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Author : Lewis F. Miller
Publisher : Gordon & Breach Publishing Group
ISBN 13 :
Total Pages : 236 pages
Book Rating : 4.3/5 (91 download)
Download or read book Thick Film Technology and Chip Joining written by Lewis F. Miller and published by Gordon & Breach Publishing Group. This book was released on 1972 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Lewis F. Miller
Publisher :
ISBN 13 :
Total Pages : 221 pages
Book Rating : 4.:/5 (112 download)
Download or read book Thick Films Technology and Chip Joining written by Lewis F. Miller and published by . This book was released on 1972 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jeremy Agnew
Publisher : Hayden
ISBN 13 :
Total Pages : 184 pages
Book Rating : 4.3/5 (91 download)
Download or read book Thick Film Technology written by Jeremy Agnew and published by Hayden. This book was released on 1973 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ken Gilleo
Publisher : Springer Science & Business Media
ISBN 13 : 9780442012205
Total Pages : 450 pages
Book Rating : 4.0/5 (122 download)
Download or read book Polymer Thick Film written by Ken Gilleo and published by Springer Science & Business Media. This book was released on 1995-10-31 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ken Gilleo's Polymer Thick Film provides you with all the essential concepts, process descriptions, performance data, and general information you will need to reach your own conclusions. The focus will be on polymer thick film's major subsets, which include conductive inks, printed resistors, dielectric films or pastes, and polymer assembly material.
Author : Daryl Ann Doane
Publisher : Springer Science & Business Media
ISBN 13 : 1461531004
Total Pages : 895 pages
Book Rating : 4.4/5 (615 download)
Download or read book Multichip Module Technologies and Alternatives: The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Author : Donald W. Hamer
Publisher :
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.F/5 ( download)
Download or read book Thick Film Hybrid Microcircuit Technology written by Donald W. Hamer and published by . This book was released on 1983 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Charles A. Harper
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 712 pages
Book Rating : 4.3/5 (91 download)
Download or read book Handbook of Thick Film Hybrid Microelectronics written by Charles A. Harper and published by McGraw-Hill Companies. This book was released on 1974 with total page 712 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Titu I. Băjenescu
Publisher : Artech House
ISBN 13 : 1596934360
Total Pages : 706 pages
Book Rating : 4.5/5 (969 download)
Download or read book Component Reliability for Electronic Systems written by Titu I. Băjenescu and published by Artech House. This book was released on 2010 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.
Author : Tapan Gupta
Publisher : Wiley-Interscience
ISBN 13 :
Total Pages : 432 pages
Book Rating : 4.3/5 (91 download)
Download or read book Handbook of Thick- and Thin-Film Hybrid Microelectronics written by Tapan Gupta and published by Wiley-Interscience. This book was released on 2003-04-17 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.
Author : A. G. Milnes
Publisher : Springer Science & Business Media
ISBN 13 : 9401170215
Total Pages : 1014 pages
Book Rating : 4.4/5 (11 download)
Download or read book Semiconductor Devices and Integrated Electronics written by A. G. Milnes and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1014 pages. Available in PDF, EPUB and Kindle. Book excerpt: For some time there has been a need for a semiconductor device book that carries diode and transistor theory beyond an introductory level and yet has space to touch on a wider range of semiconductor device principles and applica tions. Such topics are covered in specialized monographs numbering many hun dreds, but the voluminous nature of this literature limits access for students. This book is the outcome of attempts to develop a broad course on devices and integrated electronics for university students at about senior-year level. The edu cational prerequisites are an introductory course in semiconductor junction and transistor concepts, and a course on analog and digital circuits that has intro duced the concepts of rectification, amplification, oscillators, modulation and logic and SWitching circuits. The book should also be of value to professional engineers and physicists because of both, the information included and the de tailed guide to the literature given by the references. The aim has been to bring some measure of order into the subject area examined and to provide a basic structure from which teachers may develop themes that are of most interest to students and themselves. Semiconductor devices and integrated circuits are reviewed and fundamental factors that control power levels, frequency, speed, size and cost are discussed. The text also briefly mentions how devices are used and presents circuits and comments on representative applications. Thus, the book seeks a balance be tween the extremes of device physics and circuit design.
Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 1461513898
Total Pages : 1250 pages
Book Rating : 4.4/5 (615 download)
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : Titu I. Bajenescu
Publisher : Springer Science & Business Media
ISBN 13 : 3642585051
Total Pages : 547 pages
Book Rating : 4.6/5 (425 download)
Download or read book Reliability of Electronic Components written by Titu I. Bajenescu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Author : R.R. Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 1461560373
Total Pages : 1060 pages
Book Rating : 4.4/5 (615 download)
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author : Wai-Kai Chen
Publisher : CRC Press
ISBN 13 : 9781420041408
Total Pages : 3076 pages
Book Rating : 4.0/5 (414 download)
Download or read book The Circuits and Filters Handbook written by Wai-Kai Chen and published by CRC Press. This book was released on 2002-12-23 with total page 3076 pages. Available in PDF, EPUB and Kindle. Book excerpt: A bestseller in its first edition, The Circuits and Filters Handbook has been thoroughly updated to provide the most current, most comprehensive information available in both the classical and emerging fields of circuits and filters, both analog and digital. This edition contains 29 new chapters, with significant additions in the areas of computer-
Author :
Publisher :
ISBN 13 :
Total Pages : 804 pages
Book Rating : 4.3/5 ( download)
Download or read book NASA Tech Briefs written by and published by . This book was released on 1979 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Keith E. G. Pitt
Publisher :
ISBN 13 : 9780901150424
Total Pages : 506 pages
Book Rating : 4.1/5 (54 download)
Download or read book Handbook of Thick Film Technology written by Keith E. G. Pitt and published by . This book was released on 2005 with total page 506 pages. Available in PDF, EPUB and Kindle. Book excerpt:
