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The Comparison Study Of Future On Chip Interconnects For High Performance Vlsi Applications
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Book Synopsis The Comparison Study of Future On-chip Interconnects for High Performance VLSI Applications by : Kyung Hoae Koo
Download or read book The Comparison Study of Future On-chip Interconnects for High Performance VLSI Applications written by Kyung Hoae Koo and published by Stanford University. This book was released on 2011 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moore's law has driven the scaling of digital electronic devices' dimensions and performances over the last 40 years. As a result, logic components in a microprocessor have shown dramatic performance improvement. On the other hand, an on-chip interconnect which was considered only as a parasitic load before 1990s became the real performance bottleneck due to its extremely reduced cross section dimension. Now, on-chip global interconnect with conventional Cu/low-k and delay optimized repeater scheme faces great challenges in the nanometer regime, imposing problems of slower delay, higher power dissipation and limited bandwidth. Carbon based materials such as carbon nanotubes and graphene nanoribbons, and optical interconnect have been proposed for the alternate solution for the future nodes due to their special physical characteristics. This dissertation investigates the basic physical properties of novel materials for future interconnect, and describes the analytical and numerical models of local and global wire system based on new materials and novel signaling paradigms. This work also compares their basic performance metrics and circuit architectures to cope with the interconnect performance bottlenecks. We quantify the performance of these novel interconnects and compare them with Cu/low-k wires for future high-performance ICs.
Book Synopsis The Comparison Study of Future On-chip Interconnects for High Performance VLSI Applications by : Kyung Hoae Koo
Download or read book The Comparison Study of Future On-chip Interconnects for High Performance VLSI Applications written by Kyung Hoae Koo and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Moore's law has driven the scaling of digital electronic devices' dimensions and performances over the last 40 years. As a result, logic components in a microprocessor have shown dramatic performance improvement. On the other hand, an on-chip interconnect which was considered only as a parasitic load before 1990s became the real performance bottleneck due to its extremely reduced cross section dimension. Now, on-chip global interconnect with conventional Cu/low-k and delay optimized repeater scheme faces great challenges in the nanometer regime, imposing problems of slower delay, higher power dissipation and limited bandwidth. Carbon based materials such as carbon nanotubes and graphene nanoribbons, and optical interconnect have been proposed for the alternate solution for the future nodes due to their special physical characteristics. This dissertation investigates the basic physical properties of novel materials for future interconnect, and describes the analytical and numerical models of local and global wire system based on new materials and novel signaling paradigms. This work also compares their basic performance metrics and circuit architectures to cope with the interconnect performance bottlenecks. We quantify the performance of these novel interconnects and compare them with Cu/low-k wires for future high-performance ICs.
Book Synopsis Crosstalk in Modern On-Chip Interconnects by : B.K. Kaushik
Download or read book Crosstalk in Modern On-Chip Interconnects written by B.K. Kaushik and published by Springer. This book was released on 2016-04-06 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.
Book Synopsis Noise Coupling in System-on-Chip by : Thomas Noulis
Download or read book Noise Coupling in System-on-Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 519 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Book Synopsis High-Speed VLSI Interconnections by : Ashok K. Goel
Download or read book High-Speed VLSI Interconnections written by Ashok K. Goel and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Book Synopsis Proceedings of Fifth International Conference on Soft Computing for Problem Solving by : Millie Pant
Download or read book Proceedings of Fifth International Conference on Soft Computing for Problem Solving written by Millie Pant and published by Springer. This book was released on 2016-03-19 with total page 1030 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings of SocProS 2015 will serve as an academic bonanza for scientists and researchers working in the field of Soft Computing. This book contains theoretical as well as practical aspects using fuzzy logic, neural networks, evolutionary algorithms, swarm intelligence algorithms, etc., with many applications under the umbrella of ‘Soft Computing’. The book will be beneficial for young as well as experienced researchers dealing across complex and intricate real world problems for which finding a solution by traditional methods is a difficult task. The different application areas covered in the proceedings are: Image Processing, Cryptanalysis, Industrial Optimization, Supply Chain Management, Newly Proposed Nature Inspired Algorithms, Signal Processing, Problems related to Medical and Health Care, Networking Optimization Problems, etc.
