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Author : David Boswell
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 172 pages
Book Rating : 4.F/5 ( download)
Download or read book Surface Mount Guidelines for Process Control, Quality, and Reliability written by David Boswell and published by McGraw-Hill Companies. This book was released on 1992 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Elissa M. Bumiller
Publisher : CRC Press
ISBN 13 : 1420040065
Total Pages : 236 pages
Book Rating : 4.4/5 (2 download)
Download or read book Contamination of Electronic Assemblies written by Elissa M. Bumiller and published by CRC Press. This book was released on 2002-11-12 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of
Author : Ray Prasad
Publisher : Springer Science & Business Media
ISBN 13 : 1461540844
Total Pages : 791 pages
Book Rating : 4.4/5 (615 download)
Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Author : Vern Solberg
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 296 pages
Book Rating : 4.3/5 (91 download)
Download or read book Design Guidelines for Surface Mount and Fine Pitch Technology written by Vern Solberg and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: Very Good,No Highlights or Markup,all pages are intact.
Author : Kailash C. Kapur
Publisher : John Wiley & Sons
ISBN 13 : 1118841794
Total Pages : 528 pages
Book Rating : 4.1/5 (188 download)
Download or read book Reliability Engineering written by Kailash C. Kapur and published by John Wiley & Sons. This book was released on 2014-03-21 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales, and service. Containing illustrative guides that include worked problems, numerical examples, homework problems, a solutions manual, and class-tested materials, it demonstrates to product development and manufacturing professionals how to distribute key reliability practices throughout an organization. The authors explain how to integrate reliability methods and techniques in the Six Sigma process and Design for Six Sigma (DFSS). They also discuss relationships between warranty and reliability, as well as legal and liability issues. Other topics covered include: Reliability engineering in the 21st Century Probability life distributions for reliability analysis Process control and process capability Failure modes, mechanisms, and effects analysis Health monitoring and prognostics Reliability tests and reliability estimation Reliability Engineering provides a comprehensive list of references on the topics covered in each chapter. It is an invaluable resource for those interested in gaining fundamental knowledge of the practical aspects of reliability in design, manufacturing, and testing. In addition, it is useful for implementation and management of reliability programs.
Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.3/5 (91 download)
Download or read book Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1997 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: The explosive growth of high-density packaging has created a tremendous impact on the electronic assembly and manufacturing industry. Ball grid array (BGA), chip-scale package (CSP), and solder-bumped flip chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. For these technologies, solder is the electrical and mechanical "glue," and thus solder joint reliability is one of the most critical issues in the development of these technologies. This book is a one-stop guide to the state of the art of solder joint reliability problem-solving methods, or choose a creative, high-performance, robust, and cost-effective design and high-yield manufacturing process for their interconnect systems will be able to do so with this unique sourcebook. It meets the reference needs of design, material, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, vendor, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. This book is structured to provide readers with the necessary know-how for practical, on-the-job problem-solving guidance. The book covers the solder joint reliability of BGA, CSP, flip chip, and FPT assemblies completely, proceeding from the theoretical basics to applications. Specific areas covered include: Definition of reliability, life distribution, failure rate, mean time to failure, etc.; Some well-known life distributions; Accelerated testing; Parameter estimation of life distributions; Acceleration factors for solders;Solder mechanics: plasticity, creep, and constitutive equations; Design, material, and manufacturing processes of BGA, CSP, flip chip, and FTP; Failure analysis and root cause of failure for BGA, CSP, flip chip, and FPT solder joints; Design for reliability of BGA, CSP, flip chip and FPT solder joints; Solder joint reliability of CBGA, PBGA, DBGA, and TBGA assemblies under thermal fatigue, mechanical bending and twisting, and shock and vibration conditions; solder joint reliability of flip chip (e.g., high-temperature and eutectic solder bumped flip chips on ceramic and PCB) assemblies under thermal fatigue, mechanical pulling, shearing, bending and twisting, and shock and vibration conditions; Solder joint reliability of CSP (e.g., LG Semicon's, Mitsubishi's, Motorola's, Tessera's, NEC's, nitto Denko's and Toshiba's) assemblies under thermal fatigue and mechanical bending conditions; Solder joint reliability of PQFP and TSOP assemblies under thermal fatigue, mechanical bending and twisting, and vibration conditions.
Author : Intel Corporation
Publisher :
ISBN 13 :
Total Pages : 166 pages
Book Rating : 4.0/5 ( download)
Download or read book Systems Quality/reliability Handbook written by Intel Corporation and published by . This book was released on 1988 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt: Systems quality/reliability overview; Materials quality; Reliability; Manufacturing; Product regulations; Field activities; Support; Statistical process control tools; Glossary.
Author : Frank Classon
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.3/5 (91 download)
Download or read book Surface Mount Technology for Concurrent Engineering and Manufacturing written by Frank Classon and published by McGraw-Hill Companies. This book was released on 1993 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to gaining the valuable miniaturization and cost-saving benefits of surface mount technology (SMT), showing how to integrate multiple company functions - designs, manufacturing, testing and management - and save time and money at every stage.
Author : James Allen Smith
Publisher : McGraw Hill Professional
ISBN 13 : 9780070592292
Total Pages : 536 pages
Book Rating : 4.5/5 (922 download)
Download or read book Optimizing Quality in Electronics Assembly: A Heretical Approach written by James Allen Smith and published by McGraw Hill Professional. This book was released on 1997 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a radical departure from the dozens of other quality books, this one makes the case that the traditional TQM procedures used in the electronics assembly field are not only ineffective-they contribute to many failures. The only book to focus exclusively on quality in electronics manufacturing-& to propose a measurable cost/benefit methodology-this provocative volume shows what's lacking in current quality programs, & how fresh approaches can yet avoid a quality "catastrophe" in the electronics industry. Along the way, numerous quality myths are exploded, hidden issues are confronted, & an array of electronics specific solutions are offered.
Author : Marsha Ludwig-Becker
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 744 pages
Book Rating : 4.F/5 ( download)
Download or read book Electronic Systems Quality Management Handbook written by Marsha Ludwig-Becker and published by McGraw-Hill Companies. This book was released on 1997 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Quality management for electronic systems has grown far beyond the basic inspection techniques of the past. New, performance-based quality management approaches are now used at every electronics company, from huge corporations to small start-ups. This book goes beyond generic quality approaches to present an electronics-specific program for quality management.
Author : Phil Marcoux
Publisher : Springer Science & Business Media
ISBN 13 : 1461535328
Total Pages : 351 pages
Book Rating : 4.4/5 (615 download)
Download or read book Fine Pitch Surface Mount Technology written by Phil Marcoux and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Author : Thomas H. Stearns
Publisher : McGraw Hill Professional
ISBN 13 : 9780070610323
Total Pages : 308 pages
Book Rating : 4.6/5 (13 download)
Download or read book Flexible Printed Circuitry written by Thomas H. Stearns and published by McGraw Hill Professional. This book was released on 1996 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work contains the required material for an engineer to successfully design and manufacture flex circuitry. It details the relationship between design variations and overall cost.
Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 600 pages
Book Rating : 4.3/5 (91 download)
Download or read book Flip Chip Technologies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR
Author : Charles A. Harper
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 680 pages
Book Rating : 4.4/5 (91 download)
Download or read book Active Electronic Component Handbook written by Charles A. Harper and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 680 pages. Available in PDF, EPUB and Kindle. Book excerpt: Complete with coverage of the latest microwave and electro-optic components, the new edition of this classic reference meets the needs of all engineers who design, manufacture, and use active components in all categories of electronic systems. Includes data on the full range of semiconductors, guidelines for speed-power-density-cost tradeoffs, architectures, and noise reduction techniques, plus sections on microprocessors and microcontrollers. 700 illustrations.
Author : Charles A. Harper
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 814 pages
Book Rating : 4.3/5 (91 download)
Download or read book Electronic Materials and Processes Handbook written by Charles A. Harper and published by McGraw-Hill Professional Publishing. This book was released on 1994 with total page 814 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems.
Author : Aicha Elshabini
Publisher : McGraw Hill Professional
ISBN 13 : 9780070190252
Total Pages : 680 pages
Book Rating : 4.1/5 (92 download)
Download or read book Thin Film Technology Handbook written by Aicha Elshabini and published by McGraw Hill Professional. This book was released on 1998 with total page 680 pages. Available in PDF, EPUB and Kindle. Book excerpt: The most comprehensive source available on the preparation, characterization, and emerging applications of thin film. This book features extensive new advances applied in multichip modules (MCMs), and covers the basic principles and applications of thin film deposition techniques for practical use. It provides and develops design guidelines to realize multilayer structures in microcircuits, thus addressing a critical and rapidly growing area.
Author : Stephen G. Konsowski
Publisher : McGraw Hill Professional
ISBN 13 : 9780070359703
Total Pages : 488 pages
Book Rating : 4.3/5 (597 download)
Download or read book Electronic Packaging of High Speed Circuitry written by Stephen G. Konsowski and published by McGraw Hill Professional. This book was released on 1997 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
