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Solderless Assembly For Electronics
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Book Synopsis Solderless Assembly for Electronics by : Joseph Fjelstad
Download or read book Solderless Assembly for Electronics written by Joseph Fjelstad and published by . This book was released on 2017-04 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder has been a loyal servant of the electronics manufacturing industry for years; however, like any aging servant, the efficacy of solder has been waning as the industry looks to make products increasingly dense. Solder has always been the weak link in the electronics manufacturing process, where a substantial number of defects are created and solder joints remain the most common site of failure in electronic systems. With that in mind, an alternative approach to manufacturing electronic assemblies without the use of solder is discussed in this short book. In most fundamental terms, the process is one where, instead of building PCBs and placing and soldering components to them, a component board is assembled and the terminations on the components are interconnected using traditional PCB processes and bypassing, completely, the high-temperature soldering process. The reader will be shown the numerous prospective advantages and benefits--economic, technical and environmental--of this important alternative approach, including rapid prototyping, which was first suggested 10 years ago and is just now beginning to be appreciated.
Book Synopsis Assembly and Reliability of Lead-Free Solder Joints by : John H. Lau
Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Book Synopsis Modern Solder Technology for Competitive Electronics Manufacturing by : Jennie S. Hwang
Download or read book Modern Solder Technology for Competitive Electronics Manufacturing written by Jennie S. Hwang and published by McGraw Hill Professional. This book was released on 1996 with total page 678 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.
Book Synopsis Newnes Electronics Assembly Handbook by : Keith Brindley
Download or read book Newnes Electronics Assembly Handbook written by Keith Brindley and published by Elsevier. This book was released on 2013-10-22 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are described. The book also underscores testing for quality. Reliability, component parts testing, production processes, and the packaged and unpackaged assemblies are discussed. The text also examines standardization of electronics manufacture. Reference to standards, standards of organizations and bodies, assessed quality of companies, and setting up of company standards are considered. The book also discusses the process of selling to the Ministry of Defense. Procurement executive, quality assurance, and procurement executive policies and procedures are clarified. The handbook is a helpful reference for readers wanting to study the processes involved in electronic assembling.
Book Synopsis Soldering in Electronics Assembly by : Mike Judd
Download or read book Soldering in Electronics Assembly written by Mike Judd and published by Elsevier. This book was released on 2013-09-24 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assemblies.
Book Synopsis Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by : Karl J. Puttlitz
Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Book Synopsis Connections in Electronic Assemblies by : Anthony J. Bilotta
Download or read book Connections in Electronic Assemblies written by Anthony J. Bilotta and published by CRC Press. This book was released on 1985-12-03 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The Electronics Assembly Handbook by : Frank Riley
Download or read book The Electronics Assembly Handbook written by Frank Riley and published by . This book was released on 1988 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Lead-Free Soldering in Electronics by : Katsuaki Suganuma
Download or read book Lead-Free Soldering in Electronics written by Katsuaki Suganuma and published by CRC Press. This book was released on 2003-12-11 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.
Book Synopsis Handbook of Electronic Assembly and a Guide to SMTA Certification by : Ronald Lasky
Download or read book Handbook of Electronic Assembly and a Guide to SMTA Certification written by Ronald Lasky and published by . This book was released on 2014-01-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Originally conceived as a supplement to the SMTA Certification Program, this book is a must-have reference manual for all process engineers working in the electronics industry as well as anyone just entering the industry. The book provides an in-depth understanding of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test.
Book Synopsis Soldering in Electronics Assembly by : MIKE JUDD
Download or read book Soldering in Electronics Assembly written by MIKE JUDD and published by Newnes. This book was released on 1999-04-14 with total page 369 pages. Available in PDF, EPUB and Kindle. Book excerpt: Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. A practical guide for the industry covering all the main soldering processes currently in use Cleaning, faults, troubleshooting and standards are all major topics Considers safety and solder process quality assessment
Book Synopsis Solder Paste in Electronics Packaging by : Jennie S. Hwang
Download or read book Solder Paste in Electronics Packaging written by Jennie S. Hwang and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 461 pages. Available in PDF, EPUB and Kindle. Book excerpt: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
Book Synopsis Solder Joint Technology by : King-Ning Tu
Download or read book Solder Joint Technology written by King-Ning Tu and published by Springer Science & Business Media. This book was released on 2007-07-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
Book Synopsis Electronics Manufacturing by : John H. Lau
Download or read book Electronics Manufacturing written by John H. Lau and published by McGraw Hill Professional. This book was released on 2003 with total page 680 pages. Available in PDF, EPUB and Kindle. Book excerpt: An engineer's guidebook demonstrating non-toxic electronics manufacturing processes
Book Synopsis Surface Mount Technology by : Charles-Henri Mangin
Download or read book Surface Mount Technology written by Charles-Henri Mangin and published by Ifs Publications. This book was released on 1987 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Learn to Solder written by Brian Jepson and published by "O'Reilly Media, Inc.". This book was released on 2012-05-01 with total page 53 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn the fundamentals of soldering—and pick up an essential skill for building electronic gadgets. You’ll discover how to preheat and tin your iron, make a good solder joint, desolder cleanly (when things don't quite go right), and how to use helping hands to hold components in place. This concise book is part of MAKE’s Getting Started with Soldering Kit. Using the tools in the kit and some electronic components, you can practice soldering while making fun blinky objects. Then show the world you just learned a new skill by wearing the Learn to Solder Skill Badge. Learn how to prepare your workspace Get to know the components you’ll work with Use the best methods for soldering components in place Experience the perfect solder joint Know how to desolder when things don’t work the first time Heat up the iron and start soldering today!
Book Synopsis Lead Free Solder by : John Hock Lye Pang
Download or read book Lead Free Solder written by John Hock Lye Pang and published by Springer Science & Business Media. This book was released on 2011-10-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
