Solder Paste In Electronics Packaging

Download Solder Paste In Electronics Packaging full books in PDF, epub, and Kindle. Read online Solder Paste In Electronics Packaging ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!

Solder Paste in Electronics Packaging

Author : Jennie S. Hwang
Publisher : Springer Science & Business Media
ISBN 13 : 9401160503
Total Pages : 461 pages
Book Rating : 4.4/5 (11 download)

DOWNLOAD NOW!

Book Synopsis Solder Paste in Electronics Packaging by : Jennie S. Hwang

Download or read book Solder Paste in Electronics Packaging written by Jennie S. Hwang and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 461 pages. Available in PDF, EPUB and Kindle. Book excerpt: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.

Solder Paste in Electronics Packaging

Author : Jennie S Hwang
Publisher :
ISBN 13 : 9789401160513
Total Pages : 484 pages
Book Rating : 4.1/5 (65 download)

DOWNLOAD NOW!

Book Synopsis Solder Paste in Electronics Packaging by : Jennie S Hwang

Download or read book Solder Paste in Electronics Packaging written by Jennie S Hwang and published by . This book was released on 1989-04-27 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Solder Paste in Electronics Packaging

Author : Jennie Hwang
Publisher :
ISBN 13 : 9781461535294
Total Pages : 484 pages
Book Rating : 4.5/5 (352 download)

DOWNLOAD NOW!

Book Synopsis Solder Paste in Electronics Packaging by : Jennie Hwang

Download or read book Solder Paste in Electronics Packaging written by Jennie Hwang and published by . This book was released on 1992-09-24 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Solder Paste in Electronics Packaging

Author : Jennie Hwang
Publisher : Springer Science & Business Media
ISBN 13 : 146153528X
Total Pages : 374 pages
Book Rating : 4.4/5 (615 download)

DOWNLOAD NOW!

Book Synopsis Solder Paste in Electronics Packaging by : Jennie Hwang

Download or read book Solder Paste in Electronics Packaging written by Jennie Hwang and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.

Lead-Free Soldering in Electronics

Author : Katsuaki Suganuma
Publisher : CRC Press
ISBN 13 : 0824758595
Total Pages : 355 pages
Book Rating : 4.8/5 (247 download)

DOWNLOAD NOW!

Book Synopsis Lead-Free Soldering in Electronics by : Katsuaki Suganuma

Download or read book Lead-Free Soldering in Electronics written by Katsuaki Suganuma and published by CRC Press. This book was released on 2003-12-11 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.

Reflow Soldering Processes

Author : Ning-Cheng Lee
Publisher : Newnes
ISBN 13 : 0750672188
Total Pages : 282 pages
Book Rating : 4.7/5 (56 download)

DOWNLOAD NOW!

Book Synopsis Reflow Soldering Processes by : Ning-Cheng Lee

Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Modern Solder Technology for Competitive Electronics Manufacturing

Author : Jennie S. Hwang
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 680 pages
Book Rating : 4.3/5 (91 download)

DOWNLOAD NOW!

Book Synopsis Modern Solder Technology for Competitive Electronics Manufacturing by : Jennie S. Hwang

Download or read book Modern Solder Technology for Competitive Electronics Manufacturing written by Jennie S. Hwang and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 680 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.

The Electronic Packaging Handbook

Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 1351835548
Total Pages : 937 pages
Book Rating : 4.3/5 (518 download)

DOWNLOAD NOW!

Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 937 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Manufacturing Challenges in Electronic Packaging

Author : Y.C. Lee
Publisher : Springer Science & Business Media
ISBN 13 : 1461558034
Total Pages : 270 pages
Book Rating : 4.4/5 (615 download)

DOWNLOAD NOW!

Book Synopsis Manufacturing Challenges in Electronic Packaging by : Y.C. Lee

Download or read book Manufacturing Challenges in Electronic Packaging written by Y.C. Lee and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Solder Joint Reliability

Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1461539102
Total Pages : 649 pages
Book Rating : 4.4/5 (615 download)

DOWNLOAD NOW!

Book Synopsis Solder Joint Reliability by : John H. Lau

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

The Electronic Packaging Handbook

Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 9781420049848
Total Pages : 648 pages
Book Rating : 4.0/5 (498 download)

DOWNLOAD NOW!

Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Lead-Free Soldering in Electronics

Author : Katsuaki Suganuma
Publisher : CRC Press
ISBN 13 : 9780824741020
Total Pages : 376 pages
Book Rating : 4.7/5 (41 download)

DOWNLOAD NOW!

Book Synopsis Lead-Free Soldering in Electronics by : Katsuaki Suganuma

Download or read book Lead-Free Soldering in Electronics written by Katsuaki Suganuma and published by CRC Press. This book was released on 2003-12-11 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.

Solder Paste Applications for Surface Mount Technology Used in PC Manufacture

Author : Ronald P. Anjard
Publisher :
ISBN 13 :
Total Pages : 6 pages
Book Rating : 4.:/5 (255 download)

DOWNLOAD NOW!

Book Synopsis Solder Paste Applications for Surface Mount Technology Used in PC Manufacture by : Ronald P. Anjard

Download or read book Solder Paste Applications for Surface Mount Technology Used in PC Manufacture written by Ronald P. Anjard and published by . This book was released on 1985 with total page 6 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Power Electronic Packaging

Author : Yong Liu
Publisher : Springer Science & Business Media
ISBN 13 : 1461410525
Total Pages : 606 pages
Book Rating : 4.4/5 (614 download)

DOWNLOAD NOW!

Book Synopsis Power Electronic Packaging by : Yong Liu

Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Development of a Solder Paste in Collaboration with Three Partners

Author : A. M. Breuil
Publisher :
ISBN 13 :
Total Pages : 16 pages
Book Rating : 4.:/5 (255 download)

DOWNLOAD NOW!

Book Synopsis Development of a Solder Paste in Collaboration with Three Partners by : A. M. Breuil

Download or read book Development of a Solder Paste in Collaboration with Three Partners written by A. M. Breuil and published by . This book was released on 1990 with total page 16 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Solder Materials

Author : Kwang-lung Lin
Publisher : World Scientific
ISBN 13 : 9813238216
Total Pages : 388 pages
Book Rating : 4.8/5 (132 download)

DOWNLOAD NOW!

Book Synopsis Solder Materials by : Kwang-lung Lin

Download or read book Solder Materials written by Kwang-lung Lin and published by World Scientific. This book was released on 2018-07-13 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.

Electronic Packaging and Interconnection Handbook

Author : Charles A. Harper
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 1112 pages
Book Rating : 4.3/5 (91 download)

DOWNLOAD NOW!

Book Synopsis Electronic Packaging and Interconnection Handbook by : Charles A. Harper

Download or read book Electronic Packaging and Interconnection Handbook written by Charles A. Harper and published by McGraw-Hill Professional Publishing. This book was released on 2000 with total page 1112 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.