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Technical Guidelines For Aerospace And High Performance Electronic Systems Containing Lead Free Solder And Finishes
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Book Synopsis Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes by : Government Electronics and Information Technology Association
Download or read book Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes written by Government Electronics and Information Technology Association and published by . This book was released on 2007 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes by : G-24 Pb-free Risk Management Committee for ADHP.
Download or read book Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes written by G-24 Pb-free Risk Management Committee for ADHP. and published by . This book was released on 2016 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document is intended for use as technical guidance by Aerospace system suppliers, e.g., Aerospace system Original Equipment Manufacturers (OEMs) and Aerospace system maintenance facilities, in developing and implementing designs and processes to assure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as AHP) both during and after the transition to Pb-Free electronics.This document is intended for application to aerospace products; however, it may also be applied, at the discretion of the user, to other products with similar characteristics, e.g., low-volume, rugged use environments, high reliability, long lifetime, and reparability. If other industries wish to use this document, they may substitute the name of their industry for the word "Aerospace" in this document.The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to assure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with Document GEIA-STD-0005-1, "Performance Standard for High Performance Electronic Systems Containing Pb-Free Solder."This document also contains lessons learned from previous experience with Pb-Free aerospace electronic systems. The lessons learned give specific references to solder alloys and other materials, and their expected applicability to various operating environmental conditions. The lessons learned are intended for guidance only; they are not guarantees of success in any given application.
Book Synopsis Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder by :
Download or read book Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder written by and published by . This book was released on 2006 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Lead-Free Solder Process Development by : Gregory Henshall
Download or read book Lead-Free Solder Process Development written by Gregory Henshall and published by John Wiley & Sons. This book was released on 2011-03-29 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Book Synopsis Standard for Developing a Lead-Free Control Plan to Manage the Risks of Lead-Free Solders and Finishes in Aerospace, Defense, and High-Performance Soldered Electronic Products by : G-24 Pb-free Risk Management Committee for ADHP.
Download or read book Standard for Developing a Lead-Free Control Plan to Manage the Risks of Lead-Free Solders and Finishes in Aerospace, Defense, and High-Performance Soldered Electronic Products written by G-24 Pb-free Risk Management Committee for ADHP. and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This technical report identifies the requirements for an LFCP for ADHP soldered electronic products built fully or partially with Pb-free materials and assembly processes. An LFCP documents the specific Pb-free materials and assembly processes used to assure customers their ADHP soldered electronic products will meet the applicable reliability requirements of the customer. This standard specifically addresses LFCPs for: aPb-free components and mixed assembly: Products originally designed and qualified with SnPb solder and assembly processes that incorporate components with Pb-free termination finishes and/or Pb-free BGAs, i.e., assembling Pb-free parts using eutectic/near-eutectic SnPb processes (also known as mixed metallurgy). bCOTS products: COTS products likely built with Pb-free materials and assembly processes. cPb-free design and assembly: Products designed and qualified with Pb-free solder and assembly processes.This standard does not include detailed descriptions of the processes to be documented in an LFCP, but lists high-level requirements for ADHP soldered electronic products using Pb-free materials and assembly processes, such as requirements for manufacturing and reliability, configuration control and product identification, and rework, repair, and maintenance.This standard is structured to enable tailoring, i.e., deleting, adding, or modifying requirements as applicable to the product, system or program under consideration. Tailoring GEIA-STD-0005-1 requires agreement between the LFCP user and customer before implementation. This technical report was revised to incorporate the knowledge accrued from managing risks of using lead (Pb)-free materials in aerospace, defense, and high-performance (ADHP) soldered electronic products and to comply with the SAE Five-Year Review policy.
Book Synopsis Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder by : G-24 Pb-free Risk Management Committee for ADHP.
Download or read book Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder written by G-24 Pb-free Risk Management Committee for ADHP. and published by . This book was released on 2012 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This standard defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.It is intended to communicate requirements for a Pb-free Control Plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan Owners in the development of their own Plans. The Plan documents the Plan Owner's processes that assure their customers, and all other stakeholders that the Plan Owner's products will continue to meet their requirements, given the risks stated in the Introduction.This standard does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the ADHP industries that must be addressed by the processes.Pb-free risk management should be accomplished through specific requirements added to the Plan Owner's existing infrastructure of product management and control.This standard applies to the ADHP electronics system supply chain.The control of the Pb-free activities shall be accomplished by the Plan Owner addressing the requirements of their Customer. These activities include, but are not limited to, those performed by the System Integrator, the OEM, and their respective supply chains, to the lowest level possible. This must be done with the knowledge that, at the component level, the aerospace industry may not have a great influence over those suppliers. In such cases, the Plan Owner assumes responsibility.Some applications may have unique requirements that exceed the scope of this standard. The extended scope should be covered separately.The requirements of this standard may be tailored to address unique/specific program needs. If tailoring is performed, the user shall obtain documented customer concurrence. Annex A provides a tailoring template that may be used.
