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Substrate Coupling In Mixed Signal Ics
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Book Synopsis Substrate Noise Coupling in Mixed-Signal ASICs by : Stéphane Donnay
Download or read book Substrate Noise Coupling in Mixed-Signal ASICs written by Stéphane Donnay and published by Springer Science & Business Media. This book was released on 2006-05-31 with total page 311 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Book Synopsis Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits by : Nishath K. Verghese
Download or read book Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits written by Nishath K. Verghese and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.
Book Synopsis Substrate Noise Coupling in RFICs by : Ahmed Helmy
Download or read book Substrate Noise Coupling in RFICs written by Ahmed Helmy and published by Springer Science & Business Media. This book was released on 2008-03-23 with total page 129 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
Book Synopsis Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs by : X. Aragones
Download or read book Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs written by X. Aragones and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.
Book Synopsis Substrate Coupling in Mixed Signal IC's by : Elie M. Issa
Download or read book Substrate Coupling in Mixed Signal IC's written by Elie M. Issa and published by . This book was released on 2007 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Integrating digital with sensitive analog circuitry has created concerns for signal integrity. The fast switching digital signal creates noise that injects through the doped silicon substrate abd travels through it, due to its low resistivity to the analog circuits causing damages and operational bandwidth reduction. How much is the coupling and how to control it? These are the questions that will be answered in this thesis using 3D filed solver, COMSOL, to extract the substrate coupling parameters." (v)
Book Synopsis Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs by : Balsha R. Stanisic
Download or read book Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs written by Balsha R. Stanisic and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.
Book Synopsis Synthesized Compact Models for Substrate Noise Coupling in Mixed-signal ICS by : Hai Lan
Download or read book Synthesized Compact Models for Substrate Noise Coupling in Mixed-signal ICS written by Hai Lan and published by . This book was released on 2006 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Characterization of Substrate Noise Coupling, Its Impacts and Remedies in RF and Mixed-signal ICs by : Ahmed Helmy
Download or read book Characterization of Substrate Noise Coupling, Its Impacts and Remedies in RF and Mixed-signal ICs written by Ahmed Helmy and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: Substrate noise coupling in integrated circuits is the process by which interference signals generated by high speed digital blocks cause parasitic currents to flow in the silicon substrate and couple devices in various parts of the circuits on this common substrate. In RFIC the switching noise couples to the sensitive analog circuits through the substrate causing degradation in performance and yield hit. Overcoming substrate coupling is a key issue in successful "system on chip" integration. In this thesis a substrate aware design flow is built, calibrated to silicon and used as part of the design flow to uncover substrate coupling problems in RFICs in the design phase. The flow is used to develop the first comprehensive RF substrate noise isolation design guide to be used by RF designers during the design phase. This will allow designers to optimize the design to maximize noise isolation and protect sensitive blocks from being degraded by substrate noise coupling. Several effects of substrate coupling on circuit performance will be identified and remedies will be given based on the design guide. Three case studies are designed to analyze the substrate coupling problem in RFICs. The case studies are designed to attack the problem from the device, circuit and system levels. On the device level a special emphasis is given to designing on chip inductors as an important device in RFIC. An accurate model is developed for a broadband fit of the inductor scattering parameters. This model is shown to be scalable and is proven to be accurate across various frequency bands and geometries. A special emphasis is put on the design for manufacturing effects that affect the design robustness. A circuit level case study is developed and results are compared to simulations and measurements to highlight the need for such a flow before tapping out to ensure a yielding part. The system level problem studied is a GSM receiver where the research results are directly applied to it as a demonstration vehicle to debug and resolve a system level substrate noise coupling problem that otherwise caused a product to be on the edge of malfunction.
Book Synopsis Parasitic Substrate Coupling in High Voltage Integrated Circuits by : Pietro Buccella
Download or read book Parasitic Substrate Coupling in High Voltage Integrated Circuits written by Pietro Buccella and published by Springer. This book was released on 2018-03-14 with total page 195 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools. The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits. The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis. Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits; Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate; Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices; Offers design guidelines to reduce couplings by adding specific protections.
Book Synopsis Substrate Noise by : Edoardo Charbon
Download or read book Substrate Noise written by Edoardo Charbon and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.
Book Synopsis Fast Parasitic Extraction for Substrate Coupling in Mixed-signal ICs by : Nishath K. Verghese
Download or read book Fast Parasitic Extraction for Substrate Coupling in Mixed-signal ICs written by Nishath K. Verghese and published by . This book was released on 1995 with total page 4 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "Techniques for the fast extraction of substrate resistances in mixed-signal integrated circuits are presented. For a given process, a simple analytical model for point-to-point substrate impedance is determined during a preprocessing stage. A hierarchical extraction strategy is then employed using this simple analytical model in conjunction with a delimitation technique to quickly determine resistive coupling through the substrate on a cell-by-cell basis. The extraction procedure yields a resistive netlist which when simulated, along with necessary parasitic capacitances and the circuit itself, determines any performance limitations in the design due to substrate coupling. The extraction procedure has been used in the verification and redesign of a triple 8-bit video A/D converter IC for substrate-noise problems."
