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Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections Noises And Parasites
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Book Synopsis Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites by : Christian Gontrand
Download or read book Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites written by Christian Gontrand and published by Bentham Science Publishers. This book was released on 2014-04-21 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels
Book Synopsis Towards a Modeling Synthesis of Two Or Three-Dimensional Circuits Through Substrate Coupling and Interconnections by : Christian Gontrand
Download or read book Towards a Modeling Synthesis of Two Or Three-Dimensional Circuits Through Substrate Coupling and Interconnections written by Christian Gontrand and published by . This book was released on 2014-04-21 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: "The number of transistors in integrated circuits doubles every two years, as stipulated by Moore's law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years - currently advanced to the nanomet"
Book Synopsis Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement by : Yue Ma
Download or read book Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement written by Yue Ma and published by CRC Press. This book was released on 2019-03-08 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
Book Synopsis Analog Devices and Circuits 2 by : Christian Gontrand
Download or read book Analog Devices and Circuits 2 written by Christian Gontrand and published by John Wiley & Sons. This book was released on 2024-02-23 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: At the end of the Second World War, a new technological trend was born: integrated electronics. This trend relied on the enormous rise of integrable electronic devices. Analog Devices and Circuits is composed of two volumes: the first deals with analog components, and the second with associated analog circuits. The goal here is not to create an overly comprehensive analysis, but rather to break it down into smaller sections, thus highlighting the complexity and breadth of the field. This first volume, after a brief history, describes the two main devices, namely bipolar transistors and MOS, with particular importance given to the modeling aspect. In doing so, we deal with new devices dedicated to radio frequency, which touches on nanoelectronics. We will also address some of the notions related to quantum mechanics. Finally, Monte Carlo methods, by essence statistics, will be introduced, which have become more and more important since the middle of the twentieth century. The second volume deals with the circuits that "use" the analog components that were introduced in Volume 1. Here, a particular emphasis is placed on the main circuit: the operational amplifier.
Book Synopsis Computer-Aided Design of Analog Integrated Circuits and Systems by : Rob A. Rutenbar
Download or read book Computer-Aided Design of Analog Integrated Circuits and Systems written by Rob A. Rutenbar and published by John Wiley & Sons. This book was released on 2002-05-06 with total page 773 pages. Available in PDF, EPUB and Kindle. Book excerpt: The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.
Book Synopsis Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement by : Yue Ma
Download or read book Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement written by Yue Ma and published by CRC Press. This book was released on 2019-03-08 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt: As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
Book Synopsis Parasitic Substrate Coupling in High Voltage Integrated Circuits by : Pietro Buccella
Download or read book Parasitic Substrate Coupling in High Voltage Integrated Circuits written by Pietro Buccella and published by Springer. This book was released on 2018-03-14 with total page 195 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools. The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits. The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis. Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits; Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate; Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices; Offers design guidelines to reduce couplings by adding specific protections.
Book Synopsis Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs by : X. Aragones
Download or read book Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs written by X. Aragones and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.
Book Synopsis Signal Integrity Effects in Custom IC and ASIC Designs by : Raminderpal Singh
Download or read book Signal Integrity Effects in Custom IC and ASIC Designs written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2001-12-12 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: "...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication
Book Synopsis Substrate Noise Coupling in RFICs by : Ahmed Helmy
Download or read book Substrate Noise Coupling in RFICs written by Ahmed Helmy and published by Springer Science & Business Media. This book was released on 2008-03-23 with total page 129 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
Book Synopsis Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits by : Wenjian Yu
Download or read book Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits written by Wenjian Yu and published by Springer Science & Business. This book was released on 2014-04-21 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: Resistance and capacitance (RC) extraction is an essential step in modeling the interconnection wires and substrate coupling effect in nanometer-technology integrated circuits (IC). The field-solver techniques for RC extraction guarantee the accuracy of modeling, and are becoming increasingly important in meeting the demand for accurate modeling and simulation of VLSI designs. Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits presents a systematic introduction to, and treatment of, the key field-solver methods for RC extraction of VLSI interconnects and substrate coupling in mixed-signal ICs. Various field-solver techniques are explained in detail, with real-world examples to illustrate the advantages and disadvantages of each algorithm. This book will benefit graduate students and researchers in the field of electrical and computer engineering as well as engineers working in the IC design and design automation industries. Dr. Wenjian Yu is an Associate Professor at the Department of Computer Science and Technology at Tsinghua University in China; Dr. Xiren Wang is a R&D Engineer at Cadence Design Systems in the USA.
