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Author :
Publisher :
ISBN 13 :
Total Pages : 504 pages
Book Rating : 4.3/5 (91 download)
Download or read book IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. written by and published by . This book was released on 1997 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9780780355026
Total Pages : 479 pages
Book Rating : 4.3/5 (55 download)
Download or read book Twenty Fourth IEEE CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 1999 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9780780355033
Total Pages : 479 pages
Book Rating : 4.3/5 (55 download)
Download or read book Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1999-01-01 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Chee Kai Chua
Publisher : World Scientific
ISBN 13 : 9811218374
Total Pages : 384 pages
Book Rating : 4.8/5 (112 download)
Download or read book 3d Printing And Additive Manufacturing Of Electronics: Principles And Applications written by Chee Kai Chua and published by World Scientific. This book was released on 2021-05-14 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D printed electronics have captured much attention in recent years, owing to their success in allowing on-demand fabrication of highly-customisable electronics on a wide variety of substrates and conformal surfaces. This textbook helps readers understand and gain valuable insights into 3D printed electronics. It does not require readers to have any prior knowledge on the subject.3D Printing and Additive Manufacturing of Electronics: Principles and Applications provides a comprehensive overview of the recent progress and discusses the fundamentals of the 3D printed electronics technologies, their respective advantages, shortcomings and potential applications. The book covers conventional contact printing techniques for printed electronics, 3D electronics printing techniques, materials and inks inks for 3D-printed electronics, substrates and processing for 3D-printed electronics, sintering techniques for metallic nanoparticle inks, designs and simulations, applications of 3D-printed electronics, and future trends. The book includes several related problems for the reader to test his or her understanding of the topics.This book is a good guide for anyone who is interested in the 3D printing of electronics. The book is also an effective textbook for undergraduate and graduate courses that aim to arm their students with a thorough understanding of the fundamentals of 3D printed electronics.Related Link(s)
Author : Florin Pop
Publisher : Springer Nature
ISBN 13 : 3030388360
Total Pages : 300 pages
Book Rating : 4.0/5 (33 download)
Download or read book Big Data Platforms and Applications written by Florin Pop and published by Springer Nature. This book was released on 2021-09-28 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a review of advanced topics relating to the theory, research, analysis and implementation in the context of big data platforms and their applications, with a focus on methods, techniques, and performance evaluation. The explosive growth in the volume, speed, and variety of data being produced every day requires a continuous increase in the processing speeds of servers and of entire network infrastructures, as well as new resource management models. This poses significant challenges (and provides striking development opportunities) for data intensive and high-performance computing, i.e., how to efficiently turn extremely large datasets into valuable information and meaningful knowledge. The task of context data management is further complicated by the variety of sources such data derives from, resulting in different data formats, with varying storage, transformation, delivery, and archiving requirements. At the same time rapid responses are needed for real-time applications. With the emergence of cloud infrastructures, achieving highly scalable data management in such contexts is a critical problem, as the overall application performance is highly dependent on the properties of the data management service.
Author : Don Millard
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 504 pages
Book Rating : 4.:/5 (318 download)
Download or read book Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA written by Don Millard and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Author : Oded Maler
Publisher : Springer Science & Business Media
ISBN 13 : 3540009132
Total Pages : 569 pages
Book Rating : 4.5/5 (4 download)
Download or read book Hybrid Systems: Computation and Control written by Oded Maler and published by Springer Science & Business Media. This book was released on 2003-03-18 with total page 569 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitues the refereed proceedings of the 6th International Workshop on Hybrid Systems: Computation and Control, HSCC 2003, held in Prague, Czech Republic, in April 2003. The 36 revised full papers presented were carefully reviewed and selected from 75 submissions. All current issues in hybrid systems are addressed including formal methods for analysis and control, computational tools, as well as innovative applications in various fields such as automotive control, the immune system, electrical circuits, operating systems, and human brains.
Author :
Publisher :
ISBN 13 :
Total Pages : 370 pages
Book Rating : 4.0/5 ( download)
Download or read book IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 2004 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Dimitrios A. Lamprou
Publisher : MDPI
ISBN 13 : 3039364235
Total Pages : 436 pages
Book Rating : 4.0/5 (393 download)
Download or read book 3D Printing of Pharmaceuticals and Drug Delivery Devices written by Dimitrios A. Lamprou and published by MDPI. This book was released on 2020-07-01 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 3D printing (3DP) process was patented in 1986; however, only in the last decade has it begun to be used for medical applications, as well as in the fields of prosthetics, bio-fabrication, and pharmaceutical printing. 3DP or additive manufacturing (AM) is a family of technologies that implement layer-by-layer processes in order to fabricate physical models based on a computer aided design (CAD) model. 3D printing permits the fabrication of high degrees of complexity with great reproducibility in a fast and cost-effective fashion. 3DP technology offers a new paradigm for the direct manufacture of individual dosage forms and has the potential to allow for variations in size and geometry as well as control dose and release behavior. Furthermore, the low cost and ease of use of 3DP systems means that the possibility of manufacturing medicines and medical devices at the point of dispensing or at the point of use could become a reality. 3DP thus offers the perfect innovative manufacturing route to address the critical capability gap that hinders the widespread exploitation of personalized medicines for molecules that are currently not easy to deliver. This Special Issue will address new developments in the area of 3D printing and bioprinting for drug delivery applications, covering the recent advantages and future directions of additive manufacturing for pharmaceutical products.
Author : Freek Wiedijk
Publisher : Springer
ISBN 13 : 354036580X
Total Pages : 569 pages
Book Rating : 4.5/5 (43 download)
Download or read book Hybrid Systems: Computation and Control written by Freek Wiedijk and published by Springer. This book was released on 2003-07-01 with total page 569 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains the proceedings of the Sixth Workshop on Hybrid Systems: Computation and Control (HSCC 2003), which was held in Prague, during April 3–5, 2003. The Hybrid Systems workshops attract researchers interested in the modeling, analysis, control, and implementation of systems which involve the interaction of both discrete and continuous state dynamics. The newest results and latest developments in hybrid system models, formal methods for analysis and control, computational tools, as well as new applications and examples are presented at these annual meetings. The Sixth Workshop continued the series of workshops held in Grenoble, France (HART’97), Berkeley, California, USA (HSCC’98), Nijmegen, The Neth- lands (HSCC’99), Pittsburgh, Pennsylvania, USA (HSCC 2000), Rome, Italy (HSCC 2001), and Stanford, California, USA (HSCC 2002). Proceedings of these workshops have been published by Springer-Verlag in the Lecture Notes in C- puter Science (LNCS) series. This year we assembled a technical program committee with a broad expertise in formal methods in computer science, control theory, applied mathematics, and arti?cial intelligence. We received a set of 75 high-quality submitted papers. After detailed review and discussion of these papers by the program committee, 36 papers were accepted for presentation at the workshop, and the ?nal versions of these papers appear in this volume.
Author : Nam P. Suh
Publisher : Oxford University Press, USA
ISBN 13 : 0195178769
Total Pages : 313 pages
Book Rating : 4.1/5 (951 download)
Download or read book Complexity written by Nam P. Suh and published by Oxford University Press, USA. This book was released on 2005 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: Suh (mechanical engineering, Massachusetts, Institute of Technology) offers a general theoretical framework that may be used to solve complexity problems in engineering, science, and even in certain nontechnical areas.
Author : YongAn Huang
Publisher : Springer
ISBN 13 : 981133627X
Total Pages : 297 pages
Book Rating : 4.8/5 (113 download)
Download or read book Modeling and Application of Flexible Electronics Packaging written by YongAn Huang and published by Springer. This book was released on 2019-04-23 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Author : C. P.(Ching-Ping) Wong
Publisher : Springer Nature
ISBN 13 : 303049991X
Total Pages : 582 pages
Book Rating : 4.0/5 (34 download)
Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C. P.(Ching-Ping) Wong and published by Springer Nature. This book was released on 2021-03-17 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Author : Paul Siffert
Publisher : Springer Science & Business Media
ISBN 13 : 3662098970
Total Pages : 552 pages
Book Rating : 4.6/5 (62 download)
Download or read book Silicon written by Paul Siffert and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use of silicon, the basis for the revolutionary changes in our lives sometimes called "The Silicon Age." Beginning with the very first developments more than 50 years ago, this reports on all aspects of silicon and silicon technology up to its use in exciting new technologies, including a glance at possible future developments.
Author : R.R. Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 1461560373
Total Pages : 1060 pages
Book Rating : 4.4/5 (615 download)
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author : James E. Morris
Publisher : Springer
ISBN 13 : 3319903624
Total Pages : 1007 pages
Book Rating : 4.3/5 (199 download)
Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author : Chong Leong, Gan
Publisher : Springer Nature
ISBN 13 : 3031267087
Total Pages : 223 pages
Book Rating : 4.0/5 (312 download)
Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
