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Stress Induced Phenomena In Metallization
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Book Synopsis Stress-Induced Phenomena in Metallization by : Paul S. Ho
Download or read book Stress-Induced Phenomena in Metallization written by Paul S. Ho and published by American Institute of Physics. This book was released on 2009-07-02 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: This symposium focuses on new developments in the fields of experimental and theoretical nuclear physics, including nuclear dynamics, nuclear structure including hypernuclei, nuclear matter, nuclear astrophysics, applications. The participants also reported on the innovative instrumentation, including future large-scale facility both in Japan and Italy that will be essential for future studies.
Book Synopsis Stress-induced Phenomena in Metallization by : Paul S. Ho
Download or read book Stress-induced Phenomena in Metallization written by Paul S. Ho and published by . This book was released on 1996 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Stress-Induced Phenomena in Metallization by : Shinichi Ogawa
Download or read book Stress-Induced Phenomena in Metallization written by Shinichi Ogawa and published by American Institute of Physics. This book was released on 2007-11-13 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: Kyoto, Japan, 4-7 April 2007
Book Synopsis Stress Induced Phenomena in Metallization by : Shefford P. Baker
Download or read book Stress Induced Phenomena in Metallization written by Shefford P. Baker and published by American Inst. of Physics. This book was released on 2002-04-09 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tiny metal structures, less than a millionth of a meter across, are critical building blocks in a number of high-tech devices such as computer chips. These "metallizations" are subjected to extreme conditions of temperature, electric current density, and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.
Book Synopsis Stress-Induced Phenomena in Metallization by : Ehrenfried Zschech
Download or read book Stress-Induced Phenomena in Metallization written by Ehrenfried Zschech and published by American Institute of Physics. This book was released on 2006-02-16 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: These proceedings present current research on issues related to stress-induced phenomena in on-chip metal interconnects and solder joints. The volume will appeal to scientists, engineers, graduate students interested in research and development of microelectronic devices as well as technology integration, and semiconductor industry professionals and equipment suppliers.
Book Synopsis Stress-induced Phenomena in Metallization by : Paul S. Ho
Download or read book Stress-induced Phenomena in Metallization written by Paul S. Ho and published by . This book was released on 1994 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Stress-induced Phenomena in Metallization by :
Download or read book Stress-induced Phenomena in Metallization written by and published by . This book was released on 2007 with total page 204 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Stress-Induced Phenomena in Metallization by : P. S. Ho
Download or read book Stress-Induced Phenomena in Metallization written by P. S. Ho and published by A I P Press. This book was released on 2004-12-14 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: Continuing the spirit of the previous workshops, the proceedings contain new research results and advances in basic understanding of stress-induced phenomena in metallization. The current technology drive to implement low dielectric constant materials into copper metallization has brought new and significant challenges in process integration and reliability. Stresses arising in metallizations and surrounding dielectric structures due to thermal mismatch, electromigration, microstructure changes or process integration can lead to damage and failure of interconnect structures. Understanding stress-related phenomena in new materials and structures becomes critical for reliability improvement and metallization development. This is reflected in the papers included in the proceedings, which report results on electromigration, thermal stresses and void formation in copper-low k interconnect structures. The book also includes new results on fracture of low k dielectric structures, an important research area for reliability and integration of copper metallization.
Book Synopsis Stress-induced Phenomena in Metallization by : No
Download or read book Stress-induced Phenomena in Metallization written by No and published by American Institute of Physics. This book was released on 1998-03-27 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Stress-Induced Phenomena in Metallization by : Ehrenfried Zschech
Download or read book Stress-Induced Phenomena in Metallization written by Ehrenfried Zschech and published by American Inst. of Physics. This book was released on 2010-12-20 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: One current challenge to micro- and nanoelectronics is the understanding of stress-related phenomena in metallization. Stresses arising in on-chip and 3D metal interconnects and in the surrounding materials due to thermal mismatch, microstructure changes or process integration as well as electromigration can lead to degradation and failure of microelectronic products. The implementation of low dielectric constant materials into the inlaid copper backend-of-line process has brought new challenges for process integration and reliability. Understanding stress-related phenomena in new materials used for 3D integration and packaging, particularly using through silicon vias and microbumps, is critical for future microelectronic products. The Proceedings summarize new research results and advances in basic understanding of stress-induced phenomena in metallization. In addition to experimental studies, modelling and simulation capabilities are demonstrated to evaluate the effect of stress on product performance and reliability. Stress-related phenomena in 3D IC interconnects are covered too.
Book Synopsis Stress-Induced Phenomena in Metallization by : P. S. Ho
Download or read book Stress-Induced Phenomena in Metallization written by P. S. Ho and published by A I P Press. This book was released on 1996 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Proceedings of the June 1995 workshop, reporting on new and basic results in electromigration and stress-induced void formation. Sections on stress characteristics and void formation in thin films and interconnects, and electromigration and damage mechanisms in interconnects, contain research in areas such as stresses in passivated gold and metal lines; electrical measurement of stress- induced void growth; modeling electromigration in multi-level interconnects; comparison of electromigration in submicron Al(Cu) and Cu thin-film lines; and resistance oscillations induced by DC electromigration. No index. Annotation c. by Book News, Inc., Portland, Or.
Book Synopsis Stress Induced Phenomena in Metallization by : Hidekazu Okabayashi
Download or read book Stress Induced Phenomena in Metallization written by Hidekazu Okabayashi and published by American Institute of Physics. This book was released on 1998-02-20 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The scope of this workshop was extended from the last one two years ago in two areas to reflect the current interest in interconnect metallization. First, the topics in metallization were extended to include problems related to atomic transport for reflow and filling of vias and contact holes, silicadation, and barrier metals. These topics are of particular interest for the development of the current quarter- micron metallization. The second was to include metallization for liquid crystal display of devices and surface acoustic devices in addition to semiconductor devices. Problems related to mass transport in these devices have become increasingly important, in some cases more so than those in semiconductor devices. Several papers were presented to discuss the similarities and differences of these phenomena and their mechanisms, focusing on the questions concerning why and how atoms migrate and what are the effects of the migration.
Book Synopsis Stress-induced Phenomena in Metallization by : Paul Totta
Download or read book Stress-induced Phenomena in Metallization written by Paul Totta and published by American Institute of Physics. This book was released on 1994 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: The aim of this text of stress-induced phenomena in metallization is to assess the current understanding of the problems, to discuss the implications for the reliability of future devices, and to identify needs and directions for future research.
Book Synopsis Stress-Induced Phenomena in Metallization by : Paul S. Ho
Download or read book Stress-Induced Phenomena in Metallization written by Paul S. Ho and published by American Inst. of Physics. This book was released on 2004-12-14 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: These proceedings contain new research results and advances in basic understanding of stress-induced phenomena in metallization. Papers cover results on electromigration, thermal stresses and void formation in copper-low k interconnect structures.
Book Synopsis Stress-induced Phenomena in Metallization by : No
Download or read book Stress-induced Phenomena in Metallization written by No and published by American Institute of Physics. This book was released on 1998-03-27 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Stress-induced Phenomena in Metallization by : No
Download or read book Stress-induced Phenomena in Metallization written by No and published by American Institute of Physics. This book was released on 1998-03-27 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: From a September 1991 international workshop in Ithaca, New York, 18 papers address the growing concern over the impact of stress-induced voiding and related phenomena on reliability in very large scale integrated circuits, as the circuit features become ever smaller and challenge the capabilities o
Book Synopsis Stress Induced Phenomena in Metallization by : Shefford P. Baker
Download or read book Stress Induced Phenomena in Metallization written by Shefford P. Baker and published by American Institute of Physics. This book was released on 2002-04-09 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tiny metal structures, less than a millionth of a meter across, are critical building blocks in a number of high-tech devices such as computer chips. These "metallizations" are subjected to extreme conditions of temperature, electric current density, and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.