Book Synopsis Substrate Noise Coupling in Mixed-Signal ASICs by : Stéphane Donnay
Download or read book Substrate Noise Coupling in Mixed-Signal ASICs written by Stéphane Donnay and published by Springer Science & Business Media. This book was released on 2003-02-28 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: Driven by applications such as telecommunications, computing and consumer/multimedia and facilitated by the progress in CMOS ULSI technology, the microelectronics IC market is characterized by an ever-increasing level of integration complexity. Today complete systems, that previously occupied one or more boards, are integrated on a few chips or even on one single multi-million transistor chip - a so called System-on-Chip (SoC). Although most functions in such integrated systems are implemented with digital or digital signal processing circuitry, the analog circuits needed at the interface between the electronic system and the continuous-valued outside world are also being integrated on the same die for reasons of cost and performance. Unfortunately, the integration of both analog & RF circuits and digital circuits on the same die not only offers many benefits, but also creates some technical difficulties. Since the analog circuits exploit the low-level physics of the fabrication process, they remain difficult and costly to design, but they are also vulnerable to any kind of noise or crosstalk signals. The higher levels of integration (moving towards 100 million transistors per chip clocked at ever higher frequencies) make the mixed-signal signal integrity problem increasingly challenging. One of the most important problems is the parasitic supply and substrate noise coupling, caused by the fast switching of the digital circuitry that then propagates to the sensitive analog circuitry via the common substrate. It is therefore important to be able to predict the impact of digital switching noise on the analog circuit performance at the design stage of the integrated system, before the chip is taped out for fabrication, and to understand how this problem can be reduced. The purpose of Substrate Noise Coupling in Mixed-Signal ASICs is to provide an overview of very recent research results in the field of substrate noise analysis and reduction techniques. Much of the reported work has been established as part of the Mixed-Signal Initiative of the European Union. It is a representative sampling of the current state of the art in this area. All the different aspects of the substrate noise coupling problem are covered. Some chapters describe techniques to model and reduce the digital switching noise injected in the substrate. Other chapters describe methods to analyse the propagation of the noise from the source (the digital circuitry) to the reception point (the embedded analog circuitry) through the substrate considered as a resistive/capacitive mesh. Finally, the remaining chapters describe techniques to model and especially to reduce the impact of substrate noise on the analog side. This is illustrated with several practical design examples and measurement results.
Download or read book Proceedings written by and published by . This book was released on 1996 with total page 880 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book VLSI Circuits and Systems written by and published by . This book was released on 2005 with total page 604 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design and Process for Three-dimensional Heterogeneous Integration by : Shulu Chen
Download or read book Design and Process for Three-dimensional Heterogeneous Integration written by Shulu Chen and published by Stanford University. This book was released on 2010 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the invention of the integrated circuit (IC) in the late 1950s, the semiconductor industry has experienced dramatic growth driven by both technology and manufacturing improvements. Over the past 40 years, the industry's growth trend has been predicted by Moore's law, and driven by the constant electrical field scaling design methodology. While the intrinsic performance of each device improves over generations, the corresponding interconnects do not. To alleviate this interconnect issue, a three-dimensional (3D) integration concept of transforming longer side to side interconnects into shorter vertical vias by using multiple active layers has attracted much attention. The focus of this thesis is on providing the foundation for 3D heterogeneous integration by investigating methods of growing single crystal materials on the silicon platform and the subsequent low-temperature process flow, through experimental demonstration, theoretical modeling and device structure simplification. First, thin film single crystal GaAs and GaSb were grown on dielectric layers on bulk silicon substrates by the rapid melt growth (RMG) method, using both rapid thermal annealing (RTA) and laser annealing. The relationship between stoichiometry and the crystal structure is discussed according to the theoretical phase diagram and the experimental results. A modified RMG structure is also proposed and demonstrated to solve the potential issue involved in integrating the RMG method into a three-dimensional integrated circuits (3D-IC) process with thick isolation layers. In order to estimate the outcome of the crystallization and to provide further understanding of the physics behind this RMG process, compact models are derived based on classical crystallization theory. Mathematical models including the geometry, the thermal environment and the outcome of the crystallization are built. The initial cooling rate is identified as the key factor for the RMG process. With the ability of integrating multiple materials on silicon substrates, the subsequent process flows using low-temperature-fabrication or simplified device structures are proposed and evaluated to achieve high density 3D integration. A "bonding substrate/monolithic contact" approach is proposed to relieve the thermal constraint from getting the starting single crystal layer without sacrificing the interconnect performance. A low-temperature process using germanium as the channel material is also discussed. Finally, gated thin film resistor structures are designed and compared to the conventional MOSFET structure with a focus on their relative performance and process complexity trade-off for future 3D-IC implementation.
Download or read book ESD written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2006-02-03 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: The scaling of semiconductor devices from sub-micron to nanometer dimensions is driving the need for understanding the design of electrostatic discharge (ESD) circuits, and the response of these integrated circuits (IC) to ESD phenomena. ESD Circuits and Devices provides a clear insight into the layout and design of circuitry for protection against electrical overstress (EOS) and ESD. With an emphasis on examples, this text: explains ESD buffering, ballasting, current distribution, design segmentation, feedback, coupling, and de-coupling ESD design methods; outlines the fundamental analytical models and experimental results for the ESD design of MOSFETs and diode semiconductor device elements, with a focus on CMOS, silicon on insulator (SOI), and Silicon Germanium (SiGe) technology; focuses on the ESD design, optimization, integration and synthesis of these elements and concepts into ESD networks, as well as applying within the off-chip driver networks, and on-chip receivers; and highlights state-of-the-art ESD input circuits, as well as ESD power clamps networks. Continuing the author’s series of books on ESD, this book will be an invaluable reference for the professional semiconductor chip and system ESD engineer. Semiconductor device and process development, quality, reliability and failure analysis engineers will also find it an essential tool. In addition, both senior undergraduate and graduate students in microelectronics and IC design will find its numerous examples useful.
Book Synopsis Advanced Metallization Conference 2002 (AMC 2002) by :
Download or read book Advanced Metallization Conference 2002 (AMC 2002) written by and published by . This book was released on 2003 with total page 920 pages. Available in PDF, EPUB and Kindle. Book excerpt:
