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The Thermal Design Of High Temperature Electronic Parts And Equipments
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Book Synopsis Thermal Design of Electronic Equipment by : Ralph Remsburg
Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 395 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Book Synopsis The Thermal Design of High Temperature Electronic Parts and Equipments by : John B. Coleman
Download or read book The Thermal Design of High Temperature Electronic Parts and Equipments written by John B. Coleman and published by . This book was released on 1959 with total page 136 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis High Temperature Electronics by : F. Patrick McCluskey
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Book Synopsis Advanced Thermal Design of Electronic Equipment by : Ralph Remsburg
Download or read book Advanced Thermal Design of Electronic Equipment written by Ralph Remsburg and published by Springer Science & Business Media. This book was released on 2011-06-27 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Book Synopsis Guide Manual of Cooling Methods for Electronic Equipment by : United States. Navy Department. Bureau of Ships
Download or read book Guide Manual of Cooling Methods for Electronic Equipment written by United States. Navy Department. Bureau of Ships and published by . This book was released on 1956 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Guide Manual of Cooling Methods for Electronic Equipment by : Cornell Aeronautical Laboratory
Download or read book Guide Manual of Cooling Methods for Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1956 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thermal Computations for Electronic Equipment by : Gordon N. Ellison
Download or read book Thermal Computations for Electronic Equipment written by Gordon N. Ellison and published by . This book was released on 1989 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design Manual of Natural Methods of Cooling Electronic Equipment by : James P. Welsh
Download or read book Design Manual of Natural Methods of Cooling Electronic Equipment written by James P. Welsh and published by . This book was released on 1962 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis High-Temperature Electronics by : Randall Kirschman
Download or read book High-Temperature Electronics written by Randall Kirschman and published by Wiley-IEEE Press. This book was released on 1998-09-01 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.
Book Synopsis Design Manual of Natural Methods of Cooling Electronic Equipment by : United States. Ships Bureau
Download or read book Design Manual of Natural Methods of Cooling Electronic Equipment written by United States. Ships Bureau and published by . This book was released on 1962 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thermal Management of Microelectronic Equipment by : Lian-Tuu Yeh
Download or read book Thermal Management of Microelectronic Equipment written by Lian-Tuu Yeh and published by American Society of Mechanical Engineers. This book was released on 2002 with total page 454 pages. Available in PDF, EPUB and Kindle. Book excerpt: With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Book Synopsis Reliability Design Handbook by : United States. Naval Ship Systems Command
Download or read book Reliability Design Handbook written by United States. Naval Ship Systems Command and published by . This book was released on 1963 with total page 810 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Heat Transfer in Miniaturized Electronic Equipment by : Cornell Aeronautical Laboratory
Download or read book Heat Transfer in Miniaturized Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1955 with total page 100 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Applied Thermal Design by : Eric C. Guyer
Download or read book Handbook of Applied Thermal Design written by Eric C. Guyer and published by CRC Press. This book was released on 1999-02-01 with total page 710 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gives a foundation to the four principle facets of thermal design: heat transfer analysis, materials performance, heating and cooling technology, and instrumentation and control. The focus is on providing practical thermal design and development guidance across the spectrum of problem analysis, material applications, equipment specification, and sensor and control selection.
Book Synopsis Advances in Thermal Modeling of Electronic Components and Systems by : Avram Bar Cohen
Download or read book Advances in Thermal Modeling of Electronic Components and Systems written by Avram Bar Cohen and published by Advances in Thermal Modeling o. This book was released on 1997-12-31 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume of the series focuses on air cooling technology. Begins with a review of techniques used in thermal analysis of natural convection electronic systems, and continues with the presentation of a methodology for thermal modeling of air cooled components mounted on printed circuit boards. Gov
Book Synopsis Thermal Design Guideline for Electronic Equipment by : Robert F. Dillon
Download or read book Thermal Design Guideline for Electronic Equipment written by Robert F. Dillon and published by . This book was released on 1981 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis U.S. Government Research Reports by :
Download or read book U.S. Government Research Reports written by and published by . This book was released on 1963 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt:
