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Author :
Publisher :
ISBN 13 : 9780818627279
Total Pages : 181 pages
Book Rating : 4.6/5 (272 download)
Download or read book Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92 written by and published by . This book was released on 1992 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 1992 IEEE Multi-Chip Module Conference, MCMC-92 written by and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers, Inc. Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book Multi-Chip Module Conference (MCMC-92 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1992 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Daryl Ann Doane
Publisher : Springer Science & Business Media
ISBN 13 : 1461531004
Total Pages : 895 pages
Book Rating : 4.4/5 (615 download)
Download or read book Multichip Module Technologies and Alternatives: The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Author : IEEE
Publisher :
ISBN 13 :
Total Pages : 210 pages
Book Rating : 4.3/5 (91 download)
Download or read book Multi-Chip Module Conference written by IEEE and published by . This book was released on 1992 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Computer Society Staff
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9780780305069
Total Pages : 200 pages
Book Rating : 4.3/5 (5 download)
Download or read book IEEE Multi-Chip Module Conference, 1992 written by IEEE Computer Society Staff and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1992-03-01 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Sriram Dasu
Publisher : Springer Science & Business Media
ISBN 13 : 9401113904
Total Pages : 290 pages
Book Rating : 4.4/5 (11 download)
Download or read book Management of Design written by Sriram Dasu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: Product design significantly influences product cost and quality, as well as market share and profitability of a firm. Design projects often involve many people belonging to different functional areas and in many organizations several design projects may be under way at the same time. Due to this complexity, management of design has given rise to a rich set of research problems in management and engineering. In this volume, design is considered as the planning and specification activity prior to fabrication. Design determines what products will be produced, how they will be produced, and when they will be introduced into the market. The quality of the products and the speed with which they are developed are significantly affected by the design process. The design process by which a product is developed is determined by the managerial and engineering practices, tools and techniques. This book presents engineering and management perspectives on design. Topics covered include: Decomposition of product development projects; Tools and techniques for preliminary evaluation of designs; Interface between design and manufacturing, assembly and distribution; Design information flows, and Determination of the scope, timing and duration of projects, and the allocation of resources.
Author :
Publisher : IEEE Computer Society
ISBN 13 : 9780818635427
Total Pages : 203 pages
Book Rating : 4.6/5 (354 download)
Download or read book 1993 IEEE Multi-Chip Module Conference, MCMC-93 written by and published by IEEE Computer Society. This book was released on 1993 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9780818655623
Total Pages : 150 pages
Book Rating : 4.6/5 (556 download)
Download or read book 1994 IEEE Multi-Chip Module Conference written by and published by . This book was released on 1994 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Computer Society Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book Multi-Chip Module Conference, 1997 IEEE (MCMC-97). written by IEEE Computer Society Staff and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 1994 IEEE Multi-Chip Module Conference MCMC 1994 written by and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers, Inc. Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book Multi-Chip Module Conference, 1996 IEEE (MCMC-96 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1996 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ray T. Chen
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 476 pages
Book Rating : 4.F/5 ( download)
Download or read book Optoelectronic Interconnects and Packaging written by Ray T. Chen and published by SPIE-International Society for Optical Engineering. This book was released on 1996 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author :
Publisher : IEEE Computer Society
ISBN 13 : 9780818669705
Total Pages : 233 pages
Book Rating : 4.6/5 (697 download)
Download or read book Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California written by and published by IEEE Computer Society. This book was released on 1994 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEEE Multi-Chip Module Conference (MCMC) brings together elements of packaging technology and design, circuits and system design, computer-aided design, modeling, analysis, and education. The proceedings of MCMC'95 comprise papers and posters on manufacturing issues, applications, field programm
Author : Institute of Electrical and Electronics Engineers, Inc. Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book Multi-Chip Module Conference (MCMC-94 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers, Inc. Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book Multi-Chip Module Conference (MCMC-95 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1995 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 232 pages
Book Rating : 4.3/5 (91 download)
Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 1993 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:
