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Silicon Microchannel Heat Sinks
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Book Synopsis Silicon Microchannel Heat Sinks by : Lian Zhang
Download or read book Silicon Microchannel Heat Sinks written by Lian Zhang and published by Springer Science & Business Media. This book was released on 2004-01-22 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 mm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes. Scientists and engineers tackling thermal and MEMS problems will find the discussion in this book inspiring for their future design of microscale heat transfer experiments. This book will also contribute to the study of two-phase microchannel flows by providing extensive experimental data which are otherwise barely available.
Book Synopsis Silicon Microchannel Heat Sinks by : Lian Zhang
Download or read book Silicon Microchannel Heat Sinks written by Lian Zhang and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt: Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.
Book Synopsis Silicon Microchannel Heat Sinks by : Lian Zhang
Download or read book Silicon Microchannel Heat Sinks written by Lian Zhang and published by . This book was released on 2014-01-15 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Phase Change Phenomena in Silicon Microchannel Heat Sinks for IC Chip Cooling by : Lian Zhang
Download or read book Phase Change Phenomena in Silicon Microchannel Heat Sinks for IC Chip Cooling written by Lian Zhang and published by . This book was released on 2002 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Next Generation Microchannel Heat Exchangers by : Michael M. Ohadi
Download or read book Next Generation Microchannel Heat Exchangers written by Michael M. Ohadi and published by Springer Science & Business Media. This book was released on 2012-10-16 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Next Generation Microchannel Heat Exchangers, the authors’ focus on the new generation highly efficient heat exchangers and presentation of novel data and technical expertise not available in the open literature. Next generation micro channels offer record high heat transfer coefficients with pressure drops much less than conventional micro channel heat exchangers. These inherent features promise fast penetration into many mew markets, including high heat flux cooling of electronics, waste heat recovery and energy efficiency enhancement applications, alternative energy systems, as well as applications in mass exchangers and chemical reactor systems. The combination of up to the minute research findings and technical know-how make this book very timely as the search for high performance heat and mass exchangers that can cut costs in materials consumption intensifies.
Book Synopsis كتاب المختار للفتوى على مذهب الامام الاعظم by :
Download or read book كتاب المختار للفتوى على مذهب الامام الاعظم written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microchannel Heat Sink Assembly by :
Download or read book Microchannel Heat Sink Assembly written by and published by . This book was released on 1992 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated at a high pressure. The heat sink comprises a microchannel layer preferably formed of silicon, and a manifold layer preferably formed of glass. The manifold layer comprises an inlet groove and outlet groove which define an inlet manifold and an outlet manifold. The inlet manifold delivers coolant to the inlet section of the microchannels, and the outlet manifold receives coolant from the outlet section of the microchannels. In one embodiment, the manifold layer comprises an inlet hole extending through the manifold layer to the inlet manifold, and an outlet hole extending through the manifold layer to the outlet manifold. Coolant is supplied to the heat sink through a conduit assembly connected to the heat sink. A resilient seal, such as a gasket or an O-ring, is disposed between the conduit and the hole in the heat sink in order to provide a watetight seal. In other embodiments, the conduit assembly may comprise a metal tube which is connected to the heat sink by a soft solder. In still other embodiments, the heat sink may comprise inlet and outlet nipples. The present invention has application in supercomputers, integrated circuits and other electronic devices, and is suitable for cooling materials to superconducting temperatures.
