Solder Joint Reliability Of Bga Csp Flip Chip And Fine Pitch Smt Assemblies

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by : John H. Lau

Download or read book Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1997 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: The explosive growth of high-density packaging has created a tremendous impact on the electronic assembly and manufacturing industry. Ball grid array (BGA), chip-scale package (CSP), and solder-bumped flip chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. For these technologies, solder is the electrical and mechanical "glue," and thus solder joint reliability is one of the most critical issues in the development of these technologies. This book is a one-stop guide to the state of the art of solder joint reliability problem-solving methods, or choose a creative, high-performance, robust, and cost-effective design and high-yield manufacturing process for their interconnect systems will be able to do so with this unique sourcebook. It meets the reference needs of design, material, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, vendor, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. This book is structured to provide readers with the necessary know-how for practical, on-the-job problem-solving guidance. The book covers the solder joint reliability of BGA, CSP, flip chip, and FPT assemblies completely, proceeding from the theoretical basics to applications. Specific areas covered include: Definition of reliability, life distribution, failure rate, mean time to failure, etc.; Some well-known life distributions; Accelerated testing; Parameter estimation of life distributions; Acceleration factors for solders;Solder mechanics: plasticity, creep, and constitutive equations; Design, material, and manufacturing processes of BGA, CSP, flip chip, and FTP; Failure analysis and root cause of failure for BGA, CSP, flip chip, and FPT solder joints; Design for reliability of BGA, CSP, flip chip and FPT solder joints; Solder joint reliability of CBGA, PBGA, DBGA, and TBGA assemblies under thermal fatigue, mechanical bending and twisting, and shock and vibration conditions; solder joint reliability of flip chip (e.g., high-temperature and eutectic solder bumped flip chips on ceramic and PCB) assemblies under thermal fatigue, mechanical pulling, shearing, bending and twisting, and shock and vibration conditions; Solder joint reliability of CSP (e.g., LG Semicon's, Mitsubishi's, Motorola's, Tessera's, NEC's, nitto Denko's and Toshiba's) assemblies under thermal fatigue and mechanical bending conditions; Solder joint reliability of PQFP and TSOP assemblies under thermal fatigue, mechanical bending and twisting, and vibration conditions.

Solder Joint Reliability

Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1461539102
Total Pages : 649 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Solder Joint Reliability by : John H. Lau

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Assembly and Reliability of Lead-Free Solder Joints

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811539200
Total Pages : 545 pages
Book Rating : 4.8/5 (115 download)

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Book Synopsis Assembly and Reliability of Lead-Free Solder Joints by : John H. Lau

Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Author : Karl J. Puttlitz
Publisher : CRC Press
ISBN 13 : 082475249X
Total Pages : 1044 pages
Book Rating : 4.8/5 (247 download)

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Book Synopsis Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by : Karl J. Puttlitz

Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Area Array Interconnection Handbook

Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 1461513898
Total Pages : 1250 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz

Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Modeling and Simulation for Microelectronic Packaging Assembly

Author : Shen Liu
Publisher : John Wiley & Sons
ISBN 13 : 0470828412
Total Pages : 586 pages
Book Rating : 4.4/5 (78 download)

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Book Synopsis Modeling and Simulation for Microelectronic Packaging Assembly by : Shen Liu

Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Green Electronics Manufacturing

Author : John X. Wang
Publisher : CRC Press
ISBN 13 : 1439826641
Total Pages : 362 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Green Electronics Manufacturing by : John X. Wang

Download or read book Green Electronics Manufacturing written by John X. Wang and published by CRC Press. This book was released on 2012-07-25 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: Going "green" is becoming a major component of the mission for electronics manufacturers worldwide. While this goal seems simplistic, it poses daunting dilemmas. Yet, to compete effectively in the global economy, manufacturers must take the initiative to drive this crucial movement. Green Electronics Manufacturing: Creating Environmental Sensible Products provides you with a complete reference to design, develop, build, and install an electronic product with special consideration for the product’s environmental impacts during its whole life cycle. The author discusses how to integrate the state-of-the-art technologies of finite element method (FEM) modeling, simulation, and testing to create environmental sensible products of satisfying global environmental regulations, such as Restriction of Hazardous Substances (ROHS) compliance. He covers enabling techniques such as advanced fatigue life modeling, crack propagation analysis, and probabilistic robust design of lead-free electronics. The book also explores how risk engineering methodology empowers practitioners with effective tools such as buckling analysis of tin whiskers. With its emphasis on reducing parts, rationing materials, and reusing components to make products more efficient to build, green electronics intertwines today’s electronics with manufacturing strategies of global sourcing, concurrent engineering, and total quality. Implemented through product and process design, it can help you achieve sustainability to support future generations and at the same time preserve our natural resources. Green Electronics Manufacturing: Creating Environmental Sensible Products gives you the tools to create environmental sensible products while maintaining electronics quality and reliability.