Book Synopsis Extraction and Simulation Techniques for Substrate-coupled Noise in Mixed-signal Integrated Circuits by : Nishath K. Verghese
Download or read book Extraction and Simulation Techniques for Substrate-coupled Noise in Mixed-signal Integrated Circuits written by Nishath K. Verghese and published by . This book was released on 1995 with total page 136 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "This thesis presents several techniques for the analysis of substrate-coupled noise in mixed-signal integrated circuits. Advantages and limitations of several commonly employed analysis techniques for substrate coupling are outlined. A preprocessed boundary element technique introduced in this thesis is shown to overcome all the limitations of the prior approaches and results that confirm its accuracy and superior performance are presented. Methods are also discussed that dramatically accelerate the solution of the preprocessed boundary element equations. A methodology that applies these fast techniques to the verification of large mixed-signal circuits and results that confirm its efficiency are described. An application of this complete methodology to the design and verification of an industrial mixed-signal video analog-to- digital converter IC for substrate noise problems that ensured its success on first pass silicon is presented."
Download or read book Mixed-Signal Design Cluster written by and published by . This book was released on 2001 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Modeling and Analysis of Thermally-aware Substrate Noise Coupling in Nanometer-scale Mixed-signal ICs by : Injoon Jo
Download or read book Modeling and Analysis of Thermally-aware Substrate Noise Coupling in Nanometer-scale Mixed-signal ICs written by Injoon Jo and published by . This book was released on 2004 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Noise Coupling in System-on-Chip by : Thomas Noulis
Download or read book Noise Coupling in System-on-Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 519 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Book Synopsis Reducing Signal Coupling and Crosstalk in Monolithic, Mixed-signal Integrated Circuits by : Matthew John Clewell
Download or read book Reducing Signal Coupling and Crosstalk in Monolithic, Mixed-signal Integrated Circuits written by Matthew John Clewell and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Designers of mixed-signal systems must understand coupling mechanisms at the system, PC board, package and integrated circuit levels to control crosstalk, and thereby minimize degradation of system performance. This research examines coupling mechanisms in a RF-targeted high-resistivity partially-depleted Silicon-on-Insulator (SOI) IC process and applying similar coupling mitigation strategies from higher levels of design, proposes techniques to reduce coupling between sub-circuits on-chip. A series of test structures was fabricated with the goal of understanding and reducing the electric and magnetic field coupling at frequencies up to C-Band. Electric field coupling through the active-layer and substrate of the SOI wafer is compared for a variety of isolation methods including use of deep-trench surrounds, blocking channel-stopper implant, blocking metal-fill layers and using substrate contact guard-rings. Magnetic coupling is examined for on-chip inductors utilizing counter-winding techniques, using metal shields above noisy circuits, and through the relationship between separation and the coupling coefficient. Finally, coupling between bond pads employing the most effective electric field isolation strategies is examined. Lumped element circuit models are developed to show how different coupling mitigation strategies perform. Major conclusions relative to substrate coupling are 1) substrates with resistivity 1 [kiloohm] cm or greater act largely as a high-K insulators at sufficiently high frequency, 2) compared to capacitive coupling paths through the substrate, coupling through metal-fill has little effect and 3) the use of substrate contact guard-rings in multi-ground domain designs can result in significant coupling between domains if proper isolation strategies such as the use of deep-trench surrounds are not employed. The electric field coupling, in general, is strongly dependent on the impedance of the active-layer and frequency, with isolation exceeding 80 dB below 100 MHz and relatively high coupling values of 40 dB or more at upper S-band frequencies, depending on the geometries and mitigation strategy used. Magnetic coupling was found to be a strong function of circuit separation and the height of metal shields above the circuits. Finally, bond pads utilizing substrate contact guard-rings resulted in the highest degree of isolation and the lowest pad load capacitance of the methods tested.
Book Synopsis Substrate Noise Coupling in Analog/RF Circuits by : Stephane Bronckers
Download or read book Substrate Noise Coupling in Analog/RF Circuits written by Stephane Bronckers and published by Artech House. This book was released on 2010 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation structures and circuit techniques to make analog/RF circuits more immune to substrate noise. Topics include substrate noise propagation, passive isolation structures, noise couple in active devices, measuring the coupling mechanisms in analog/RF circuits, prediction of the impact of substrate noise on analog/RF circuits, and noise coupling in analog/RF systems.