Book Synopsis Optimum Design of Microchannel Heat Sinks by : Scott F. Choquette
Download or read book Optimum Design of Microchannel Heat Sinks written by Scott F. Choquette and published by . This book was released on 1997 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Two-Phase Flow Boiling and Instabilities in Silicon Microchannel Heat Sinks for Microsystems Cooling by : Dario Bogojević
Download or read book Two-Phase Flow Boiling and Instabilities in Silicon Microchannel Heat Sinks for Microsystems Cooling written by Dario Bogojević and published by . This book was released on 2009 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Flow Boiling and Two-phase Flow Instabilities in Silicon Microchannel Heat Sinks for Microsystems Cooling by : Dario Bogojević
Download or read book Flow Boiling and Two-phase Flow Instabilities in Silicon Microchannel Heat Sinks for Microsystems Cooling written by Dario Bogojević and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Simulation and Optimisation Design of Microchannel Heat Sinks by : Sh Hua Chong
Download or read book Simulation and Optimisation Design of Microchannel Heat Sinks written by Sh Hua Chong and published by . This book was released on 2001 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Mathematical Optimisation by : Fervent Ighalo
Download or read book Mathematical Optimisation written by Fervent Ighalo and published by LAP Lambert Academic Publishing. This book was released on 2011-08 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this work, a design methodology which combines CFD with a mathematical optimisation algorithm (a leapfrog optimisation program and DYNAMIC-Q algorithm) is proposed. This automated process is applied to three design cases. In the first design case, the peak wall temperature of a microchannel embedded in a highly conductive solid is minimised. The second case involves the optimisation of a double row micropin-fin heat sink. In this case, the objective is to maximise the total rate of heat transfer with the effect of the thermal conductivity also being investigated. The third case extends the micropin-fin optimisation to a heat sink with three rows. In all three cases, fixed volume constraint and manufacturing restraints are enforced to ensure industrial applicability. Lastly, the trends of the three cases are compared. It is concluded that optimal design can be achieved with a combination of CFD and mathematical optimisation.
Book Synopsis A Comparative Analysis of Innovative Microchannel Heat Sinks for Electronic Cooling by : Sainan Lu
Download or read book A Comparative Analysis of Innovative Microchannel Heat Sinks for Electronic Cooling written by Sainan Lu and published by . This book was released on 2015 with total page 25 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this work, a comparative analysis of innovative microchannel heat sinks such as two layered and multilayered microchannel heat sinks (MCHS), or thin films within flexible complex seals and cooling augmentation using microchannels with rotatable separating plates, is presented. A compilation of the numbers of layers, main characteristics, setups, advantages and disadvantages, thermal resistance, pumping power in double-layer (DL-MCHS) and multi-layer MCHS (ML-MCHS) is presented. In addition, the thermal resistance is analyzed in order to present a comparison between the single-layer MCHS (SL-MCHS) and multi-layer microchannels. The results of comparison indicates that double-layer and multi-layer MCHS have lower thermal resistance and require smaller pumping power and they resolve the high streamwise temperature rise problem of SL-MCHS.
Book Synopsis Analysis and Computation of Conjugate Heat Transfer in Trapezoidal Microchannel Heat Sinks in a Silicon Substrate by : Jose Raul Rujano Maldonado
Download or read book Analysis and Computation of Conjugate Heat Transfer in Trapezoidal Microchannel Heat Sinks in a Silicon Substrate written by Jose Raul Rujano Maldonado and published by . This book was released on 1995 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Laminar Microchannel Cooling of Integrated Circuits by : Jeffrey Jay Lienau
Download or read book Laminar Microchannel Cooling of Integrated Circuits written by Jeffrey Jay Lienau and published by . This book was released on 1990 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt: Liquid cooled, laminar microchannel heat sinks were earlier proposed by Tuckerman for cooling high heat generating integrated circuits and high power microwave generation systems using photoconductive switches. A method of computationally analyzing the heat sinks is presented which produces the desired temperature and velocity distributions within the heat sinks. The problem was solved in two different ways. First, computational techniques were developed to investigate the problem assuming fully developed temperature and velocity profiles. Second, the hydro-thermal code TEMPEST was used to solve the developing problem. A comparison was made between the results of this study and Landrum's integral analysis. Other analytical comparisons were made. A parametric study was performed which considers the effect of geometric parameters on the solution. From this parametric study, trends were observed which allowed optimization of the geometric parameters of the design. The optimization involved a specified pressure drop across the heat sink. The optimized design was one which had the lowest peak silicon temperature with a given pressure drop across the heat sink. For every given pressure drop across the heat sink, there was an optimal design. Optimized heat transfer performance characterized by nondimensional peak silicon temperature may be related to the pressure drop across the heat sink so the cooling effect can be compared to its cost in terms of pumping power. An evaluation of the fully developed momentum and energy assumptions was presented. The developing solution was solved for cases both near the optimized design and for cases which deviated substantially from the optimized design. The fully developed momentum assumption provided accurate velocity profiles in all cases considered. The hydrodynamic entry length can be neglected in most cases. The accuracy of the fully developed energy assumption varied considerably with geometric parameters. The fully developed energy solution did not accurately represent the developing solution for microchannels with small fin width to channel width ratios and large channel aspect ratios. For microchannels with large fin width to channel width ratios and small channel aspect ratios, the fully developed solution accurately represented the developing solution. The fully developed assumption provided accurate temperature profiles in cases at or near the optimum design as determined by the methods in this report. The effects of variable fluid specific heat and thermal conductivity were considered by comparing the temperature and velocity profiles to constant property cases. The assumption of constant fluid properties provided a conservative estimate of the peak silicon temperature. This suggested using the constant property assumption in order to provide a margin of safety and to simplify the computation.
Book Synopsis Thermal Stresses in the Microchannel Heatsink Cooled by Liquid Nitrogen by :
Download or read book Thermal Stresses in the Microchannel Heatsink Cooled by Liquid Nitrogen written by and published by . This book was released on 1993 with total page 17 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microchannel heatsinks represent a highly efficient and compact method for heat removal in high heat flux components. Excellent thermal performance of a silicon microchannel heatsink has been demonstrated using liquid nitrogen as the coolant. For the heating of a 1 square centimeter area, at a heat dissipation of 500 W, a typical silicon heatsink cooled by liquid nitrogen has a thermal resistance of 0.046 cm2°K/W. The actual heatsink structure in this case is only 0.1 cm high. Silicon, although it has excellent thermal properties at liquid nitrogen temperatures, may fracture with very little plastic deformation due to mechanical and thermal stresses. Because the fracture strength of silicon depends on the presence of small defects, strength of the heatsink structures must be addressed to insure highly reliable heatsink devices. Microchannel heatsink reliability can be affected by thermal stresses that arise due to temperature gradients between the base and fin and along the film length. These stresses are combined with the bonding stresses that arise in attaching components at elevated temperatures to the silicon heatsink and then cooling the structure to the cryogenic operating temperatures. These bonding stresses are potentially large because of the differences in the values of the coefficients of thermal expansion in silicon heatsink material, and the attached component materials. The stress results are shown for a 17:1 aspect ratio heatsink cooled in liquid nitrogen. The temperature gradients are a result of a surface heat flux of 1.3 kW/cm2, approximating the heat dissipation of an RF power chip. The chip is connected to an aluminum nitride substrate, then the chip and substrate module are attached to the heatsink at a bonding temperature of 600°K, as for a gold tin eutectic bond. The stresses are shown to be within the allowables of the materials involved.
Book Synopsis Experimental Study of Micro Pin-fin Heat Sinks and Supercritical Carbon Dioxide Microchannel Heat Exchanger by : Cameron J. Naderi
Download or read book Experimental Study of Micro Pin-fin Heat Sinks and Supercritical Carbon Dioxide Microchannel Heat Exchanger written by Cameron J. Naderi and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Microchannels in the application of heat sinks and heat exchangers play an important role in the field of heat transfer as the ever-increasing need for smaller components becomes apparent. Microchannels, although demanding larger pumping power in the systems they are integrated in, provide the superseding benefit of efficient heat transfer in a smaller and more cost-effective product when compared to larger scale heat exchange devices. This thesis focused on two areas relating to the study of microchannels. The first explored the performance of micro pin-fin heat sinks in quantitative studies of both the heat transfer and pressure drop of varying pin aspect and pitch ratios. Additionally, the study attempted to discover the effect of vortex shedding that occurs within the pin arrays of certain heat sinks and the geometric parameters that allow or prohibit its onset. The study found there to be a set of criteria for pin aspect and pitch ratios that would allow for vortex shedding, a flow feature that results in better heat transfer and lower pressure drop across the heat sink. The second topic examined in this thesis was the use of microchannels in a recuperator heat exchanger used in a supercritical carbon dioxide power generation cycle. A unit cell design of a heat exchanger was designed and tested for its heat transfer and pressure drop performance in order to provide results that would aid in designing a scaled-up version that would meet real-world demands. A viable design was created that could withstand conditions up to 90 ̊C and 120bar while also performing at 95% effectiveness.