Book Synopsis Program Management/Systems Engineering Guidelines for Managing the Transition to Lead-Free Electronics by : G-24 Pb-free Risk Management Committee for ADHP.
Download or read book Program Management/Systems Engineering Guidelines for Managing the Transition to Lead-Free Electronics written by G-24 Pb-free Risk Management Committee for ADHP. and published by . This book was released on 2016 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with GEIA-STD-0005-1, "Performance Standard for Aerospace and High Performance Electronic Systems Containing Pb-free Solder". Please note that the program manager, and managers of systems engineering, Supply Chain and Quality Assurance (along with their respective organizations), and the appropriate enterprise authority need to work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. Herein "program management (or manager), supplier chain management (or manager), quality assurance management (or manager) and systems engineering management (or manager) and/or the appropriate enterprise authority" shall be defined as "responsible manager" throughout the remaining document (see Section 3, Terms and Definitions).The basic principles delineated in this handbook can be used for program management, system engineering, supply chain management and quality assurance management of any aerospace and/or high performance program. Appendix A contains a General Responsible Manager Checklist for Dealing with Pb-free Issues. The checklist can be used to identify potential issues related to the content in sections 5 through 15 of this handbook.Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations. The industry conversion to Pb-free solder technology may affect manufacturers and consumers of ADHP electronics in one or combinations of the following three ways: (1) If the program is required to implement Pb-free technology (contract requirement, environmental regulation, etc), then the managers of organizations responsible for program execution will need to assess the impact of in-house transition with respect to design (e.g., performance of products using Pb-free) and process (e.g., processes to build Pb-free products). (2) If the program purchases COTS (Commercial-off-the-Shelf) items for its products/systems, then there is a very good chance that these items will contain Pb-free solder or Pb-free finishes on parts, PWBs, or PBAs. (3) Manufacturers of ADHP electronics may inadvertently introduce Pb-free parts or assemblies (including component finish, Printed Wiring Board (PWB) finish, or assembly solder) if careful coordination between buyer and supplier is not exercised. This handbook is intended to provide guidance for the mitigation of all potential issues and risks affecting the Aerospace Defense and High Performance (ADHP) electronics industry as a result of the transition from tin-lead (SnPb) to lead-free (Pb-free) electronics. The guidance in this handbook has been developed to assist managers in the responsible mitigation of the impact of the Pb-free electronics transition.The original release of this document was written primarily from the perspective of a military program. Revision A broadens the perceptive, and is rewritten to advise and assist the four primary stakeholders; Systems Engineering, Supply Chain Management, Quality Assurance Management and Program Management.
Book Synopsis Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes by :
Download or read book Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes written by and published by . This book was released on 2008 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems by : G-24 Pb-free Risk Management Committee for ADHP.
Download or read book Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems written by G-24 Pb-free Risk Management Committee for ADHP. and published by . This book was released on 2015 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task.This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term "Rework/Repair" is used as applicable.NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.
Book Synopsis Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes by : G-24 Pb-free Risk Management Committee for ADHP.
Download or read book Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes written by G-24 Pb-free Risk Management Committee for ADHP. and published by . This book was released on 2018 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document defines: 1A default method for those companies that require a pre-defined approach and 2A protocol for those companies that wish to develop their own test methods.The default method (Section 4 of the document) is intended for use by electronic equipment manufacturers, repair facilities, or programs which, for a variety of reasons, may be unable to develop methods specific to their own products and applications. It is to be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing Pb-free solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of AHP electronic equipment.The protocol (Section 5 of the document) is intended for use by manufacturers or repair facilities which have the necessary resources to design and conduct reliability, qualification, or process development tests that are specific to their products, their operating conditions, and their applications. Users of the protocol will have the necessary knowledge, experience, and data to customize their own methods for designing, conducting, and interpreting results from the data. Key to developing a protocol is a firm understanding of all material properties for the Pb-free material in question as well as knowledge of package- and board-level attributes as described in Section 4.1.1. As an example, research has shown that the mechanisms for creep are very different between SnPb and Tin-Silver-Copper (SAC) solders. Understanding these mechanisms is key to determining critical test parameters such as dwell time for thermal cycling. The protocol portion of this document provides guidance on performing sufficient characterization of new materials in order to accurately define test parameters.Use of the protocol is encouraged, since it is likely to yield more accurate results. Reference [7] provides a comprehensive overview of those technical considerations necessary in implementing a test protocol.This document addresses the evaluation of failure mechanisms, through performance testing, expected in electronic products containing Pb-free solder. One failure mode, fatigue-failure through the solder-joint, is considered a primary failure mode in AHP electronics and can be understood in terms of physics-of-failure and life-projections. Understanding the all potential failure modes caused by Pb-free solder of AHP electronics is a critical element in defining early field-failures/reliability issues. Grouping of different failure modes may result in incorrect and/or misleading test conclusions. Failure analysis efforts should be conducted to insure that individual failure modes are identified enabling the correct application of reliability assessments and life-projection efforts.When properly used, the methods or protocol defined in this document may be used along with the processes documented in compliance to Reference [3], to satisfy, at least in part, the reliability requirements of References [3] and [4].This document may be used for products in all stages of the transition to Pb-free solder, including: Products that have been designed and qualified with traditional SnPb electronic components, materials, and assembly processes, and are being re-qualified with use of Pb-free components Products with SnPb designs transitioning to Pb-free solder; and Products newly-designed with Pb-free solder.For programs that were designed with SnPb solder, and are currently not using any Pb-free solder, the traditional methods may be used. It is important, however, for those programs to have processes in place to maintain the SnPb configuration including those outsourced or manufactured by subcontractors.With respect to products as mentioned above, the methods presented in this document are intended to be applied at the level of assembly at which soldering occurs, i.e., circuit-card assembly level. For those users interested in COTS (commercial-off-the-shelf) testing, some guidance at box-level (e.g., power suppliers, module assemblies, etc.) is provided in Section 6.0.IMPORTANT TO NOTE: This standard does not apply to space flight hardware. Applications that do not permit the use of Pb-free soldering for circuit board assembly, such as electronic hardware for space flight, are outside the scope of this document.The demonstration of successful performance or acceptable reliability of hardware through a test program consistent with this Standard may be application-specific, and should not be construed as demonstrating qualification of the same hardware for a different application where Pb-free solder and finishes have been prohibited.
Book Synopsis Process Management for Avionics. Aerospace and Defence Electronic Systems Containing Lead-free Solder by : British Standards Institution
Download or read book Process Management for Avionics. Aerospace and Defence Electronic Systems Containing Lead-free Solder written by British Standards Institution and published by . This book was released on 2014 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Process Management for Avionics--aerospace and Defence Electronic Systems Containing Lead-free Solder by : International Electrotechnical Commission
Download or read book Process Management for Avionics--aerospace and Defence Electronic Systems Containing Lead-free Solder written by International Electrotechnical Commission and published by . This book was released on 2011 with total page 69 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Process Management for Avionics. Aerospace and Defence Electronic Systems Containing Lead-Free Solder. Technical Guidelines by : British Standards Institute Staff
Download or read book Process Management for Avionics. Aerospace and Defence Electronic Systems Containing Lead-Free Solder. Technical Guidelines written by British Standards Institute Staff and published by . This book was released on 1913-10-31 with total page 74 pages. Available in PDF, EPUB and Kindle. Book excerpt: Air transport engineering, Production management, Electronic equipment and components, Aircraft components, Management, Plans, Selection, Operating conditions, Process control, Production planning, Qualification approval, Acceptance specification, Quality assurance
Book Synopsis Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes by :
Download or read book Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes written by and published by . This book was released on 2012 with total page 44 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Process Management for Avionics--aerospace and Defence Electronic Systems Containing Lead-free Solder by : International Electrotechnical Commission
Download or read book Process Management for Avionics--aerospace and Defence Electronic Systems Containing Lead-free Solder written by International Electrotechnical Commission and published by . This book was released on 2014 with total page 42 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Process Management for Avionics. Aerospace and Defence Electronic Systems Containing Lead-Free Solder. Performance Testing for Systems Containing Lead-Free Solder and Finishes by : British Standards Institute Staff
Download or read book Process Management for Avionics. Aerospace and Defence Electronic Systems Containing Lead-Free Solder. Performance Testing for Systems Containing Lead-Free Solder and Finishes written by British Standards Institute Staff and published by . This book was released on 1911-09-30 with total page 44 pages. Available in PDF, EPUB and Kindle. Book excerpt: Production management, Air transport engineering, Defence, Aircraft components, Electronic equipment and components, Solders, Lead-free alloys, Lead alloys, Soldering, Repair, Fluxes (materials), Printed circuits, Printed-circuit boards, Finishes, Performance testing, Environmental testing
Book Synopsis Process Management for Avionics by : International Electrotechnical Commission
Download or read book Process Management for Avionics written by International Electrotechnical Commission and published by . This book was released on 2013 with total page 34 pages. Available in PDF, EPUB and Kindle. Book excerpt:
