engineer.
Author :
Publisher :
ISBN 13 :
Total Pages : 992 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings of the ... International Symposium on Microelectronics written by and published by . This book was released on 2002 with total page 992 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Electrochemical Society. Meeting
Publisher : The Electrochemical Society
ISBN 13 : 9781566774123
Total Pages : 332 pages
Book Rating : 4.7/5 (741 download)
Download or read book Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices written by Electrochemical Society. Meeting and published by The Electrochemical Society. This book was released on 2004 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Spie
Publisher :
ISBN 13 : 9780819417145
Total Pages : pages
Book Rating : 4.4/5 (171 download)
Download or read book 27th International Symposium on Microelectronics written by Spie and published by . This book was released on 1994-01-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 969 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 969 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Michael Kraft
Publisher : Elsevier
ISBN 13 : 0857096486
Total Pages : 358 pages
Book Rating : 4.8/5 (57 download)
Download or read book Mems for Automotive and Aerospace Applications written by Michael Kraft and published by Elsevier. This book was released on 2013-01-02 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries. Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for aerospace applications, including devices for active drag reduction in aerospace applications, inertial navigation and structural health monitoring systems, and thrusters for nano- and pico-satellites. A selection of case studies are used to explore MEMS for harsh environment sensors in aerospace applications, before the book concludes by considering the use of MEMS in space exploration and exploitation. With its distinguished editors and international team of expert contributors, MEMS for automotive and aerospace applications is a key tool for MEMS manufacturers and all scientists, engineers and academics working on MEMS and intelligent systems for transportation. Chapters consider the role of MEMS in a number of automotive applications, including passenger safety and comfort, vehicle stability and control MEMS for aerospace applications are also discussed, including active drag reduction, inertial navigation and structural health monitoring systems Presents a number of case studies exploring MEMS for harsh environment sensors in aerospace
Author : Richard K. Ulrich
Publisher : John Wiley & Sons
ISBN 13 : 0471466093
Total Pages : 852 pages
Book Rating : 4.4/5 (714 download)
Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author : Roger Narayan
Publisher : Springer Nature
ISBN 13 : 3030492060
Total Pages : 728 pages
Book Rating : 4.0/5 (34 download)
Download or read book Biomedical Materials written by Roger Narayan and published by Springer Nature. This book was released on 2020-12-09 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition provides a comprehensive discussion of contemporary materials used in biomedical research and development. The pedagogical writing style and structure provides students with an understanding of the fundamental concepts necessary to pursue research and industrial work in this growing area of biomedical science, including characteristics of biomaterials, biological processes, biocompatibility, and applications of materials in implants and medical instruments. Written by leading researchers in the field, this volume highlights important topics associated with biomedical engineering, medicine and surgery. The revised text contains updates that reflect recent technological advances in biomedical materials. It contains information on new characterization methods and applications for biomedical materials and incorporates suggestions that were offered by readers and educators using the first edition over the years. This textbook takes the reader to the forefront of biomedical materials development, providing graduate students with a taste of how the field is changing, while also serving as a useful reference to physicians and engineers.
Author : International Symposium on Microelectronics
Publisher :
ISBN 13 : 9780930815448
Total Pages : 584 pages
Book Rating : 4.8/5 (154 download)
Download or read book 1995 International Symposium on Microelectronics written by International Symposium on Microelectronics and published by . This book was released on 1995 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Dirk Ortloff
Publisher : Springer Science & Business Media
ISBN 13 : 3709107067
Total Pages : 216 pages
Book Rating : 4.7/5 (91 download)
Download or read book MEMS Product Engineering written by Dirk Ortloff and published by Springer Science & Business Media. This book was released on 2013-10-11 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides the methodological background to directing cooperative product engineering projects in a micro and nanotechnology setting. The methodology is based on well-established methods like PRINCE2 and StageGate, which are supplemented by best practices that can be individually tailored to the actual nature and size of the project at hand. This book is intended for everyone who takes an active role in either practical product engineering or in teaching it. This includes project and product management staff and program management offices in companies working on innovation projects, those active in innovation, as well as professors and students in engineering and management.
Author : Yi (Grace) Li
Publisher : Springer Science & Business Media
ISBN 13 : 0387887830
Total Pages : 445 pages
Book Rating : 4.3/5 (878 download)
Download or read book Electrical Conductive Adhesives with Nanotechnologies written by Yi (Grace) Li and published by Springer Science & Business Media. This book was released on 2009-10-08 with total page 445 pages. Available in PDF, EPUB and Kindle. Book excerpt: “Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author : Edval J. P. Santos
Publisher : The Electrochemical Society
ISBN 13 : 9781566774161
Total Pages : 418 pages
Book Rating : 4.7/5 (741 download)
Download or read book Microelectronics Technology and Devices, SBMICRO 2004 written by Edval J. P. Santos and published by The Electrochemical Society. This book was released on 2004 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:
