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Thermal Ald Of Cu Via Reduction Of Cuxo Films For The Advanced Metallization In Spintronic And Ulsi Interconnect Systems
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Book Synopsis Thermal ALD of Cu Via Reduction of CuxO Films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems by : Steve Mueller
Download or read book Thermal ALD of Cu Via Reduction of CuxO Films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems written by Steve Mueller and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Metal Amide Chemistry by : Michael Lappert
Download or read book Metal Amide Chemistry written by Michael Lappert and published by John Wiley & Sons. This book was released on 2008-12-23 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by internationally recognised leaders in the field, Metal Amide Chemistry is the authoritative survey of this important class of compounds, the first since Lappert and Power’s 1980 book “Metal and Metalloid Amides.” An introduction to the topic is followed by in-depth discussions of the amide compounds of: alkali metals alkaline earth metals zinc, cadmium and mercury the transition metals group 3 and lanthanide metals group 13 metals silicon and the group 14 metals group 15 metals the actinide metals Accompanied by a substantial bibliography, this is an essential guide for researchers and advanced students in academia and research working in synthetic organometallic, organic and inorganic chemistry, materials chemistry and catalysis.
Book Synopsis Polycrystalline And Amorphous Thin Films And Devices by : Lawrence Kazmerski
Download or read book Polycrystalline And Amorphous Thin Films And Devices written by Lawrence Kazmerski and published by Elsevier. This book was released on 2012-12-02 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polycrystalline and Amorphous Thin Films and Devices is a compilation of papers that discusses the electronic, optical, and physical properties of thin material layers and films. This compilation reviews the different applications of thin films of various materials used as protective and optical coatings, thermal transfer layers, and selective membranes from submicron- area VLSI memory units to large-area energy conservation devices. Some papers discuss the basic properties, such as growth, structure, electrical, and optical mechanisms that are encountered in amorphous and polycrystalline thin semiconductor films. For example, experiments on electronic structure of dislocations have led to a model for the intrinsic properties of grain boundaries in polycrystalline semiconductor thin films that can have an impact on the designs of high-efficiency, thin-film solar cells. Other papers review the problems encountered in these thin layers in active semiconductor devices and passive technologies. Techniques in film growth and control variables of source, substrate temperature, and substrate properties will determine the successful performance of the devices installed with these thin film layers. This compilation can prove valuable for chemists, materials engineers, industrial technologists, and researchers in thin-film technology.
Book Synopsis Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12 by : Robert Havemann
Download or read book Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12 written by Robert Havemann and published by . This book was released on 1997 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Interconnect and Contact Metallization for ULSI by : G. S. Mathad
Download or read book Interconnect and Contact Metallization for ULSI written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2000 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Copper Interconnect Technology by : Tapan Gupta
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Book Synopsis Copper Interconnect Technology by : Christoph Steinbruchel
Download or read book Copper Interconnect Technology written by Christoph Steinbruchel and published by SPIE Press. This book was released on 2001 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt: A textbook designed to accompany The Society of Photo-Optical Instrumentation Engineers' short course on improving interconnect performance for increased speed in overall circuit performance authored by Steinbrnchel (materials science and engineering, Renselaer Polytechnic Institute) and Chin (senio
Book Synopsis Advanced Metallization and Processing for Semiconductor Devices and Circuits - II: Volume 260 by : Avishay Katz
Download or read book Advanced Metallization and Processing for Semiconductor Devices and Circuits - II: Volume 260 written by Avishay Katz and published by . This book was released on 1992-10-28 with total page 1000 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Advanced Metallization Conference 2000 (AMC 2000): by : Dan Edelstein
Download or read book Advanced Metallization Conference 2000 (AMC 2000): written by Dan Edelstein and published by Materials Research Society. This book was released on 2002-03-01 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on recent work in on-chip interconnects and other aspects of advanced metallization. In particular, the concentration for this year's volume is on the rapid advances in copper and low-K. The volume is divided into nine parts: Part I contains an invited perspective on the state of semiconductor research and development in Japan; Part II focuses on performance aspects of interconnect architectures; Part III includes some of the most significant recent advances in copper/low-K integration; Part IV is an in-depth collection of electrochemical and chemical processes, mainly pertaining to copper; Part V contains state-of-the-art papers on thin-film diffusion barriers, again mainly for copper wiring; Part VI covers reliability engineering and results; Part VII is a collection of alternative and novel processes and systems related to circuit interconnection; Part VIII contains papers on specific low-K dielectrics and their properties, and new methods for their characterization; and Part IX covers continuing advances in the Al(Cu)/W metallization system.
