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Author :
Publisher :
ISBN 13 :
Total Pages : 194 pages
Book Rating : 4.E/5 ( download)
Download or read book 2002 7th International Symposium on Plasma- and Process-Induced Damage written by and published by . This book was released on 2002 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Han-Ming Wu
Publisher : The Electrochemical Society
ISBN 13 : 1566778069
Total Pages : 1203 pages
Book Rating : 4.5/5 (667 download)
Download or read book China Semiconductor Technology International Conference 2010 (CSTIC 2010) written by Han-Ming Wu and published by The Electrochemical Society. This book was released on 2010-03 with total page 1203 pages. Available in PDF, EPUB and Kindle. Book excerpt: Our mission is to provide a forum for world experts to discuss technologies, address the growing needs associated with silicon technology, and exchange their discoveries and solutions for current issues of high interest. We encourage collaboration, open discussion, and critical reviews at this conference. Furthermore, we hope that this conference will also provide collaborative opportunities for those who are interested in the semiconductor industry in Asia, particularly in China.
Author : Karen A. Reinhardt
Publisher : John Wiley & Sons
ISBN 13 : 1118099516
Total Pages : 596 pages
Book Rating : 4.1/5 (18 download)
Download or read book Handbook for Cleaning for Semiconductor Manufacturing written by Karen A. Reinhardt and published by John Wiley & Sons. This book was released on 2011-04-12 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.
Author : Alexander A. Demkov
Publisher : Springer Science & Business Media
ISBN 13 : 1402030789
Total Pages : 477 pages
Book Rating : 4.4/5 (2 download)
Download or read book Materials Fundamentals of Gate Dielectrics written by Alexander A. Demkov and published by Springer Science & Business Media. This book was released on 2006-05-24 with total page 477 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents materials fundamentals of novel gate dielectrics that are being introduced into semiconductor manufacturing to ensure the continuous scalling of the CMOS devices. This is a very fast evolving field of research so we choose to focus on the basic understanding of the structure, thermodunamics, and electronic properties of these materials that determine their performance in device applications. Most of these materials are transition metal oxides. Ironically, the d-orbitals responsible for the high dielectric constant cause sever integration difficulties thus intrinsically limiting high-k dielectrics. Though new in the electronics industry many of these materials are wel known in the field of ceramics, and we describe this unique connection. The complexity of the structure-property relations in TM oxides makes the use of the state of the art first-principles calculations necessary. Several chapters give a detailed description of the modern theory of polarization, and heterojunction band discontinuity within the framework of the density functional theory. Experimental methods include oxide melt solution calorimetry and differential scanning calorimetry, Raman scattering and other optical characterization techniques, transmission electron microscopy, and x-ray photoelectron spectroscopy. Many of the problems encounterd in the world of CMOS are also relvant for other semiconductors such as GaAs. A comprehensive review of recent developments in this field is thus also given. The book should be of interest to those actively engaged in the gate dielectric research, and to graduate students in Materials Science, Materials Physics, Materials Chemistry, and Electrical Engineering.
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Author : Ram Ekwal Sah
Publisher : The Electrochemical Society
ISBN 13 : 9781566774598
Total Pages : 606 pages
Book Rating : 4.7/5 (745 download)
Download or read book Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Other Emerging Diele[c]trics VIII written by Ram Ekwal Sah and published by The Electrochemical Society. This book was released on 2005 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Zhenghao Gan
Publisher : McGraw Hill Professional
ISBN 13 : 0071754288
Total Pages : 528 pages
Book Rating : 4.0/5 (717 download)
Download or read book Semiconductor Process Reliability in Practice written by Zhenghao Gan and published by McGraw Hill Professional. This book was released on 2012-10-06 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown
Author : Electronic Device Failure Analysis Society
Publisher : ASM International
ISBN 13 : 1615030891
Total Pages : 524 pages
Book Rating : 4.6/5 (15 download)
Download or read book ISTFA 2006 written by Electronic Device Failure Analysis Society and published by ASM International. This book was released on 2006 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Cher Ming Tan
Publisher : World Scientific
ISBN 13 : 9814273325
Total Pages : 312 pages
Book Rating : 4.8/5 (142 download)
Download or read book Electromigration in ULSI Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.
Author :
Publisher :
ISBN 13 : 9780965157759
Total Pages : 0 pages
Book Rating : 4.1/5 (577 download)
Download or read book Plasma- and Process-Induced Damage, 2001 6th International Symposium on written by and published by . This book was released on 2001 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Francesc Moll
Publisher : Springer Science & Business Media
ISBN 13 : 0306487195
Total Pages : 214 pages
Book Rating : 4.3/5 (64 download)
Download or read book Interconnection Noise in VLSI Circuits written by Francesc Moll and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.
Author : Amara Amara
Publisher : Springer Science & Business Media
ISBN 13 : 9048193796
Total Pages : 266 pages
Book Rating : 4.0/5 (481 download)
Download or read book Emerging Technologies and Circuits written by Amara Amara and published by Springer Science & Business Media. This book was released on 2010-09-28 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Emerging Technologies and Circuits contains a set of outstanding papers, keynote and tutorials presented during 3 days at the International Conference On Integrated Circuit Design and Technology (ICICDT) held in June 2008 in Minatec, Grenoble.
Download or read book 2003 8th International Symposium on Plasma- and Process-induced Damage written by and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : G. S. Mathad
Publisher :
ISBN 13 : 9781566773416
Total Pages : 342 pages
Book Rating : 4.7/5 (734 download)
Download or read book Plasma Processing XIV written by G. S. Mathad and published by . This book was released on 2002 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Manfred Glesner
Publisher : Springer
ISBN 13 : 0387334033
Total Pages : 315 pages
Book Rating : 4.3/5 (873 download)
Download or read book VLSI-SOC: From Systems to Chips written by Manfred Glesner and published by Springer. This book was released on 2006-08-16 with total page 315 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book.
Author : Samares Kar
Publisher :
ISBN 13 :
Total Pages : 330 pages
Book Rating : 4.3/5 (91 download)
Download or read book Physics and Technology of High-k Gate Dielectrics I written by Samares Kar and published by . This book was released on 2003 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : L. Cook
Publisher : The Electrochemical Society
ISBN 13 : 9781566774253
Total Pages : 362 pages
Book Rating : 4.7/5 (742 download)
Download or read book Interfaces in Electronic Materials written by L. Cook and published by The Electrochemical Society. This book was released on 2006 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Christos H. Skiadas
Publisher : CRC Press
ISBN 13 : 1466590440
Total Pages : 934 pages
Book Rating : 4.4/5 (665 download)
Download or read book Handbook of Applications of Chaos Theory written by Christos H. Skiadas and published by CRC Press. This book was released on 2017-12-19 with total page 934 pages. Available in PDF, EPUB and Kindle. Book excerpt: In addition to explaining and modeling unexplored phenomena in nature and society, chaos uses vital parts of nonlinear dynamical systems theory and established chaotic theory to open new frontiers and fields of study. Handbook of Applications of Chaos Theory covers the main parts of chaos theory along with various applications to diverse areas. Expert contributors from around the world show how chaos theory is used to model unexplored cases and stimulate new applications. Accessible to scientists, engineers, and practitioners in a variety of fields, the book discusses the intermittency route to chaos, evolutionary dynamics and deterministic chaos, and the transition to phase synchronization chaos. It presents important contributions on strange attractors, self-exciting and hidden attractors, stability theory, Lyapunov exponents, and chaotic analysis. It explores the state of the art of chaos in plasma physics, plasma harmonics, and overtone coupling. It also describes flows and turbulence, chaotic interference versus decoherence, and an application of microwave networks to the simulation of quantum graphs. The book proceeds to give a detailed presentation of the chaotic, rogue, and noisy optical dissipative solitons; parhelic-like circle and chaotic light scattering; and interesting forms of the hyperbolic prism, the Poincaré disc, and foams. It also covers numerous application areas, from the analysis of blood pressure data and clinical digital pathology to chaotic pattern recognition to economics to musical arts and research.
