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The Use Of Porous Silicon In The Fabrication Of Spiral Inductors For Radio Frequency Integrated Circuits
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Book Synopsis Development of Design Approaches Using Porous Silicon that Facilitate High Frequency Integration in Silicon Substrates by : Isaac Kamau Itotia
Download or read book Development of Design Approaches Using Porous Silicon that Facilitate High Frequency Integration in Silicon Substrates written by Isaac Kamau Itotia and published by . This book was released on 2005 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2668 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis IEICE Transactions on Electronics by :
Download or read book IEICE Transactions on Electronics written by and published by . This book was released on 2003 with total page 756 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Physics of Semiconductor Devices-99 by : Vikram Kumar
Download or read book Physics of Semiconductor Devices-99 written by Vikram Kumar and published by SPIE-International Society for Optical Engineering. This book was released on 2000 with total page 780 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrical & Electronics Abstracts by :
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 2304 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design and Analysis of Spiral Inductors by : Genemala Haobijam
Download or read book Design and Analysis of Spiral Inductors written by Genemala Haobijam and published by Springer Science & Business Media. This book was released on 2013-09-07 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book addresses the critical challenges faced by the ever-expanding wireless communication market and the increasing frequency of operation due to continuous innovation of high performance integrated passive devices. The challenges like low quality factor, design complexity, manufacturability, processing cost, etc., are studied with examples and specifics. Silicon on-chip inductor was first reported in 1990 by Nguyen and Meyer in a 0.8 μm silicon bipolar complementary metal oxide semiconductor technology (BiCMOS). Since then, there has been an enormous progress in the research on the performance trends, design and optimization, modeling, quality factor enhancement techniques, etc., of spiral inductors and significant results are reported in literature for various applications. This book introduces an efficient method of determining the optimized layout of on chip spiral inductor. The important fundamental tradeoffs of the design like quality factor and area, quality factor and inductance, quality factor and operating frequency, maximum quality factor and the peak frequency is also explored. The authors proposed an algorithm for accurate design and optimization of spiral inductors using a 3D electromagnetic simulator with minimum number of inductor structure simulations and thereby reducing its long computation time. A new multilayer pyramidal symmetric inductor structure is also proposed in this book. Being multilevel, the proposed inductor achieves high inductance to area ratio and hence occupies smaller silicon area.
Book Synopsis International Aerospace Abstracts by :
Download or read book International Aerospace Abstracts written by and published by . This book was released on 1999 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Dissertation Abstracts International by :
Download or read book Dissertation Abstracts International written by and published by . This book was released on 1999 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Coplanar Waveguide Circuits, Components, and Systems by : Rainee N. Simons
Download or read book Coplanar Waveguide Circuits, Components, and Systems written by Rainee N. Simons and published by John Wiley & Sons. This book was released on 2004-04-07 with total page 461 pages. Available in PDF, EPUB and Kindle. Book excerpt: Up-to-date coverage of the analysis and applications of coplanar waveguides to microwave circuits and antennas The unique feature of coplanar waveguides, as opposed to more conventional waveguides, is their uniplanar construction, in which all of the conductors are aligned on the same side of the substrate. This feature simplifies manufacturing and allows faster and less expensive characterization using on-wafer techniques. Coplanar Waveguide Circuits, Components, and Systems is an engineer's complete resource, collecting all of the available data on the subject. Rainee Simons thoroughly discusses propagation parameters for conventional coplanar waveguides and includes valuable details such as the derivation of the fundamental equations, physical explanations, and numerical examples. Coverage also includes: Discontinuities and circuit elements Transitions to other transmission media Directional couplers, hybrids, and magic T Microelectromechanical systems based switches and phase shifters Tunable devices using ferroelectric materials Photonic bandgap structures Printed circuit antennas
Book Synopsis Lumped Elements for RF and Microwave Circuits by : I. J. Bahl
Download or read book Lumped Elements for RF and Microwave Circuits written by I. J. Bahl and published by Artech House. This book was released on 2003 with total page 509 pages. Available in PDF, EPUB and Kindle. Book excerpt: This practical book is the first comprehensive treatment of lumped elements, which are playing a critical role in the development of the circuits that make these cost-effective systems possible. The book offers professionals an in-depth understanding of the different types of RF and microwave circuit elements.
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2004-05-14 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Book Synopsis Silicon-on-Insulator Technology: Materials to VLSI by : J.-P. Colinge
Download or read book Silicon-on-Insulator Technology: Materials to VLSI written by J.-P. Colinge and published by Springer Science & Business Media. This book was released on 2004-02-29 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, also describes the properties of other SOI devices, such as multiple gate MOSFETs, dynamic threshold devices and power MOSFETs. The advantages and performance of SOI circuits used in both niche and mainstream applications are discussed in detail. The SOI specialist will find this book invaluable as a source of compiled references covering the different aspects of SOI technology. For the non-specialist, the book serves an excellent introduction to the topic with detailed, yet simple and clear explanations. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition is recommended for use as a textbook for classes on semiconductor device processing and physics at the graduate level.
Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Book Synopsis Functional and Smart Materials by : Chander Prakash
Download or read book Functional and Smart Materials written by Chander Prakash and published by CRC Press. This book was released on 2020-10-25 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive and broad-spectrum picture of the state-of-the-art research, development, and commercial prospective of various discoveries conducted in the real world of functional and smart materials. This book presents various synthesis and fabrication routes of function and smart materials for universal applications such as material science, mechanical engineering, manufacturing, metrology, nanotechnology, physics, biology, chemistry, civil engineering, and food science. The content of this book opens various scientific horizons proved to be beneficial for uplifting the standards of day-to-day practices in the biomedical domain. Myriad innovations in the materials science and engineering are transforming our everyday lives in extraordinary ways. This book captures the emerging areas of materials science and advanced manufacturing engineering and presents recent trends in research for researchers, field engineers, and academic professionals.
Book Synopsis Handbook of Modern Sensors by : Jacob Fraden
Download or read book Handbook of Modern Sensors written by Jacob Fraden and published by Springer Science & Business Media. This book was released on 2006-04-29 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Seven years have passed since the publication of the previous edition of this book. During that time, sensor technologies have made a remarkable leap forward. The sensitivity of the sensors became higher, the dimensions became smaller, the sel- tivity became better, and the prices became lower. What have not changed are the fundamental principles of the sensor design. They are still governed by the laws of Nature. Arguably one of the greatest geniuses who ever lived, Leonardo Da Vinci, had his own peculiar way of praying. He was saying, “Oh Lord, thanks for Thou do not violate your own laws. ” It is comforting indeed that the laws of Nature do not change as time goes by; it is just our appreciation of them that is being re?ned. Thus, this new edition examines the same good old laws of Nature that are employed in the designs of various sensors. This has not changed much since the previous edition. Yet, the sections that describe the practical designs are revised substantially. Recent ideas and developments have been added, and less important and nonessential designs were dropped. Probably the most dramatic recent progress in the sensor technologies relates to wide use of MEMS and MEOMS (micro-electro-mechanical systems and micro-electro-opto-mechanical systems). These are examined in this new edition with greater detail. This book is about devices commonly called sensors. The invention of a - croprocessor has brought highly sophisticated instruments into our everyday lives.
Book Synopsis Design and Modeling of Millimeter-wave CMOS Circuits for Wireless Transceivers by : Ivan Chee-Hong Lai
Download or read book Design and Modeling of Millimeter-wave CMOS Circuits for Wireless Transceivers written by Ivan Chee-Hong Lai and published by Springer Science & Business Media. This book was released on 2008-03-25 with total page 185 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design and Modeling of Millimeter-wave CMOS Circuits for Wireless Transceivers describes in detail some of the interesting developments in CMOS millimetre-wave circuit design. This includes the re-emergence of the slow-wave technique used on passive devices, the license-free 60GHz band circuit blocks and a 76GHz voltage-controlled oscillator suitable for vehicular radar applications. All circuit solutions described are suitable for digital CMOS technology. Digital CMOS technology developments driven by Moore’s law make it an inevitable solution for low cost and high volume products in the marketplace. Explosion of the consumer wireless applications further makes this subject a hot topic of the day. The book begins with a brief history of millimetre-wave research and how the silicon transistor is born. Originally meant for different purposes, the two technologies converged and found its way into advanced chip designs. The second part of the book describes the most important passive devices used in millimetre-wave CMOS circuits. Part three uses these passive devices and builds circuit blocks for the wireless transceiver. The book completes with a comprehensive list of references for further readings. Design and Modeling of Millimeter-wave CMOS Circuits for Wireless Transceivers is useful to show the analogue IC designer the issues involved in making the leap to millimetre-wave circuit designs. The graduate student and researcher can also use it as a starting point to understand the subject or proceed to innovative from the works described herein.
Book Synopsis MEMS Materials and Processes Handbook by : Reza Ghodssi
Download or read book MEMS Materials and Processes Handbook written by Reza Ghodssi and published by Springer Science & Business Media. This book was released on 2011-03-18 with total page 1211 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.