Soldering In Electronics Assembly

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Soldering in Electronics Assembly

Author : MIKE JUDD
Publisher : Elsevier
ISBN 13 : 008051734X
Total Pages : 385 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Soldering in Electronics Assembly by : MIKE JUDD

Download or read book Soldering in Electronics Assembly written by MIKE JUDD and published by Elsevier. This book was released on 1999-03-26 with total page 385 pages. Available in PDF, EPUB and Kindle. Book excerpt: Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment

Solder Paste in Electronics Packaging

Author : Jennie Hwang
Publisher : Springer Science & Business Media
ISBN 13 : 146153528X
Total Pages : 374 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Solder Paste in Electronics Packaging by : Jennie Hwang

Download or read book Solder Paste in Electronics Packaging written by Jennie Hwang and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.

Modern Solder Technology for Competitive Electronics Manufacturing

Author : Jennie S. Hwang
Publisher : McGraw Hill Professional
ISBN 13 : 9780070317499
Total Pages : 678 pages
Book Rating : 4.3/5 (174 download)

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Book Synopsis Modern Solder Technology for Competitive Electronics Manufacturing by : Jennie S. Hwang

Download or read book Modern Solder Technology for Competitive Electronics Manufacturing written by Jennie S. Hwang and published by McGraw Hill Professional. This book was released on 1996 with total page 678 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.

Handbook of Electronic Assembly and a Guide to SMTA Certification

Author : Ronald Lasky
Publisher :
ISBN 13 : 9780988887312
Total Pages : pages
Book Rating : 4.8/5 (873 download)

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Book Synopsis Handbook of Electronic Assembly and a Guide to SMTA Certification by : Ronald Lasky

Download or read book Handbook of Electronic Assembly and a Guide to SMTA Certification written by Ronald Lasky and published by . This book was released on 2014-01-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Originally conceived as a supplement to the SMTA Certification Program, this book is a must-have reference manual for all process engineers working in the electronics industry as well as anyone just entering the industry. The book provides an in-depth understanding of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test.

Getting Started with Soldering

Author : Marc de Vinck
Publisher : Maker Media, Inc.
ISBN 13 : 1680453815
Total Pages : 165 pages
Book Rating : 4.6/5 (84 download)

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Book Synopsis Getting Started with Soldering by : Marc de Vinck

Download or read book Getting Started with Soldering written by Marc de Vinck and published by Maker Media, Inc.. This book was released on 2017-10-11 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: Getting Started with Soldering not only teaches new makers and experimenters the core principles of soldering, it also functions as an excellent reference and resource for beginners and more advanced makers alike. The book guides readers through the fundamentals of soldering, explains the tools and materials, demonstrates proper techniques, and shows how to fix mistakes or broken connections. It even includes guidance on more advanced techniques such as surface-mount soldering for electronics. From choosing the right soldering iron to making perfect connections, readers will acquire the knowledge and skills needed to form a strong foundation for a lifetime of making. Soldering is a core concept in making, electronics prototyping, and home repairs The many different types of soldering -- requiring different materials and tools -- are explained with easy-to-follow instructions Full-color photographs and illustrations throughout create a visually engaging format for learning Pricing and technical considerations help readers select the best tools for their budgets and needs Troubleshooting guidelines show how to repair solder connections that have failed from improper technique or from age

Reflow Soldering Processes

Author : Ning-Cheng Lee
Publisher : Newnes
ISBN 13 : 0750672188
Total Pages : 282 pages
Book Rating : 4.7/5 (56 download)

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Book Synopsis Reflow Soldering Processes by : Ning-Cheng Lee

Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Soldering

Author : Mel Schwartz
Publisher : ASM International
ISBN 13 : 1627080589
Total Pages : 207 pages
Book Rating : 4.6/5 (27 download)

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Book Synopsis Soldering by : Mel Schwartz

Download or read book Soldering written by Mel Schwartz and published by ASM International. This book was released on 2014-03-01 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.

Electronic Assembly Fabrication

Author : Charles A. Harper
Publisher : McGraw Hill Professional
ISBN 13 : 9780071378826
Total Pages : 692 pages
Book Rating : 4.3/5 (788 download)

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Book Synopsis Electronic Assembly Fabrication by : Charles A. Harper

Download or read book Electronic Assembly Fabrication written by Charles A. Harper and published by McGraw Hill Professional. This book was released on 2002-04-10 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printed circuit history and overview. Development and fabrication of IC chips. Packaging of IC chips. Printed circuit board fabrication.

The Electronics Assembly Handbook

Author : Frank Riley
Publisher : Springer Science & Business Media
ISBN 13 : 3662131617
Total Pages : 576 pages
Book Rating : 4.6/5 (621 download)

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Book Synopsis The Electronics Assembly Handbook by : Frank Riley

Download or read book The Electronics Assembly Handbook written by Frank Riley and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.

Soldering in Electronics Assembly

Author : Mike Judd
Publisher : Elsevier
ISBN 13 : 1483102173
Total Pages : 301 pages
Book Rating : 4.4/5 (831 download)

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Book Synopsis Soldering in Electronics Assembly by : Mike Judd

Download or read book Soldering in Electronics Assembly written by Mike Judd and published by Elsevier. This book was released on 2013-09-24 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assemblies.

Lead-free Soldering Process Development and Reliability

Author : Jasbir Bath
Publisher : John Wiley & Sons
ISBN 13 : 1119482046
Total Pages : 512 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Lead-free Soldering Process Development and Reliability by : Jasbir Bath

Download or read book Lead-free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-06-12 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Soldering Manual

Author : American Welding Society. Committee on Brazing and Soldering
Publisher :
ISBN 13 :
Total Pages : 192 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis Soldering Manual by : American Welding Society. Committee on Brazing and Soldering

Download or read book Soldering Manual written by American Welding Society. Committee on Brazing and Soldering and published by . This book was released on 1959 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt:

The Printed Circuit Assembler's Guide To... Solder Defects

Author : Indium Corporation
Publisher :
ISBN 13 : 9781737023289
Total Pages : pages
Book Rating : 4.0/5 (232 download)

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Book Synopsis The Printed Circuit Assembler's Guide To... Solder Defects by : Indium Corporation

Download or read book The Printed Circuit Assembler's Guide To... Solder Defects written by Indium Corporation and published by . This book was released on 2021-11-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. Indium Corporations' Christopher Nash and Dr. Ronald C. Lasky address six top defect topics, as well as how to avoid them, including (1) voiding in bottom-termination components, (2) graping, (3) head-in-pillow and non-wet opens, (4) tombstoning of passive components, (5) insufficients, and (6) solder balling and beading. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

Learn to Solder

Author : Brian Jepson
Publisher : "O'Reilly Media, Inc."
ISBN 13 : 1449337430
Total Pages : 53 pages
Book Rating : 4.4/5 (493 download)

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Book Synopsis Learn to Solder by : Brian Jepson

Download or read book Learn to Solder written by Brian Jepson and published by "O'Reilly Media, Inc.". This book was released on 2012-05-01 with total page 53 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn the fundamentals of soldering—and pick up an essential skill for building electronic gadgets. You’ll discover how to preheat and tin your iron, make a good solder joint, desolder cleanly (when things don't quite go right), and how to use helping hands to hold components in place. This concise book is part of MAKE’s Getting Started with Soldering Kit. Using the tools in the kit and some electronic components, you can practice soldering while making fun blinky objects. Then show the world you just learned a new skill by wearing the Learn to Solder Skill Badge. Learn how to prepare your workspace Get to know the components you’ll work with Use the best methods for soldering components in place Experience the perfect solder joint Know how to desolder when things don’t work the first time Heat up the iron and start soldering today!

Newnes Electronics Assembly Handbook

Author : Keith Brindley
Publisher : Elsevier
ISBN 13 : 1483105377
Total Pages : 354 pages
Book Rating : 4.4/5 (831 download)

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Book Synopsis Newnes Electronics Assembly Handbook by : Keith Brindley

Download or read book Newnes Electronics Assembly Handbook written by Keith Brindley and published by Elsevier. This book was released on 2016-06-30 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: Newnes Electronics Assembly Handbook

Lead-Free Soldering in Electronics

Author : Katsuaki Suganuma
Publisher : CRC Press
ISBN 13 : 0824758595
Total Pages : 355 pages
Book Rating : 4.8/5 (247 download)

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Book Synopsis Lead-Free Soldering in Electronics by : Katsuaki Suganuma

Download or read book Lead-Free Soldering in Electronics written by Katsuaki Suganuma and published by CRC Press. This book was released on 2003-12-11 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.

SMT Soldering Handbook

Author : RUDOLF STRAUSS
Publisher : Elsevier
ISBN 13 : 0080480977
Total Pages : 389 pages
Book Rating : 4.0/5 (84 download)

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Book Synopsis SMT Soldering Handbook by : RUDOLF STRAUSS

Download or read book SMT Soldering Handbook written by RUDOLF STRAUSS and published by Elsevier. This book was released on 1998-02-24 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. - Written by founding father of SMT technology - Standard specifications have been fully updated - New chapter covering Ball Grid Array (BGA) technology