Book Synopsis Carbon Nanotube Based VLSI Interconnects by : Brajesh Kumar Kaushik
Download or read book Carbon Nanotube Based VLSI Interconnects written by Brajesh Kumar Kaushik and published by Springer. This book was released on 2014-11-01 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
Book Synopsis Interconnects in VLSI Design by : Hartmut Grabinski
Download or read book Interconnects in VLSI Design written by Hartmut Grabinski and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
Book Synopsis Design and Optimization of High-performance Low-power CMOS VLSI Interconnects by : Yulei Zhang
Download or read book Design and Optimization of High-performance Low-power CMOS VLSI Interconnects written by Yulei Zhang and published by . This book was released on 2011 with total page 115 pages. Available in PDF, EPUB and Kindle. Book excerpt: As semiconductor technology advances in the ultra deep sub-micron era, on-chip global interconnections have been an ever-greater barrier to achieving high-performance and low-power for the increasingly larger system-on-chip (SoC) designs. Various on-chip interconnection schemes are proposed to tackle the scaling issue of global wires by manipulating the wire operation regions, changing signaling methods, and applying different equalization techniques. Optimization frameworks are also proposed to aid the transmitter-wire-receiver co-design based on user-defined constraints. For the six representative global interconnection schemes, we investigate their performance metrics with technology scaling by performing optimizations using the proposed SQP-based framework. A set of simple models is also developed to enable early-stage system-level analysis. Performance of different interconnection schemes are predicted and compared over several technology nodes. We further perform studies on the pipelined $RC$ interconnection by exploring its performance metrics with voltage and technology scaling based on different design objectives. A performance evaluation flow is developed to generate the optimal designs for given objectives. Also, impacts of pipelining depth, voltage and technology scaling are illustrated. Finally, we propose an energy-efficient high-speed on-chip global interconnection by employing continuous-time active equalization. Modeling and design of transmitter and receiver circuits are discussed. Analytical formula of received eye-opening is derived for system-level design planning. We further perform transmitter-receiver co-design through an optimization framework and explore the design space to generate design based on best energy-throughput tradeoff.
Book Synopsis Interconnect Technologies for Integrated Circuits and Flexible Electronics by : Yash Agrawal
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Book Synopsis Modeling and Simulation of High Speed VLSI Interconnects by : Michel S. Nakhla
Download or read book Modeling and Simulation of High Speed VLSI Interconnects written by Michel S. Nakhla and published by Springer Science & Business Media. This book was released on 2011-06-28 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Book Synopsis Design of High-performance VLSI RLC Interconnects by : Falah Rashad Awwad
Download or read book Design of High-performance VLSI RLC Interconnects written by Falah Rashad Awwad and published by . This book was released on 2002 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: On-Chip Inductance has become of significance in the design of high-speed interconnects. In this thesis, three techniques are applied to regenerate an RLC: interconnect in series, parallel and without regeneration. Simulations using a 0.25?m TSMC technology show that the parallel regeneration starts achieving a better speed than the non-regenerated line at wire lengths smaller than that achieved when the wire is serially regenerated. It also features 47% time delay saving and 96% Area-Delay product saving over the serial regeneration. Repeaters are now widely used to enhance the performance of long On-Chip interconnects in CMOS VLSI. For RC-modeled interconnects, parallel repeaters have proved to be superior to serial ones. In this thesis, a Variable-Segment Regeneration Technique is introduced and compared with a Variable-Driver Parallel Technique, a recently proposed transparent repeater and with other three conventional techniques. HSpice Simulations using a 0.25?m TSMC technology show that both the variable-segment and variable-driver techniques feature 62% time delay saving and 354% Area-Delay product saving over the transparent repeater, and are superior to all conventional techniques. Moreover, our new variable-segment technique is characterized by a 116% Area-Delay product saving over the variable-driver technique. Thus, making it the most performant in the field of high-performance RLC interconnect regeneration. The simulation results and an analytical model of VSRT confirm the superiority of the parallel regeneration technique over the serial ones.
Book Synopsis Computational Intelligence in Digital and Network Designs and Applications by : Mourad Fakhfakh
Download or read book Computational Intelligence in Digital and Network Designs and Applications written by Mourad Fakhfakh and published by Springer. This book was released on 2015-07-14 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains the application of recent advances in computational intelligence – algorithms, design methodologies, and synthesis techniques – to the design of integrated circuits and systems. It highlights new biasing and sizing approaches and optimization techniques and their application to the design of high-performance digital, VLSI, radio-frequency, and mixed-signal circuits and systems. This second of two related volumes addresses digital and network designs and applications, with 12 chapters grouped into parts on digital circuit design, network optimization, and applications. It will be of interest to practitioners and researchers in computer science and electronics engineering engaged with the design of electronic circuits.
Book Synopsis High-frequency Impedance Extraction of Interconnects Considering Substrate Effects and Exploration of Single-walled Carbon Nanotubes for Future VLSI Interconnects by : Navin Srivastava
Download or read book High-frequency Impedance Extraction of Interconnects Considering Substrate Effects and Exploration of Single-walled Carbon Nanotubes for Future VLSI Interconnects written by Navin Srivastava and published by . This book was released on 2009 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Interconnects among more than a billion transistors on a single chip are widely recognized as the performance bottlenecks in nanometer scale integrated circuits. Shrinking interconnect dimensions as well as noise and timing budgets have made accurate full-chip interconnect parasitic extraction an indispensable yet (computationally) formidable task, while simultaneously raising concerns about the reliability limits of prevalent Copper interconnects.
Book Synopsis Multi-Net Optimization of VLSI Interconnect by : Konstantin Moiseev
Download or read book Multi-Net Optimization of VLSI Interconnect written by Konstantin Moiseev and published by . This book was released on 2014-11-30 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Compact Models and Measurement Techniques for High-Speed Interconnects by : Rohit Sharma
Download or read book Compact Models and Measurement Techniques for High-Speed Interconnects written by Rohit Sharma and published by Springer Science & Business Media. This book was released on 2012-02-17 with total page 81 pages. Available in PDF, EPUB and Kindle. Book excerpt: Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 702 pages. Available in PDF, EPUB and Kindle. Book excerpt:
