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Author :
Publisher : ASTM International
ISBN 13 :
Total Pages : 197 pages
Book Rating : 4./5 ( download)
Download or read book Symposium on Solder written by and published by ASTM International. This book was released on 1956 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : American Society for Testing Materials
Publisher :
ISBN 13 :
Total Pages : 200 pages
Book Rating : 4.3/5 (91 download)
Download or read book Symposium on Solder, Presented at the Fifty-ninth Annual Meeting American Society for Testing Materials, Atlantic City, N.J., June 19-20, 1956 written by American Society for Testing Materials and published by . This book was released on 1957 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : ASM International
Publisher : ASM International
ISBN 13 : 1627082735
Total Pages : 540 pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author : ASM International
Publisher : ASM International
ISBN 13 : 1615030913
Total Pages : 551 pages
Book Rating : 4.6/5 (15 download)
Download or read book Thirty-fourth International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2008-01-01 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Baoyan Duan
Publisher : Springer Nature
ISBN 13 : 9811913099
Total Pages : 2195 pages
Book Rating : 4.8/5 (119 download)
Download or read book Proceedings of the Eighth Asia International Symposium on Mechatronics written by Baoyan Duan and published by Springer Nature. This book was released on 2022-07-12 with total page 2195 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book presents high-quality papers from the Eighth Asia International Symposium on Mechatronics (AISM 2021). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design of electronic equipment, sensing and measurement, mechatronics in manufacturing and automations, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.
Author : Mohd Arif Anuar Mohd Salleh
Publisher : Springer Nature
ISBN 13 : 9811992673
Total Pages : 873 pages
Book Rating : 4.8/5 (119 download)
Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Author : KV Subramanian
Publisher : Springer Science & Business Media
ISBN 13 : 0387484337
Total Pages : 370 pages
Book Rating : 4.3/5 (874 download)
Download or read book Lead-Free Electronic Solders written by KV Subramanian and published by Springer Science & Business Media. This book was released on 2007-06-28 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Author : ASM International
Publisher : ASM International
ISBN 13 : 1627080996
Total Pages : 593 pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2018-12-01 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Author :
Publisher :
ISBN 13 :
Total Pages : 348 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings of the ... IEEE International Symposium on Electronics and the Environment written by and published by . This book was released on 1996 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Giles Humpston
Publisher : ASM International
ISBN 13 : 1615031707
Total Pages : 284 pages
Book Rating : 4.6/5 (15 download)
Download or read book Principles of Soldering written by Giles Humpston and published by ASM International. This book was released on 2004 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jasbir Bath
Publisher : Springer Science & Business Media
ISBN 13 : 0387684220
Total Pages : 307 pages
Book Rating : 4.3/5 (876 download)
Download or read book Lead-Free Soldering written by Jasbir Bath and published by Springer Science & Business Media. This book was released on 2007-06-26 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.
Author : ASM International
Publisher : ASM International
ISBN 13 : 1615030883
Total Pages : 524 pages
Book Rating : 4.6/5 (15 download)
Download or read book Istfa 2005 written by ASM International and published by ASM International. This book was released on 2005-01-01 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Andrew E. Perkins
Publisher : Springer Science & Business Media
ISBN 13 : 0387793941
Total Pages : 202 pages
Book Rating : 4.3/5 (877 download)
Download or read book Solder Joint Reliability Prediction for Multiple Environments written by Andrew E. Perkins and published by Springer Science & Business Media. This book was released on 2008-12-16 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Author : Rao Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 9780412084515
Total Pages : 662 pages
Book Rating : 4.0/5 (845 download)
Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Author : Dongkai Shangguan
Publisher : ASM International
ISBN 13 : 161503093X
Total Pages : 292 pages
Book Rating : 4.6/5 (15 download)
Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Karl J. Puttlitz
Publisher : CRC Press
ISBN 13 : 0203021487
Total Pages : 1044 pages
Book Rating : 4.2/5 (3 download)
Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Author : John W. Evans
Publisher : Springer Science & Business Media
ISBN 13 : 1846283108
Total Pages : 212 pages
Book Rating : 4.8/5 (462 download)
Download or read book A Guide to Lead-free Solders written by John W. Evans and published by Springer Science & Business Media. This book was released on 2007-01-05 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