Integrated Circuit Packaging, Assembly and Interconnections

Author : William Greig
Publisher : Springer Science & Business Media
ISBN 13 : 0387339132
Total Pages : 312 pages
Book Rating : 4.3/5 (873 download)

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Book Synopsis Integrated Circuit Packaging, Assembly and Interconnections by : William Greig

Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

Structural Dynamics of Electronic and Photonic Systems

Author : Ephraim Suhir
Publisher : John Wiley & Sons
ISBN 13 : 047088679X
Total Pages : 610 pages
Book Rating : 4.4/5 (78 download)

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Book Synopsis Structural Dynamics of Electronic and Photonic Systems by : Ephraim Suhir

Download or read book Structural Dynamics of Electronic and Photonic Systems written by Ephraim Suhir and published by John Wiley & Sons. This book was released on 2011-04-04 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.

Chiplet Design and Heterogeneous Integration Packaging

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811999171
Total Pages : 542 pages
Book Rating : 4.8/5 (119 download)

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Book Synopsis Chiplet Design and Heterogeneous Integration Packaging by : John H. Lau

Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau and published by Springer Nature. This book was released on 2023-03-27 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Author : Ephraim Suhir
Publisher : CRC Press
ISBN 13 : 0429863829
Total Pages : 344 pages
Book Rating : 4.4/5 (298 download)

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Book Synopsis Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices by : Ephraim Suhir

Download or read book Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices written by Ephraim Suhir and published by CRC Press. This book was released on 2021-01-28 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.

Semiconductor Advanced Packaging

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)

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Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Microvias

Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 : 0071500472
Total Pages : 595 pages
Book Rating : 4.0/5 (715 download)

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Book Synopsis Microvias by : John H. Lau

Download or read book Microvias written by John H. Lau and published by McGraw Hill Professional. This book was released on 2001-04-26 with total page 595 pages. Available in PDF, EPUB and Kindle. Book excerpt: State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.

Reliability Assessments

Author : Franklin Richard Nash, Ph.D.
Publisher : CRC Press
ISBN 13 : 1315353849
Total Pages : 749 pages
Book Rating : 4.3/5 (153 download)

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Book Synopsis Reliability Assessments by : Franklin Richard Nash, Ph.D.

Download or read book Reliability Assessments written by Franklin Richard Nash, Ph.D. and published by CRC Press. This book was released on 2017-07-12 with total page 749 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides engineers and scientists with a single source introduction to the concepts, models, and case studies for making credible reliability assessments. It satisfies the need for thorough discussions of several fundamental subjects. Section I contains a comprehensive overview of assessing and assuring reliability that is followed by discussions of: • Concept of randomness and its relationship to chaos • Uses and limitations of the binomial and Poisson distributions • Relationship of the chi-square method and Poisson curves • Derivations and applications of the exponential, Weibull, and lognormal models • Examination of the human mortality bathtub curve as a template for components Section II introduces the case study modeling of failure data and is followed by analyses of: • 5 sets of ideal Weibull, lognormal, and normal failure data • 83 sets of actual (real) failure data The intent of the modeling was to find the best descriptions of the failures using statistical life models, principally the Weibull, lognormal, and normal models, for characterizing the failure probability distributions of the times-, cycles-, and miles-to-failure during laboratory or field testing. The statistical model providing the preferred characterization was determined empirically by choosing the two-parameter model that gave the best straight-line fit in the failure probability plots using a combination of visual inspection and three statistical goodness-of-fit (GoF) tests. This book offers practical insight in dealing with single item reliability and illustrates the use of reliability methods to solve industry problems.

Fundamentals of Lead-Free Solder Interconnect Technology

Author : Tae-Kyu Lee
Publisher : Springer
ISBN 13 : 1461492661
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Fundamentals of Lead-Free Solder Interconnect Technology by : Tae-Kyu Lee

Download or read book Fundamentals of Lead-Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Lead-Free Solder Interconnect Reliability

Author : Dongkai Shangguan
Publisher : ASM International
ISBN 13 : 161503093X
Total Pages : 292 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Lead-Free Solder Interconnect Reliability by : Dongkai Shangguan

Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:

A Guide to Lead-free Solders

Author : John W. Evans
Publisher : Springer Science & Business Media
ISBN 13 : 1846283108
Total Pages : 212 pages
Book Rating : 4.8/5 (462 download)

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Book Synopsis A Guide to Lead-free Solders by : John W. Evans

Download or read book A Guide to Lead-free Solders written by John W. Evans and published by Springer Science & Business Media. This book was released on 2007-01-05 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.